• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.1
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• pp.672-679
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• 2018

This paper describes a methodology for shape design using an optimal design system, whereas generally a three dimensional analysis is required for such designs. An automatic finite element mesh generation technique, which is based on fuzzy knowledge processing and computational geometry techniques, is incorporated into the system, together with a commercial FE analysis code and a commercial solid modeler. Also, with the aid of multilayer neural networks, the present system allows us to automatically obtain a design window, in which a number of satisfactory design solutions exist in a multi-dimensional design parameter space. The developed optimal design system is successfully applied to evaluate the structures that are used. This study used a stress gauge to measure the maximum stress affecting the parts of the side housing bracket which are most vulnerable to cracking. Thereafter, we used a tool to interpret the maximum stress value, while maintaining the same stress as that exerted on the spot. Furthermore, a stress analysis was performed with the typical shape maintained intact, SM490 used for the material and the minimizing weight safety coefficient set to 3, while keeping the maximum stress the same as or smaller than the allowable stress. In this paper, a side housing bracket with a comparably simple structure for 36 tons was optimized, however if the method developed in this study were applied to side housing brackets of different classes (tons), their quality would be greatly improved.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.3
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• pp.578-584
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• 2017

$SiO_2$ buffer layer (100 nm) has been deposited on PET substrate by electron beam evaporation. And then, IZTO (In-Zn-Sn-O) thin film has been deposited on $SiO_2$/PET substrate with different RF power of 30 to 60 W, working pressure, 1 to 7 mTorr, by RF magnetron sputtering. Structural, electrical and optical properties of IZTO thin film have been analyzed with various RF powers and working pressures. IZTO thin film deposited on the process condition of 50 W and 3 mTorr exhibited the best characteristics, where figure of merit was $4.53{\times}10^{-3}{\Omega}^{-1}$, resistivity, $4.42{\times}10^{-4}{\Omega}-cm$, sheet resistance, $27.63{\Omega}/sq.$, average transmittance (400-800 nm), 81.24%. As a result of AFM, all the IZTO thin film has no defects such as pinhole and crack, and RMS surface roughness was 1.147 nm. Due to these characteristics, IZTO thin film deposited on $SiO_2$/PET structure was found to be a very compatible material that can be applied to the next generation flexible display device.

• Journal of Korean Society of Steel Construction
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• v.15 no.4 s.65
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• pp.423-433
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• 2003

Many study have been performed to describe the elastic and inelastic behavior of H-shaped beams with web openings that generally concentrated on the monotonic loading condition and concentric web opening. The findings of the studies led Darwin to propose formulas for the design of beams with web openings considering local buckling. While the formulas are simple and useful in real situation, more studies arc needed on their cyclic loading condition. In this experimental study, 12 H-shaped beams with web openings under cyclic loading condition were investigated. The dimension criteria based on the formulas proposed by Darwin were examined. The suitability of existing design formulas and the effects of plastic hinges on beams with web openings and of local buckling around web openings on the beam strength under cyclic loading were also studied. This was done by observing their behavior with various dimensional openings, eccentric per cent, and stiffeners.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.10
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• pp.7071-7077
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• 2015

In recently, the demand of cover-glass is increased because smart phone, tablet pc, and electrical device has become widely used. The display of mobile device is enlarged, so it is necessary to have a high strength against the external force such as contact or falling. In fabrication process of cover-glass, a grinding process is very important process to obtain high strength of glass. Conventional grinding process using a grinding wheel is caused such as a scratch, chipping, notch, and micro-crack on a surface. In this paper, polishing system using a abrasive film was developed for a grinding of mobile cover-glass. To evaluate structural stability of the designed system, finite element model of the polishing system is generated, and multi-body dynamic analysis of abrasive film polishing machine is proposed. As a result of the analysis, stress and displacement analysis of abrasive film polishing system are performed, and using laser displacement sensor, structural stability of abrasive film polishing system is confirmed by measuring displacement.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.21 no.1
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• pp.35-42
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• 2008

In the nuclear power plant, early detection of fatigue crack by non-destructive test (NDT) equipment due to the thermal cyclic load is very important in terms of strict safety regulation. To this end, many efforts are exerted to the fabrication of artificial cracked specimen for practicing engineers in the NDT company. The crack of this kind, however, cannot be made by conventional machining, but should be made under thermal cyclic load that is close to the in-situ condition, which takes tremendous time due to the repetition. In this study, thermal loading condition is investigated to minimize the time for fabricating the cracked specimen using simulation technique which predicts the crack initiation and propagation behavior. Simulation and experiment are conducted under an initial assumed condition for validation purpose. A number of simulations are conducted next under a variety of heating and cooling conditions, from which the best solution to achieve minimum time for crack with wanted size is found. In the simulation, general purpose software ANSYS is used for the stress analysis, MATLAB is used to compute crack initiation life, and ZENCRACK, which is special purpose software for crack growth prediction, is used to compute crack propagation life. As a result of the study, the time for the crack to reach the size of 1mm is predicted from the 418 hours at the initial condition to the 319 hours at the optimum condition, which is about 24% reduction.

