• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.1
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• pp.139-144
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• 1991

Chip flow angle is one of the important factors to be determined for the scheme of Chip Control. Up to now, however, a dependable way to predict the chip flow angle in practical cutting has not been established satisfactorily. In this paper a rather simple theoretical prediction of chip flow angle is tried based on some already widely confirmed hypotheses. The developed equation of chip flow angle contains the parameters of depth of cut d, feed rate f, nose radius $r_{n}$ side cutting edge angle $C_{s}$, side rake angle .alpha.$_{s}$ and back rake angle .alpha.$_{b}$. Theoretical results of chip flow angle given by this study bas been shown in a good agreement with experimental ones.s.s.s.s.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.6
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• pp.190-196
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• 1999

In this study, a procedure for analyzing chip-tool friction and shear processes in 3-D cutting with a single point tool has been established. The edge of a single point tool including circular nose is modified to the equivalent straight edge, then 3-D cutting with a single point tool is reduced to equivalent oblique cutting. Transforming the conventional coordinate systems and using the measured three component of cutting forces, force components on the rake face and the shear plane of the equivalent oblique cutting system can be obtained. And it can be possible to assess the chip-tool friction and shear characteristics in 3-D cutting with a single point tool.

• Journal of Wetlands Research
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• v.20 no.2
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• pp.145-154
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• 2018

In this study, three pilot-scale wetland systems were built for treating stormwater runoff from asphalt road. Each of the system consists of a settling tank and a vertical flow wetland packed with 25%, 50%, and 75% woodchip as treatment media. According to the analysis of the distributions of particle size, it was found that solids ranging in size $0.52-30{\mu}m$ were predominant in the stormwater runoff. After 24-hours settling, those coarser than $20{\mu}m$ were significantly detained. Further retention, especially for the finer-sized fraction, occurred in the wetland through internal recirculation during the dry day periods. As a primary media of the wetland, woodchip showed a high filtration and attachment capacity for the particulates in pre-settled stormwater, whereas overall amount of solids in the wetland effluent increased due to the detachment of woody elements from the media. This was observed mainly during the initial 75 days of operation, and the size and detachment rate were found to be strongly related with the woodchip packing ratio. The mechanism involving woody particle detachment was modeled as a first-order form. In addition, water quality factors and operational parameters affecting the detachment were analyzed and discussed.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.33 no.6B
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• pp.456-468
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• 2008

In this paper, we design Input/Output modules as a preference work for implementation of hybrid two stage AWG based WDM-PON and verify operations of each function modules through the logic simulation. This WDM-PON system provides service to 128 ONUs through 32 wavelength and one wavelength is shared for upstream transmission with four ONU while each wavelength is allocated to each ONU for downstream transmission. The designed WDM-PON MAC chip is based on sub-MAC which consists of one control unit and reception unit and four transmission unit. To design the reception and transmission unit of sub-MAC, we define the functions of the sub-MAC, pins of the modules, control signal and timing of each signal. We intend to design MAC chip with 1Gbps transmission rate. Thus the designed MAC chip is worked on 125MHz clock rate. We define FSM and design Input/Output modules with VHDL. The logic simulation of the modules is executed by the ModelSIM simulator.

• Journal of the Korea Society of Computer and Information
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• v.6 no.4
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• pp.12-20
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• 2001

The problem of software bottle-neck may be arised from unbalance of demands and supply of software. This is caused from the fact that the capability of programmer could not be improved in software development. Therefor, the new method of software development should aim at improving the productivity of software. This paper presents the expressions to be the standardized software Program modules by means of the software chip. The expressions are consist of name, input, output, and iteration of each software chip. And they simple express a combination and separation in sequence, parallel, iteration, composition, mixing, and variety form. Therefore they can easily software reuse as a result of analyzing the flow of data clearly.

• Journal of Wetlands Research
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• v.20 no.1
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• pp.63-71
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• 2018

The particle filtration mechanisms in an infiltration trench should be varying due to the different hydraulic conditions during stormwater runoff. The understanding of these variations associated with different filtration mechanisms and their effect on the particle removal efficiency is of vital importance. Therefore, a LID (Low Impact Development) system comprising of an infiltration trench packed with gravel and woodchip was investigated during the monitoring of several independent rainfall events. A typical rainfall event was divided into separate regimes and their corresponding flow conditions as well as filtration mechanisms in the trench were analyzed. According to hydraulic conditions, it was found out that filtration changes between vertical and horizontal flows as well as between unsaturated, saturated, and partially-saturated flows. Particle separation efficiency was high (55-76%) and was mainly governed by physical straining during the unsaturated period. It was then enhanced by diffusion during the saturated period (75-95%). When the trench became partially saturated at the end of the rainfall event, the efficiency decreased which was believed to be due to the existence of a negatively charged air-water interface which limited the removal to positively charged particles.

