• Title/Summary/Keyword: 충격 시험법

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Application of Linear Curve Fitting Methods for Slug Test Analysis in Compressible Aquifer (압축성이 큰 지반에서 순간변위(충격)시험 해석을 위한 선형 커브피팅법(Linear Curve Fitting Methods)의 적용)

  • Choi, Hang-Seok;Lee, Chul-Ho;Nguyen, The Bao
    • Journal of the Korean Geotechnical Society
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    • v.23 no.11
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    • pp.99-107
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    • 2007
  • The linear curve fitting methods such as the Hvorslev method and the Bouwer and Rice method provide a rapid and simple means to analyze slug test data for estimating in-situ hydraulic conductivity (k) of geologic material. However, when analyzing a slug test in a relatively compressible aquifer, these methods have difficulties in fitting a straight line to the semi-logarithmic plot of the test data that shows a concave-upward curvature because the linear curve fitting methods ignore the role of the compressibility or specific storage ($S_s$) of an aquifer. The comparison of the Hvorslev method and the Bouwer and Rice method is made far a partially-penetrating well geometry to show analytically that the Hvorslev method estimates higher hydraulic conductivity than the Bouwer and Rice method except that the well intake section locates very close to the bottom of the aquifer. The effect of fitting a straight line to the slug test data is evaluated along with the dimensionless compressibility parameter (${\alpha}$) ranging from 0.001 to 1. A modified linear curve fitting method that is expanded from Chirlin's approach to the case of a partially penetrating well with the basic-time-lag fitting method is introduced. A case study for a compressible glacial till is made to verify the proposed method by comparing with a type curve method (KGS method).

열 cycle 재현법을 이용한 원자로압력용기(RPV)강 용접열영향부(HAZ) 해석

  • 김주학;문종걸;변택상;이창희;홍준화
    • Proceedings of the Korean Nuclear Society Conference
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    • 1997.05b
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    • pp.17-22
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    • 1997
  • ASME SA508 Class 3 원자로압력용기강을 대상으로, 용접열영향부(heat affected zone, HAZ)의 최고온도(peak temperature) 등온분포도(isothermal diagram)를 작성 및 해석하였고, 재현(simulated) 열영향부 시험편을 제작하여 미세조직검사 및 기계적특성 시험을 실시하였다. 그 결과, 최고온도 등온분포도를 이용하여, 미소열영향부(subzone of HAZ)의 미세조직(microstructure)에 미치는 예열(preheat)온도와 용접입열량(weld heat input)의 크기 효과를 예측할 수 있었다. 또한, 재현 HAZ 의 기계적특성 시험결과, 용접용융선(fusion line) + 1 mm 이내의 위치로 대표되는 열 cycle 조건에서는 모재보다 양호한 강도와 인성을 보였고, 용접용융선 + 2~3mm부근에서 가장 미세한 조직(fine tempered lower bainite)과 우수한 충격인성을 나타냈다. 한편, 용접용융선 + 약 5mm 위치에서의 열 cycle 을 재현한 시험편에서는 미세조직의 변화(spheroidization of carbides)와 함께 인성 및 기계적 특성이 저하하여 모재보다 낮은 값을 보이는 것을 발견할 수 있었다.

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Estimate of the Bearing Capacity on Subbase and Subgrade with Dynamic Plate Bearing Test (동평판재하시험을 이용한 도로하부 재료의 지지력 평가)

  • Youn, Ilro;Oh, Sewook
    • Journal of the Korean GEO-environmental Society
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    • v.14 no.8
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    • pp.53-60
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    • 2013
  • The compaction control method of national road substructure is using field density test to determine the relative compaction and plate bearing test to check the load bearing capacity. However, these two tests digitize a construction site manager's judgment based on his experience, so mechanical basis is weak. Resilient modulus method, which is recently being used to resolve such problem, is evaluated as a rational design method of pavement structure that can rationally reflect the stress-strain state of pavement materials that is caused by the condition of load repetition of vehicle load. However, the method of measuring the resilient modulus is difficult and lengthy, and it has many problems. To replace it, light falling weight test is recently being proposed as a simple test method. Therefore, this research uses dynamic plate loading test, which quickly and simply measures the elastic modulus of the subgrade and sub-base construction and site of maintenance, to judge the possibility of compaction control of the stratum under the road, and it proposes relation formula by analyzing the result of static load test.

Experimental and Numerical Study on Board Level Impact Test of SnPb and SnAgCu BGA Assembly Packaging (BGA Type 유.무연 솔더의 기계적 충격에 대한 보드레벨 신뢰성 평가)

  • Lim, Ji-Yeon;Jang, Dong-Young;Ahn, Hyo-Sok
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.4
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    • pp.77-86
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    • 2008
  • The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

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Synthesis of the material releasing thermal stress by designing FGM (경사기능층의 디자인에 의한 열응력분산재료 합성에 관한 연구)

  • 김유택;박진호
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.2
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    • pp.240-244
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    • 1999
  • Monolithic SiC and SiC/C functionally gradient material (FGM) layers were deposited on graphite substrates by CVD method. Temperature a profiles and thermal stress distributions in the deposited layers under the thermal shock were calculated by a commercially available software package. The designed FGM specimens were found to show an efficient relaxation of thermal stresses at the interfaces, and the specimens were intact even under a thermal shock of $\Delta$T=1600 K.

