• 제목/요약/키워드: 초정밀

검색결과 1,188건 처리시간 0.04초

세장비가 큰 다단계 초정밀 사각형 디프드로잉을 위한 블랭크 설계 (Blank Design in Multi-Stage Rectangular Deep Drawing of Extreme Aspect Ratio)

  • 박철성;구태완;강범수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 춘계학술대회논문집
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    • pp.258-261
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    • 2003
  • In this study, finite element analysis for multi-stage deep drawing process of rectangular configuration with extreme aspect ratio is carried out especially for the blank design. The analysis of rectangular deep drawing process with extreme aspect ratio is likewise very difficult with respect to the design process parameters including the intermediate die profile. In order to solve the difficulties, numerical approach using finite element method is performed in the present analysis and design. A series of experiments for multi-stage rectangular deep drawing process are conducted and the deformed configuration is investigated by comparing with the results of the finite element analysis. Additionally, to minimize amount of removal material after trimming process, finite element simulation is applied for the blank modification. The analysis incorporates brick elements for a rigid-plastic finite element method with an explicit time integration scheme using LS-DYNA3D.

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고효율 Hybrid LED 패키지 설계 및 초정밀 광학패턴 가공에 관한 연구 (A Study on Design of High Luminance Hybrid LED Package and Ultra-fine Machining of Optical Pattern)

  • 전은채;제태진;황경현
    • 소성∙가공
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    • 제19권8호
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    • pp.474-479
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    • 2010
  • Newly suggested hybrid LED package can reduce the number of LED processes and enhance light efficacy in virtue of its integrated optical patterns. Square-type pyramid pattern was chosen for the integrated optical pattern in this study, and it was proved that the pattern enhances illuminance about three times and luminance about two and half times by optical simulation. Square-type pyramid patterns of 0.02mm height and 0.04mm pitch were successively machined on a copper mold which is necessary for imprinting the integrated pattern. Hybrid LED package with integrated optical pattern will be manufactured with ultra-fine machined mold in future study.

자기연마를 이용한 STS304 파이프 내면의 초정밀 가공 (Super Precise Finishing of Internal-face in STS304 Pipe Using the Magnetic Abrasive Polishing)

  • 김희남;윤여권;심재환
    • 한국안전학회지
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    • 제17권3호
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    • pp.30-35
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    • 2002
  • The magnetic abrasive polishing is the useful method to finish using magnetic power of a magnet. It's not a long time this method was introduced to korea as one of precision finishing techniques. The magnetic abrasive polishing method is not so common for machine that it is not spreaded widely. The are rarely researcher in this field because of no-effectiveness of magnetic abrasive. The mechanism of this R&D is dealing with the dynamic state of magnet-abusive. This paper deals with mediocritizing magnetic polishing device into regular lathe and this experiment was conducted in order to get the best surface roughness at low cost. We need to continue the research on it. This paper contains the result of experiment to acquire the best surface roughness, not using the high-cost polishing material in processing. The average diameters of magnetic abrasive are the particles of 150$\mu\textrm{m}$, 250$\mu\textrm{m}$.

R&D 리포트 - "광학업체들, 위성탑재체 개발 참여로 첨단기술 확보 계기로 삼아야" - 우리기술.우리 탑재체, 과학기술위성 3호 지구관측 영상분광기 코미스(COMIS) -

  • 이준호
    • 광학세계
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    • 통권121호
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    • pp.23-27
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    • 2009
  • 1980년 말에 시작한 우주개발에 참여한 우리나라는 약 20년이라는 짧은 시간 동안 급속하게 기술축적을 하여 위성체 개발 기술을 상당부분 보유하게 되었고, 오는 7월이면 KSLV-1의 발사를 통하여 우주진입 기술 확보도 시작하게 될 것으로 기대되고 있다. 과학기술위성 3호 영상분광기 코미스(COMIS)는 개발 과정도 하나의 목표로 취급되고 있어, 모든 개발 과정이 100% 국내에서 이뤄지고 있다. 특히, 광학 소자의 가공 및 평가에 국내 민수 광학 업체들이 참여하고 있다. 광학 업체의 위성탑재체 개발 참여를 통한 매출 증가는 아직 미비하지만 이를 통하여 초정밀 초청밀 가공 및 평가 기술, 초경량화 및 신소재, 환경평가 기술들을 확보하는 계기로 판단하여 적극적인 참여의지 표시가 필요할 것으로 보인다.