• Proceedings of the IEEK Conference
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• 1998.06a
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• pp.791-794
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• 1998

칩의 집적도에 비레한 테스트 문제의 원초적인 해결은 VHDL등으로 기술되는 상위기능 수준에서부터 고려되어야 한다. 본 논문에서는 상위수준의 기능정보에서 테스트점을 삽입 제어흐름(control flow)를 변경하여 고집적 회로의 고장점검도를 증진시키는 기술을 소개한다. while 푸프와 if-then-else 제어문에 AND 및 OR 타입 등의 테스점을 삽입하여 내부 신호의 조정도를 최적화시킨다. 랜덤패턴 시뮬레이션을 벤치마크 회로에 적용 각 변수의 조정도를 산출하여 테스트점의 종류 및 삽입할 위치를 결정하였다. 본 연구에서 제안하는 상대적 랜덤도에 의하여 VHDL 코드에 단일 테스트점을 삽입 합성한 결과 게이트 수준회로에 대한 고장점검도가 최대 30% 까지 증진됨을 알 수 있었다.

• Proceedings of the KIEE Conference
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• 1999.07b
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• pp.945-947
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• 1999

첨단의 자동화 시스템을 구축하기 위해서는 각 필드기기에서 생산되는 정보들을 적절한 형태로 가공하여 적시에 필요한 공정으로 제공하여 줄 수 있는 지능형 센서 및 필드기기의 도입이 필요하다. 이러한 필드기기들이 유기적으로 정보를 교환하고 공유하기 위해서는 통신망 시스템을 구축할 필요가 있다. 필드버스는 자동화 및 분산 제어 시스템의 컴퓨터 통신망 계층구조에서 최하위 계층 기기들 간에 실시간 통신을 제공하는 산업용 통신망이다. 본 연구에서는 통신용 프로세서인 Mc68360을 기반으로 하여 필드버스의 일종인 Profibus의 물리계층과 데이터링크계층 프로토콜을 구현하였다. 물리계층은 프로세서의 UART 통신 기능과 RS-485칩을 사용하여 구현하고, 데이터링크계층 프로토콜은 프레임 분석과 송수신, 에러처리, 흐름제어, 매체접속권한 관리 등의 기능을 소프트웨어로 구현하였다. 또한 지능형 센서 본래의 목적중의 하나인 원격관리 기능을 위하여 각 필드기기의 노드 주소, 타이머 값 등의 통신 파라미터를 원격 마스터에서 설정할 수 있도록 관리계층의 기능을 추가하였다. 본 연구에서는 각각 하나의 노드기능을 담당하는 여러 개의 보드들로 구성된 testbed를 구축하고, 다양한 통신환경에서 초기화, 정상, 비정상 상태 등의 동작을 실험하였으며, 이를 통하여 지능형 센서용 필드버스의 데이터링크계층 프로토콜이 정상적으로 동작됨을 확인하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.480-481
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• 2012

LED (Light Emitting Diode)는 친환경적이며 고수명 등의 여러 장점을 가지고 있어서 액정디스플레이의 광원으로 널리 사용되고 있다. 그러나 LED 제품을 제조하기 위해서는 칩, 패키지, 모듈, 시스템으로 구성된 4단계의 복잡한 제조공정을 거쳐야 하므로 가격이 높은 단점이 있다. 이를 개선하기 위해서 패키지, 모듈, 시스템의 3단계의 공정을 하나로 통합한 hybrid LED package(HLP) 개념이 제시되었다. HLP는 LED chip을 PCB에 직접 실장한 뒤 초정밀 가공 및 성형 기술을 활용하여 일체형 광학패턴을 인가함으로써 공정을 단순화하면서도 광효율을 향상시킬 수 있다. 이에 본 연구에서는 다구찌 실험계획법을 사용하여 디스플레이에서 중요시되는 휘도를 높일 수 있는 일체형광학패턴 형상 최적화를 실시하였으며, 최적화된 일체형 광학패턴을 제조하기 위한 초정밀 가공 및 성형기술을 개발하였다. 최적화 결과 높이 25um, 꼭지각 90도의 음각형태의 사각피라미드 패턴이 최적형상으로 결정되었으며, 패턴이 없을 때와 비교하여 휘도가 약 32.3% 높아지는 것으로 나타났다. 이러한 일체형 광학패턴을 제품으로 구현하기 위하여 초정밀 절삭기술을 활용하여 마스터 금형을 제작하였다. 최종적으로 사출성형을 통해 일체형 광학패턴을 제작하게 되는데 이때 사출기 내부 공기흐름 및 진공도를 최적화함으로써 패턴 내부에 불필요한 기포가 발생하지 않도록 하는데 성공하였다. 이를 통해 생산성이 높은 사출성형으로 HLP 제품을 양산할 수 있는 가능성을 확인하였고, 추후에는 실제 제품을 제작하는 연구를 수행할 예정이다.