• Composites Research
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• v.34 no.5
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• pp.317-322
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• 2021

When a complex load such as torsion, low-speed impact, or fatigue load is applied, the properties in the thickness direction are weakened through microcracks inside the material due to the nature of the laminated composite material, and delamination occurs. To prevent the interlaminar delamination, various three-dimensional reinforcement methods such as Z-pinning and stitching, and structural health monitoring techniques that detect the microcrack of structures in real time have been continuously studied. In this paper, the single-lap joints with I-fiber stitching process were manufactured by a co-curing method and their strengths and failure detection capability were evaluated. AE and electric resistance method were used for detection of crack and failure signal and electric circuit for signal analysis was manufactured, and failure signal was analyzed during the tensile test of a single-lap joint. From the experiment, the strength of the single lap joint reinforced by I-fiber stitching process was improved by about 44.6% compared to the co-cured single lap joint without reinforcement. In addition, as the single-lap joint reinforced by I-fiber stitching process can detect failure in both the electrical resistance method and the AE method, it has been proven to be an effective structure for failure monitoring as well as strength improvement.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.1
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• pp.55-65
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• 2020

The use of underfill materials in semiconductor packages is not only important for stress relieving of the package, but also for improving the reliability of the package during shock and vibration. However, in recent years, as the size of the package becomes larger and very thin, the use of the underfill shows adverse effects and rather deteriorates the reliability of the package. To resolve these issues, we developed the package using a solid epoxy material to improve the reliability of the package as a substitute for underfill material. The developed solid epoxy was applied to the package of the application processor in smart phone, and the reliability of the package was evaluated using thermal cycling reliability tests and numerical analysis. In order to find the optimal solid epoxy material and process conditions for improving the reliability, the effects of various factors on the reliability, such as the application number of solid epoxy, type of PCB pad, and different solid epoxy materials, were investigated. The reliability test results indicated that the package with solid epoxy exhibited higher reliability than that without solid epoxy. The application of solid epoxy at six locations showed higher reliability than that of solid epoxy at four locations indicating that the solid epoxy plays a role in relieving stress of the package, thereby improving the reliability of the package. For the different types of PCB pad, NSMD (non-solder mask defined) pad showed higher reliability than the SMD (solder mask defined) pad. This is because the application of the NSMD pad is more advantageous in terms of thermomechanical stress reliability because the solderpad bond area is larger. In addition, for the different solid epoxy materials with different thermal expansion coefficients, the reliability was more improved when solid epoxy having lower thermal expansion coefficient was used.

• Applied Chemistry for Engineering
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• v.32 no.3
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• pp.268-276
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• 2021

As wireless communication devices become more common, interests in how to control the electromagnetic waves generated from the devices are increasing. One of the most commonly used electromagnetic wave control materials is magnetic one, but due to the features that make the product heavy and thick when applied to the product, it is difficult to use them in curved electronic devices. Therefore, a polymer flexible meta electronic device has been presented to sort out the problem, which is thin and can have various curvatures. However, it requires an additional evaluation of curvature reliability. In this study, we developed a method to predict electromagnetic wave control characteristics through the resistance/length of the conductive ink line patterns of polymer flexible meta electronic devices, which is inversely proportional to the electromagnetic wave control characteristics. As the radius of curvature decreased, the resistance/length increased, and there was little variations with the duration times of curvature. We also found that both permanent and recoverable changes along with the removal of curvature were occurred when the curvature was applied, and that the cause of these changes was newly created vertical cracks in the conductive ink line pattern due to the tensile stress applied by applying curvature.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.3
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• pp.63-71
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• 2022

In this study, the interfacial reaction and drop impact reliability of Sn-Ag-Cu (SAC) solder and electroless nickel autocatalytic gold (ENAG) were studied. In addition, the solder joint properties with the ENAG surface finish was compared with electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG). The IMC thickness of SAC/ENAG and SAC/ENEPIG were 1.15 and 1.12 ㎛, respectively, which were similar each other. The IMC thickness of the SAC/ENIG was 2.99 ㎛, which was about two times higher than that of SAC/ENAG. Moreover, it was found that the IMC thickness of the solder joint was affected by the metal turnover (MTO) condition of the electroless Ni(P) plating solution, and it was found that the IMC thickness increased when the MTO increased from 0 to 3. The shear strength of SAC/ENEPIG was the highest, followed by SAC/ENAG and SAC/ENIG. It was found that when the MTO increased, the shear strength was lowered. In terms of brittle fracture, SAC/ENEPIG was the lowest among the three joints, followed by SAC/ENAG and SAC/ENIG. Likewise, it was found that as MTO increased, brittle fracture increased. In the drop impact test, it was confirmed that the 0 MTO condition had a higher average number of failures than the 3 MTO condition, and the average number of failures was also higher in the order of SAC/ENEIG, SAC/ENAG, and SAC/ENIG. As a result of observing the fracture surface after the drop impact, it was found that the fracture was between the IMC and the Ni(P) layer.