• Applied Chemistry for Engineering
• /
• v.10 no.4
• /
• pp.615-619
• /
• 1999

Polyether-clay nanocomposite was not polymerized with stearyltrimethylammonium ion exchanged montmorillonite, but it was self-polymerizable when heated with both stearyltrimethylammpmoim and m-phenylenediammonium ions intercalated montmorillonite to form polyether-clay nanocomposites. Molcular disperion of montmorillonite within the crosslinked epoxy matrix verified using X-ray diffraction and transmission electron microscopy found that the final product contains a uniform dispersion of exfoliated $10{\AA}$ thin clay layers seperated by $250{\sim}500{\AA}$of polyether polymer, thus verifying the nanocomposite structure.

• Proceedings of the Korean Society of Soil and Groundwater Environment Conference
• /
• 2004.09a
• /
• pp.410-412
• /
• 2004

한반도남부에 분포하는 중생대의 화강암류는 경기육괴지역을 중심으로 분포하는 쥬라기의 대보화강암류와 옥천대 이남지역에 주로 분포하는 백악기의 불국사 화강암류로 크게 분류할 수가 있다. 우리나라의 4$0^{\circ}C$ 이상의 고온성 온천수는, 이암층으로 덮여있는 포항지역을 제외하고는 대부분이 상기의 화강암류 지역에 분포하는 특성을 지닌다. 이 논문에서는 우리나라의 고온성 온천수의 지구화학적특성, 특히 희토류원소의 분포특성을 화강암류의 분포지역과 비교하여 고찰해보고자 하였다. 화학분석에 이용된 온천수 시료는 2004년도 2월의 건기에 채취되었다. 이 연구결과에 의하면, 아산온천(구 온양온천), 덕산온천, 포천지구 및 속초지구와 같이 쥬라기 대보화강암류지역에 주로 분포하는 온천수는 PAAS(Post-Archean Australian Shale)로 규격화하였을 경우 경희토류(La-Sm)이 결핍되어 있고, 중희토류는 편평한 분포양상을 보여주었다. 그리고 Eu의 이상(anomaly)이 거의 존재하지 않으며, Ce의 경우 부(-)의 이상 (Ce netative anomaly)을 보여주기도 한다. 반면에 옥천대 이남에 분포하는 백암, 덕구, 부곡, 마금산, 동래, 해운대, 포항지구의 온천수들은 전반적으로 편평한 분포특성을 보여준다. 그리고 대체적으로 Eu 과 Ce의 강한 정(+)의 이상을 보여준다. 이와 같은 Eu과 Ce의 이상은 온천수와 대수층간의 반응에 따른 결과로서 사료된다.

• Journal of the Microelectronics and Packaging Society
• /
• v.8 no.3
• /
• pp.31-36
• /
• 2001

Dielectric material which is suitably designed for the application of the high-temperature electrostatic chucks(HTESCS) has been developed. Electrical resistivities and dielectric constants of the dielectric layer satisfy the demands for the proper operation of HTESC, and coefficient of thermal expansion(CTE) of the dielectric material matches well that of the bottom insulator so that it secures stable structure. In order to minimize particle contaminations, borosilicate glass(BSG) is selected as a bonding layer between dielectric layer and bottom insulator, and silver is used as a electrode. BSG is solidly bonded between upper dielectric and bottom insulator, and no diffusions or reactions are observed among silver electrode, dielectric, and glass layers. The chucking characteristics of the fabricated HTESC are found to be superior to those of the commercialized one.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.39-40
• /
• 2008

유기용매를 사용한 나노분산체의 경우, 유기용매를 완전하게 제거 것은 극히 어렵다. 이는 유기용매와 유기고분자와의 일부 반응되는 경우가 발생되어 전기적 물성에 영향을 줄 수 있다. 본 연구는 친환경적인 분산기법으로 물리적 분산기법을 제안하는 바이다. 양호한 분산체를 얻기위해 균질한 상태인 마이크로적 분산기법과 층상실리케이트인 층간사이에 고분자인 에폭시분자가 삽입되어 박리가 양호하게 일어나게 하는 나노적인 분산기법을 통시에 적용하여 분산이 훌륭하게 일어나는 경우를 개발하였다. 마이크로적인 분산을 위해 사용된 Homogenizer의 적용속도와 적용시간에서 원형인 Organoclay_10A Powder의 d-spacing이 262%, 263%로 증가되는 결과를 얻었다. 또한 DSC의 유리천이온도 분석에서도 적용시간의 증가에 따라 유리천이온도가 되어 원형에폭시수지에 비하여 $9^{\circ}C$상승된 결과를 얻을 수 있었다.

• Polymer(Korea)
• /
• v.32 no.4
• /
• pp.347-352
• /
• 2008

High impact polystyrene (HIPS) nanocomposites with organically modified montmorillonite (organoclay) via in situ polymerization were synthesized, and the effects of organoclay incorporation on material properties were investigated. Organoclays having a reactive group, vinylbenzyltrimethyl clay (VBC) and octadecylvinylbenzyldimethyl clay (ODVC), were prepared by the ion-exchange reactions of sodium montmorillonite with vinylbenzyltrimethyl ammonium chloride (VBTMAC) and octadecylvinylbenzyldimethyl ammonium bromide (ODVBDAB), respectively, and a commercial organoclay, $Cloisite^{(R)}$ 10A(C10A), was used for comparison. It was confirmed that the X-ray diffraction (XRD) peak of the nanocomposites prepared by ODVC disappeared, which indicates the exfoliation of silicate layers. On the contrary, the XRD peak of the nanocomposites prepared by C10A shifted to lower angle, indicative of the intercalation of polymer chains into silicate layers. Rheological properties such as storage modulus and complex viscosity increased with increasing organoclay.

