• Title/Summary/Keyword: 초정밀 연삭가공

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Study on Ultra-Precision Grinding Condition of WC-Co (금형용 WC-Co의 초정밀 연삭 가공 조건에 관한 연구)

  • S.J. Heo;J.H. Kang;W.I. KIm
    • Journal of the Korean Society for Precision Engineering
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    • v.10 no.1
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    • pp.42-51
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    • 1993
  • Recently, WC-Co have some excellent properities as the material for the mechanical component such as metallic moulding parts, ball dies parts, and punch parts. This paper describes the surface roughness and grinding force caused by experimental study on the surface grinding of WC-Co with ultra-precision like a mirror shape using diamond wheel. Also, some investigations are carried out using WA grinding wheel to increase improved ground surface roughness such as polishing, lapping effect. Some important results obtained here are summarized as follow. 1) Within this experimental grinding condition, we can be obtained $R_{max}.\;2\mu\textrm{m}\;R_a\;0.3\mu\textrm{m}$ whichare the most favourable ground surface roughness using #140 diamond wheel, and improved surface roughness values about 20 .approx. 25% throughout 5 times sparkout grinding 2) The value of surface roughness is Rmax. $0.49\mu\textrm{m},\;R_a\;0.06\mu\textrm{m}$ using #600 diamond wheel. 3) The area of no rack zone is less than $F_{n}$ 0.27N/mm, Ft 0.009N/mm

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A Study on the Nano Grinding of Sapphire by Ultra-Precision Grinder (초정밀 연삭기에 의한 사파이어의 나노가공)

  • 김우순;김동현;난바의치
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.12 no.5
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    • pp.40-45
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    • 2003
  • Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

Study on Ultra-Precision Grinding Processing for Aspheric Glass Array Lens WC Core (비구면 유리 어레이 렌즈 성형용 초경합금 코어 초정밀 연삭 가공에 관한 연구)

  • Ko, Myeong Jin;Park, Soon Sub
    • Journal of the Korean Society for Precision Engineering
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    • v.33 no.11
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    • pp.893-898
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    • 2016
  • Plastic array lens are cheap to manufacture; however, plastic is not resistant to high temperatures and moisture. Optical glass represents a better solution but is a more-expensive alternative. Glass array lens can be produced using lithography or precision-molding techniques. The lithography process is commonly used, for instance, in the semiconductor industry; however, the manufacturing costs are high, the processing time is quite long, and spherical aberration is a problem. To obtain high-order aspherical shapes, mold-core manufacturing is conducted through ultra-precision grinding machining. In this paper, a $4{\times}1$ mold core was manufactured using an ultra-precision machine with a jig for the injection molding of an aspherical array lens. The machined mold core was measured using the Form TalySurf PGI 2+ contact-stylus profilometer. The measurement data of the mold core are suitable for the design criterion of below 0.5 um.

Research on Ultra-precision Grinding Work of Silicon Carbide (실리콘 카바이드의 초정밀 연삭 가공에 관한 연구)

  • Park, Soon-Sub;Won, Jong-Ho
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.9
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    • pp.58-63
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    • 2009
  • Silicon carbide (SiC) has been used for many engineering applications because of their high strength at high temperatures and high resistances to chemical degradation. SiC is very useful especially for a glass lens mold whose components demanded to the machining with good surface finish and low surface damage. The performance and reliability of optical components are strongly influenced by the surface damage of SiC during grinding process. Therefore, the severe process condition optimization shall be necessary for the highly qualified SiC glass lens mold. Usually the major form of damage in grinding of SiC is a crack occurs at surface and subsurface. The energy introduced in the layers close to the surface leads to the formation of these cracks. The experimental studies have been carried out to get optimum conditions for grinding of silicon carbide. To get the required qualified surface finish in grinding of SiC, the selection of type of the wheel is also important. Grinding processes of sintered SiC work-pieces is carried out with varying wheel type, depth of cut and feed using diamond wheel. The machining result of the surface roughness and the number of flaws, have been analyzed by use of surface profilers and SEM.

An Research on Ultra Precisive Polishing Manufacturing Technology of Glass for Micromini and Super Wide-Angle Aspherics Glasses Lens. (초소형 초광각 비구면 유리렌즈의 초정밀 연삭가공기술에 관한 연구)

  • Kim, Doo-Jin;Yoo, Kyung-Sun;Hyun, Dong-Hoon
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.2
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    • pp.275-281
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    • 2010
  • This research's goal is to process directly aspherics with big sagment and thin center thickness. If we can process directly aspherics with big sagment and thin center thickness, we think it greatly helps to reduce the time of developing optical system. We made very thin glass using diamond grinding whetstone regarding the trace of tool and the detailed drawing of tool super precisive aspherics that has 0.46mm center thickness and over $30^{\circ}$ segment, $0.1{\mu}m$ machining accuracy, 15nm surface accuracy. We think this research's result will be effective to open new market because it is applied not only cell phone optical system but also CCTV robot optical system, internet phone optical system. Also we expect to enhance the super strong brittle precisive process's possibility with super precisive processing technique that achieves 0.46mm glass center thickness as first in the world.