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Analysis and Countermeasure for Shock-proof Performance of Laptop Computers (노트북 컴퓨터의 충격성능 분석 및 대책)

  • 임경화;윤영한;안채헌;김진규;이승은
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2001.05a
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    • pp.490-495
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    • 2001
  • This paper deals with an analysis and countermeasure for improving the shock performance of laptop computers. The shock analysis is carried out by using the commercial program of LS-DYNA3D. Also the analysis is verified by the measurements from modal tests and shock tests. The available countermeasures are investigated theoretically and experimentally to find the effective methods of reducing the shock acceleration on hard disk driver during one side fall test. The hard disk drive is the most sensitive part in a laptop computer. This research shows the effects of the spring constant of rubber pad, the reinforcement of mechanical parts and the location of a hard disk driver, on the shock reduction.

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Assessment of Tensile & Ductile-Brittle Transition Characteristics of CrMo Steel Using Small Punch Test (소형펀치실험을 이용한 CrMo강의 인장 및 연취성천이특성의 평가)

  • ;Ha, Jeong-Su
    • Korean Journal of Materials Research
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    • v.8 no.2
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    • pp.99-104
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    • 1998
  • 사용중인 중화학 설비의 재료물성의 경년열화적 특성을 평가하기 위하여 기존 실험법의 인장시험편이나 충격시험편을 채취하기는 실제적으로 불가능하다. 인장강도등 인장특성과 비교한 결과 인장강도, 연신율, 항복강도, 종탄성계수와 소형펀치실험의 각 특성과 선형적 관계를 얻을 수 있었다. 또한 경년열화도를 평가하는 두구인 파면천이온도(FATT)와 비교하기 위하여 저온 소형펀치실험을 실시한 결과 충격실험을 통하여 구한 FATT온도와 소형펀치실험의 천이온도 ( $T_{sp}$ )와 일정한 관계가 있음이 밝혀져 사용재의 열화도를 평가할 수 있다.

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Bending Impact Properties Evaluation of Sn-xAg-Cu Lead Free Solder Composition and aging treatment (시효처리한 Sn-xAg-Cu계 무연솔더 조성에 따른 굽힘충격 특성평가)

  • Jang, Im-Nam;Park, Jai-Hyun;Ahn, Yong-Sik
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.2
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    • pp.49-55
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    • 2011
  • The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

Evaluation of Structural Response of Cylindrical Structures Based on 2D Wave-Tank Test Due to Wave Impact (파랑충격력에 의한 원형실린더구조물의 구조응답평가)

  • Lee, Kangsu;Ha, Yoon-Jin;Nam, Bo Woo;Kim, Kyong-Hwan;Hong, Sa Young
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.33 no.5
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    • pp.287-296
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    • 2020
  • The wave-impact load on offshore structures can be divided into green-water and wave-slamming impact loads. These wave impact loads are known to have strong nonlinear characteristics. Although the wave impact loads are dealt with in the current classification rules in the shipping industry, their strong nonlinear characteristics are not considered in detail. Therefore, to investigate these characteristics, wave-impact loads induced by a breaking wave on a circular cylinder were analyzed. A model test was carried out to measure the wave-impact loads due to breaking waves in a two-dimensional (2D) wave tank. To generate a breaking wave, the focusing wave method was applied. A series of 2D tank tests under a horizontal wave impact was carried out to investigate the structural responses of the cylindrical structure, which were obtained from the measured model test data. According to the results, we proposed a structural damage-estimation procedure of an offshore tubular member due to a wave impact load. Furthermore, a recommended wave-impact load is suggested that considers the minimum required thickness of each member. From the experimental results, we found that the required minimum thickness is dependent on the impact pressure located in a three-dimensional space on the surface of a tubular member.

Development of a Coarse Lunar Soil Model Using Discrete Element Method (이산요소법을 이용한 성긴 달토양 수치해석모델 개발)

  • Jeong, Hyun-Jae;Lim, Jae Hyuk;Kim, Jin-Won
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.47 no.1
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    • pp.26-34
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    • 2019
  • In this paper, a coarse lunar soil model is developed using discrete element method and its computed physical properties are compared with those of the actual lunar soil for its validation. The surface of the actual moon consists of numerous craters and rocks of various sizes, and it is covered with fine dry soil which seriously affects the landing stability of the lunar lander. Therefore, in consideration of the environment of the lunar regolith, the lunar soil is realized using discrete element method. To validate the coarse model of lunar soil, the simulations of the indentation test and the direct shear test are performed to check the physical properties(indentation depth, cohesion stress, internal friction angle). To examine the performance of the proposed model, the drop simulation of finite element model of single-leg landing gear is performed on proposed soil models with different particle diameters. The impact load delivered to the strut of the lander is compared to test results.