• Journal of the Microelectronics and Packaging Society
• /
• v.9 no.2
• /
• pp.1-9
• /
• 2002

The intermetallic formation between Sn-Ag-(Cu) solders and metal pads in a real BGA package was characterized using SEM, EDS, and XRD. The intermetallic phase formed in the interface between Sn-Ag-Cu and Au/Ni/Cu pad is likely to be ternary compound of $(Cu,Ni)_6Sn_5$ from EDS analysis High concentration of Cu was observed in the solder/Ni interface. XRD analysis confirmed that $\eta -Cu_6 Sn_5$ type was intermetallic phase formed in the interface between Cu containing solders and Ni substrates and $Ni_3$Sn_4$ intermetallic was formed in the Sn-Ag solder/Ni interface. The thickness of intermetallic phase increased with the reflow times and Cu concentration in solder.

• Journal of the Korean Crystal Growth and Crystal Technology
• /
• v.9 no.1
• /
• pp.60-63
• /
• 1999

Application of reactive ion etching (RIE) technique to Ta-Al alloy thin film with a thickness of $1000{\AA}$ was studied. $CF_{4}$ gas could be used effectively to etch the Ta-Al alloy thin film. The etching rate in the thin film with Ta content of 50 mol% was about $67{\AA}/min$. NO selectivity between the Ta-Al alloy film and $SiO_{2}$ film was observed during the etching using the $CF_{4}$ gas. The etching rate of the $SiO_{2}$ layer was 12 times faster than that of the Ta-Al alloy thin film. It was also observed that photoresist of AZ5214 was more useful than Shiepley 1400-27 in RIE with the $CF_{4}$ gas.

• Polymer(Korea)
• /
• v.24 no.4
• /
• pp.556-563
• /
• 2000

In general, the development of thermoplastic composites has been confronted with difficult problems such as the weak bonding strength between fibers and matrix. However, now, such problems are being surmounted by the development of resins, the improvement of processes, and introduction of interphase. Especially, the introduction of interphase between fiber and matrix can help a dissipation of the impact energy and provide a good adhesion between fibers and matrix. In this study, polymeric interphase was introduced by electrodeposition, modified polypropylene was added to improve the weak bonding strength between interphase and polypropylene matrix. By evaluation of interlaminar shear strength and impact strength of the composites, it was found that composites with introduced composites showed higher mechanical properties than those of composites without interphase. Reactive polymers which have either anhydride or free acid functional group were used as interphase materials, and these polymers also behave as charge carrier in aqueous solution during the electrodeposition process. Weight gain on the carbon fibers was evaluated by changing process parameters such as concentration of solution, current density, and electrodeposition time.

• Polymer(Korea)
• /
• v.24 no.4
• /
• pp.571-577
• /
• 2000

A new type of filler for epoxy-clay nanocomposites has been prepared by the reaction of octadecyltrimethylammonium bromide and layered sodium montmorillonite (MMT) via an ion-exchange reaction. The gallery space was further modified by grafting the aminopropyl groups via a reaction between a octadecyltrimethylammonium-MMT and 3-aminopropyltriethoxysilane (APS). The interlayer modification of MMT was confirmed by XRD, IR, and solid-state $^{29}$ Si CP/MAS NMR. Furthermore, clay-polymer nanocomposites have been synthesized by the polymerization of diglycidyl ether of bisphenol A(DGEBA) and $C_{18}$ H$_{37}$ N($CH_3$)$_3$-APS-MMT. The resulting hybrid nanocomposites were characterized by XRD, transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The results proved that the organomontmorillonite could be exfoliated and uniformly dispersed in the epoxy matrix.

• Journal of Korean Society of Steel Construction
• /
• v.22 no.2
• /
• pp.129-137
• /
• 2010

In this study, a five-story steel frame was designed in accordance with KBC2005 to evaluate the effect of the beam-column connection on the structural behavior. The connections were designed as a fully rigid connection and as a semirigid connection. A fiber model was utilized to describe the moment-curvature relationship of the steel beam and column, and a three-parameter power model was adopted for the moment-rotation angle of the semirigid connection. To evaluate the effects of higher modes on structural behavior, the structure was subjected to a KBC2005-equivalent lateral load and lateral loads considering higher modes. The structure was idealized as a separate 2D frame and as a connected 2D frame. The pushover analysis of 2D frames for the lateral load yielded the top displacement-base shear force, design coefficients such as overstrength factor, ductility ratio, and response modification coefficient, demanded ductility ratio for the semirigid connection,and distribution of plastic hinges. The sample structure showed a greater response modification coefficient than KBC2005, the higher modes were found to have few effects on the coefficient, and the lateral load of KBC2005 was found to be conservative. The TSD connection was estimated to secure economy and safety in the sample structure.