Structural and Thermal Sensitivity Analysis of a High-Precision Centerless Grinding Machine for Machining Ferrules (페룰 가공용 초정밀 무심 연삭기의 구조적 및 열적 민감도 해석)

  • Kim, Seok-Il;Lee, Won-Jae
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.30 no.12 s.255
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    • pp.1634-1641
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    • 2006
  • High-precision centerless grinding machines are emerging as a means of finishing the outer diameter grinding process required for ferrules, which are widely used as fiber optic connectors. In this study, a sensitivity analysis for structural and thermal characteristics was carried out using a virtual prototype of a centerless grinding machine to realize systematic design technology and performance improvements required to manufacture ferrules. The prototype consisted of a concrete-filled bed, hydrostatic grinding wheel (GW) and regulating wheel (RW) spindle systems, a hydrostatic RW table feed mechanism, a RW swivel mechanism, and on-machine GW and RW dressers. The results of the structural sensitivity analysis illustrated that the vertical stiffness of hydrostatic guideway for the RW table feed system greatly influenced the horizontal loop stiffness, and the results of the thermal sensitivity analysis illustrated that the heat generation rates at hydrostatic bearings and belt pulley greatly influenced the temperature rise of hydrostatic bearings and the deviation of thermal displacement between GW and RW.

외날 다이아몬드 회전공구를 이용한 마이크로 형상가공 연구

  • Je, Tae-Jin;Lee, Jong-Chan;Choi, Hwan;Choi, Doo-Sun;Lee, Eung-Sook;Hong, Sung-Min
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.265-265
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    • 2004
  • 최근 IT산업으로 대표되는 광통신 및 광신호 전달에 이용되는 광 반사경 및 렌즈어레이, 광가이드 판넬(BLU, FLU)등 광부품의 수요가 급증하고 있고, 이의 생산을 위한 다양한 제조공정이 연구 개발되고 있다 근년까지 이러한 마이크로 광부품의 제조방법은 포토리소그래피, 에칭기술을 베이스로 한 MEMS 기술, PDMS를 이용한 복재기술에 크게 의존하고 있다. 기계적 가공법으로는 오래전부터 초정밀 경면 선삭이나 연삭에 의한 마이크로 렌즈와 미세 패턴의 금형가공이 이루어져 왔다.(중략)

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The development of Centerless Grinder for Ferrule Grinding (페룰 가공용 초정밀 센터리스 연삭기 개발)

  • CHO S.J.;EBIHARA EBIHARA;TSUKISHIMA TSUKISHIMA;YOON J.S.;CHO C.R.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.6-9
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    • 2005
  • In this study, the ultra precision centerless grinder for ferrule grinding was designed. As the good-qualified ferrule is required a precise and fine grinding, grinding machine for ferrule must have a high accuracy and a sufficient stiffness. The centerless grinder is composed of the high damping concrete bed, grinding wheel spindle unit, regulating wheel spindle unit, feeding table and dressing unit. For a newly developed centerless grinder, hydrostatic system with high precision feeding and high stiffness was proposed. The grinding and regulating wheel spindle units were composed of hydrostatic spindle and feeding table was hydrostatic table. The prototype of hydrostatic table was manufactured and tested.

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A study on the development of ultra-precision grinding system and manufacturing properties for aspheric surface micro lens (비구면 마이크로 렌즈 가공을 위한 초정밀 연삭 시스템 개발 및 가공 특성에 관한 연구)

  • Baek S.Y.;Lee H.D.;Kim S.H.;Lee E.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.15-18
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    • 2005
  • As consumer in optics, electronics, aerospace and electronics industry grow, the demand for ultra-precision aspheric surface lens increases higher. To enhance the precision and productivity of ultra precision aspheric surface micro lens, The development of ultra-precision grinding system and manufacturing properties for the aspheric surface micro lens are described. In the work reported in this paper, and ultra-precision grinding system for manufacturing the aspheric surface micro lens was developed by considering the factors affecting the surface roughness and profiles accuracy. And this paper deals with mirror grinding of an aspheric surface micro lens by resin bonded diamond wheel and spherical lens of BK7. It results was that a form accuracy of $3\;{\mu}m$ P-V and a surface roughness of $0.1\;{\mu}m\;R_{max}$.

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