• Proceedings of the KSME Conference
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• 2001.06d
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• pp.396-401
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• 2001

Heat transfer analysis of a iron core type linear motor for surface mounting device applications was considered in this study. In order to avoid the complex conjugate problem a fluid flow regime and a solid regime were considered separately. First, film coefficients of the moving parts were evaluated from computational fluid dynamic analysis and those of the stationary parts from the existing empirical or analytic correlations. And then, by applying them, internal and external temperatures of the linear motor pal1s were computed through finite element analysis. Both computation and measurement were carried out with respect to motor driving power. The measurement did not exhibit a linear temperature variation trend with respect to motor power while the computation revealed a linear correlation. Nonetheless, the computations agreed with the measurements within an error range of 20%. It indicates that an adequate heat transfer model for the reciprocative coil assembly may help more exact prediction.

• Proceedings of the KIPE Conference
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• 2008.10a
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• pp.181-183
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• 2008

반도체 칩 마운터는 PCB기판위에 칩을 마운팅 하는 장비로 짭은 시간내에 많은 양의 칩을 정확하게 마운팅 하기 위해 매우 빠른 가감속 운전과 정밀한 작업을 수행할 수 있는 선형전동기를 사용해 오고 있다. 고가임에도 빠른 응답특성, 높은 정밀도, 유지보수의 최소화 등 선형전동기가 가지고 있는 여러 가지 장점으로 인해 반도체를 포함한 LCD 및 기타 일반 산업에 까지 점진적으로 수요가 증가하고 있지만, 이동자에 전기자 권선을 가지고 있어 장거리 이송용으로 적합한 선형전동기의 경우 전원 케이블을 반복적으로 끌고 다녀야 하는 단점이 있어, 이런 문제점을 극복하기 위한 비접촉 방식의 전원 공급에 대해 많은 연구가 진행되고 있는 실정이다. 따라서 본 연구에서는 직병렬 공진 원리를 이용하여 움직이는 이동자의 전기자 권선에 비접촉으로 전원을 공급하는 전원 장치를 제안하며, LCD 자동 반송 장비인 스토커에 적용하여 특성을 분석하였다.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2002.05a
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• pp.1039-1042
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• 2002

SMD(Surface Mounting Device) which mounts electronic components as IC-Chips on PCB automatically, produces a large dynamic force and vibration. The unwanted vibrations in SMD degrade the performance of the precision device and it is the major obstacle to limit its speed for mounting. This study investigated the vibration analysis of a typical SMD to predict the natural frequencies and mode shapes. To validate the finite element analysis of SMD, the FE result was compared with that of ODS measurements. It was shown that the predicted results were well correlated with the experimental modal parameters.

• Proceedings of the KIEE Conference
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• 2003.07d
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• pp.2450-2452
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• 2003

We present a method to increase the productivity of multihead-gantry chip mounters for PCB assembly lines. To minimize the assembly time, we generate the mount sequence using the genetic algorithm. The chromosome, fitness function, and operators are newly defined to apply the algorithm. Simulation results are presented to verified the usefulness of the method.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.5 s.182
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• pp.155-161
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• 2006

This paper introduces a new type of mechanical tape feeder for chip mounter. The mechanical feeder is composed of a pneumatic linear actuator and a linear feeding module with the application of a cam-slider. As semiconductor chips are getting smaller, PCB assembly makers require the feeder to position the chip with high accuracy. The linear feeding system improves the positioning accuracy of the chip by getting rid of the index error, which brings into existence on the sprocket rotating feeder. It also can make greatly reduce the dumping rate. The dumping error is caused by the impact occurred as the pawl to interrupt ratchet wheel rotation. The paper discusses its mechanism and mechanical performance. The positioning accuracy and the dynamic characteristic were measured for long time operation and analyzed. As a result, the feeder showed very good performance. However, the feeding system was dynamically unstable due to the cover film eliminator that is required to be modified

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.2
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• pp.1398-1402
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• 2015

In surface mount technology, the use of technology implemented using a Chip Mounter relay that is inserted into the junction box, etc. car is increasing. On the other hand, there is a need for technology to reduce the weight of the heavy component of the relay attached to different Stick Tube generally chips. Therefore, rather than existing technology, this study improved the algorithm of the system to provide a mechanical structure using Air to supply greater stability using this the component feeder utilizing the Stick Tube proposed technology. When the equipment installed in the Air Stick Feeder was used, the effectiveness, such as increased production and reduced disposal expense, was improved.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.48-51
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• 1997

This paper presents the algorithm of FIC inspection in chip mounter. When device is mounted on the PCB, it is impossible to get zero defects since there are many problems which can not be predicted. Of these problems, devices with bent corner leads due to mis-handling and which are not placed at a given point measured along the axis are principal problem in SMT(Surface Mounting Technology). In this paper, we proposed a new algorithm based on the Radon transform which uses a projection to inspect the FIC(Flat Integrated Circuit) device and compared this method with other algorithms. We measured the position error and applied this algorithm to our image processing board which is characterized by line scan camera. We compared speed and accuracy in our board.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.3
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• pp.2146-2150
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• 2015

The surface mount technology is used, as mounting relay using Chip Mounter that is inserted into the junction box, etc. car and small components such as 0402 and 0603 Chip. In this study we developed stick tube for supplying the relay that cause problems as components is heavy and suggested the technology using fiber sensors to eliminate missing insertions or improper insertions because of small components. And we show to result of the experiment how to increased the productivity.

• Journal of the Semiconductor & Display Technology
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• v.12 no.1
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• pp.53-59
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• 2013

Chip mounter which is used to pick chips from the pre-specified position and place them on the target location of PCB is an essential device in semiconductor and LCD industries. Quick and high precision positioning is the key technology needed to increase productivity of chip mounters. As increasing acceleration and deceleration of placing motion, structural vibration induced from inertial reactive force and flexibility of mounter structure becomes a serious problem degrading positioning accuracy. Motivated from these, this paper proposed a new control design algorithm which combines a mounter structure acceleration feedforward compensation and an extended sliding mode control for fine positioning and suppression of structural vibration, simultaneously. The feasibility of the proposed control design was verified along with some simulation results.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.471-474
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• 2001

Recently, due to demands of faster speed and extra features for the chip mounters, there has been ever-demanding needs for the basic technology. Until four or five years ago, chip mounters placing 0.3sec/chip were considered to be in the high speed category, but since then it has become a borderline for categorizing high speed machines capable of placing 0.1sec/chip. In this study, in order to analyze the vibration of head generated by the dynamic behavior of x-frame, FEM model is composed and modal analysis is performed to identify the dynamic characteristics of the structure. Those results are compared with the modal test in order to verify the model. In this paper, Several other factors, such as definition of dynamic accuracy, static accuracy and tolerance of the axis settling range, that might affect the dynamic behavior the head are discussed.