• Proceedings of the Korean Nuclear Society Conference
• /
• 1996.05c
• /
• pp.277-283
• /
• 1996

최종 pilgering 단계에서의 가공량이 서로 다른 Zircaloy-4 피복관을 대상으로 350-50$0^{\circ}C$, 원주응력 80-150 N/$\textrm{mm}^2$의 이축응력 조건에서 크립시험이 수행되었다. Zircaloy-4 피복관의 크립변형률 및 크립변형량은 최종 pilgering 단계에서의 가공량에 비례하여 커졌다. 이를 토대로 크립모델 제시되었으며 제시된 모델은 Zircaloy-4 피복관의 크립거동을 매우 잘 모사하였다. Zircaloy-4 피복관의 크립활성화 에너지는 $\alpha$-zirconium에서의 자기확산의 활성화에너지 값과 거의 동일한 60 Lcal/mole 이므로, 크립지배기구는 전위상승이다. 따라서 가공량에 따라 크립변형률 및 크립변형률의 증대는 가공량에 따른 기지상내의 점결함의 증가 때문으로 사료된다.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.13 no.6
• /
• pp.1193-1202
• /
• 1989

본 논문에서는 발전소의 소재로 많이 쓰이고 있는 304 스테인리스강(앞으로는 304SS로 표기함)과 316스테인리스강(앞으로는 316SS로 표기함)의 크립 균열 발생 거동 을 각각 600.deg. C와 625.deg. C에서 조사한다. 이 온도는 발전소의 반응기(reactor)에 사용 되는 304SS와 316SS이 받는 온도이다. 즉 304SS와 316SS의 크립 균열 발생을 지배 하는 파괴 매개변수가 무엇인지가 크립 파괴 실험을 통하여 조사된다. 실험 결과는 이미 제안되어 있는 크립 균열 발생 모델에서 예측된 결과와 비교된다. 특히 304SS 와 316SS은 고온에서의 연성도가 변형률 속도에 따라 변하는 것으로 알려져 있다. 본 연구에서는 '변형률 속도에 따른 재료의 연성도의 변화에 근거한 균열 발생 모델' 을 제안하고, 그 모델에서 예측된 크립 발생 거동을 실험 결과와 비교한다.

• Journal of the Microelectronics and Packaging Society
• /
• v.17 no.2
• /
• pp.21-28
• /
• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.

• Tunnel and Underground Space
• /
• v.14 no.1
• /
• pp.69-77
• /
• 2004

Investigation of the time-dependent behavior of rock and the associated mechanisms are of key interest in long-term stability analysis of many engineering applications. In this study, creep tests were performed on Daejeon granite samples of 25.4mm diameter under uniaxial compression at varying stress levels. The effect of moisture was investigated by testing both air-dried and fully water-saturated samples. The creep behavior of Daejeon granite exhibited three distinctive stages of primary, secondary and tertiary creep. The ultimate strength of granite under a constant stress decreased considerably with time. Saturation and immersion of the test specimen in water markedly increased the total creep strain as well as the secondary creep rate. The experimental creep curves are fitted to Burger's model as well as two other empirical models suggested by previous researchers. A number of the parameters determined for each model are dependent on stress and influenced by the presence of water. Based on the experimental results, an empirical relation between the applied stress and the time-dependent strain is established separately for each air-dried and fully water-saturated Daejeon granite.

• Journal of the Computational Structural Engineering Institute of Korea
• /
• v.17 no.4
• /
• pp.413-421
• /
• 2004

In this paper, a structural analysis for the pressurized water reactor(PWR) spent nuclear fuel disposal canister which is deposited under the 500m deep underground is carried out to predict the creep deformation of the canister while the underground water and swelling bentonite pressure are applied on the canister. Usually the creep deformation may be caused due to the Pressure and the high heat applied to the canister even though additional external loads are not applied to the canister. These creep deformations depend on the time. In this paper, oかy the underground water and bentonite swelling Pressure are considered for the creep deformation analysis of the canister, because the heat distribution inside canister due the spent fuel is not simple and depends on time. A proper creep function is adopted for the creep analysis. The creep analysis is carried out during $10^8$ seconds. The creep analysis results show that the creep strains are very small and these strains occur usually in the lid and bottom of the canister not in the cast iron insert. A much smaller strain is found in the cast iron insert. Hence, the creep deformation doesn't affect the structural safety of the canister, and also the creep stress which shows the stress relaxation phenomenon doesn't affect the structural safety of the canister.

• 한국지구물리탐사학회:학술대회논문집
• /
• 2006.06a
• /
• pp.195-200
• /
• 2006

Laboratory creep experiments show that compaction of unconsolidated shale is an irrecoverable process caused by viscous time-dependent deformation. Using Perzyna's viscoplasticity framework combined with the modified Cam-clay theory, we found the constitutive equation expressed in the form of strain rate as a power law function of the ratio between the sizes of dynamic and static yield surfaces. We derived the volumetric creep strain at a constant hydrostatic pressure level as a logarithmic function of time, which is in good agreement with experimental results. The determined material constants indicate that the yield stress of the shale increases by 6% as strain rate rises by an order of magnitude. This demonstrates that the laboratory-based prediction of yield stress (and porosity) may result in a significant error in estimating the properties in situ.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.21 no.12
• /
• pp.2165-2171
• /
• 1997

The analysis model is the infinite power law creep material containing the rigid inclusion with crack shape. The present analysis is performed using the complex pseudo-stress function method. The strain rate intensity factor is developed as new fracture mechanics parameter which represents the stress and strain rate distribution near a crack tip in power law creep material. The strain rate intensity factor is developed in terms of Kolosoff stress functions.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.34 no.1
• /
• pp.61-65
• /
• 2010

A commercially available soft PZT wafer that is poled in thickness direction is subjected to longitudinal tensile stress loading in both short and open-circuit conditions. Variations of electric displacement in thickness direction and in-plane strains are measured over time during the loading. Different material responses in the two electrical boundary conditions are explained by the effects of piezoelectrically produced internal electric field on linear material moduli and domain switching mechanisms. Finally, a free energy model of normal distribution is introduced to explain the observed creep behavior, and its predictions are compared with experimental observations.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.9
• /
• pp.2205-2213
• /
• 1993

The characteristic test for gage factors of temperature self-compensated strain gages at cryogenic temperature is presented. By joining the international round robin test on electrical strain gages at cryogenic temperatures, the gage factors of three kinds of widely-used strain gages are obtained at the room temperature, the temperatures of liquid nitrogen and liquid helium. The calibration system which produce precise bending strain is by mechanical loading at cryogenic temperature. This paper also presents the creep characteristic of strain gages at maximum strain level.

• Journal of Welding and Joining
• /
• v.16 no.4
• /
• pp.92-97
• /
• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.