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132 kV 초정밀 전압변성기(PT) 개발 및 안정도 평가 (Development of 132 kV Standard Potential Transformer and Stability Test)

  • 권성원;이상화;정재갑;김문석;김재영;이성하
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 제40회 하계학술대회
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    • pp.1387_1388
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    • 2009
  • High accurate and stable 132 kV potential transformers (PTs) including 66 kV & 22 kV PT with stability of less than 0.0033 % for 13 month and with ratio error within $\pm$ 0.024 % at full rated voltage have been developed. The PTs are useful as the reference PT of the PT comparator system in the voltage range of 11 kV to 132 kV PT.

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초정밀 고속가공 공정에서의 변형율속도를 고려한 전산 시뮬레이션 해석에 관한 연구 (A Study on Computational Analysis of Ultraprecsion High-speed Machining Process Considering the Strain Rate Effect)

  • 신보성;제태진
    • 한국기계가공학회지
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    • 제5권2호
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    • pp.3-9
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    • 2006
  • HSM(High-speed Machining) is widely used in rapid manufacturing of precision products and molds of various materials. Improvement in cutting efficiency is one of the important subjects in the HSM process. To analyse the dynamic behavior during a very short cutting time, the computational analysis code, LS-DYNA3D, was employed for the simulation of the mechanism of HSM for aluminium 7075. This cutting mechanism includes some difficult points in simulation, for example, material and geometrical non-linearity, high-speed dynamic impact, contact with friction, etc. In this paper, a finite element model considering the strain rate effect is proposed to predict the cutting phenomena such as chip deformation, strain and stress distributions, which will help us to design the HSM process.

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마이크로 엔드밀에 의한 미세격벽가공의 가공특성에 관한 연구 (A Study on the Machining Characteristics for Micro Barrier Ribs by using Micro Endmilling)

  • 민승기;이선우;이동주;이응숙;제태진;최두선
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2001년도 추계학술대회(한국공작기계학회)
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    • pp.26-31
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    • 2001
  • Recently, miniaturization and mass production are the main trends in manufacturing fields. Therefore, ultraprecision machining and MEMS technology have been taken more and more important position in machining of microparts. Micro endmilling is one of the prominent technology that has wide spectrum of application field ranging from macro parts to micro products, such as PDP and IT components, in precision products manufacturing. However, the deburring is significant problem in making smooth and precise parts in micro endmilling. This paper shows removal characteristics of burr generated by micro endmilling process. Additionally, it is necessary to understand the formation mechanism of burr of micro barrier ribs to find proper deburring method.

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비접촉 SPL기법을 이용한 단결정 실리콘 웨이퍼 표면의 극초단파 펄스 전기화학 초정밀 나노가공 (Nanomachining on Single Crystal Silicon Wafer by Ultra Short Pulse Electrochemical Oxidation based on Non-contact Scanning Probe Lithography)

  • 이정민;김선호;김택현;박정우
    • 한국생산제조학회지
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    • 제20권4호
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    • pp.395-400
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    • 2011
  • Scanning Probe Lithography is a method to localized oxidation on single crystal silicon wafer surface. This study demonstrates nanometer scale non contact lithography process on (100) silicon (p-type) wafer surface using AFM(Atomic force microscope) apparatuses and pulse controlling methods. AFM-based experimental apparatuses are connected the DC pulse generator that supplies ultra short pulses between conductive tip and single crystal silicon wafer surface maintaining constant humidity during processes. Then ultra short pulse durations are controlled according to various experimental conditions. Non contact lithography of using ultra short pulse induces electrochemical reaction between micro-scale tip and silicon wafer surface. Various growths of oxides can be created by ultra short pulse non contact lithography modification according to various pulse durations and applied constant humidity environment.

초정밀 선삭가공을 위한 글로벌스테이지의 재현성 실험 (Global Stage of Reproducibility Experiment for Single Point Diamond Turning)

  • 박대광;곽남수;권대주;김재열
    • 한국생산제조학회지
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    • 제22권6호
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    • pp.982-988
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    • 2013
  • With conventional positioning apparatus, it is very difficult to simultaneously achieve the desired driving range and precision at the sub-micrometer level. Generally, lead screw and friction drive, etc., have been used as servo control systems. These have large driving ranges, and high-speed positioning is feasible. In this study, we present a global servo system controlled by a laser interferometer acting as a displacement measurement sensor for achieving positioning accuracy at the sub-micrometer level.

미세 박판 스탬핑을 위한 초정밀 프레스 개발 (Development of a High Precision Press for Micro-Stamping)

  • 김권희;전상열;이종구;오수익
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2001년도 춘계학술대회 논문집
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    • pp.225-230
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    • 2001
  • Hydrostatic bearings have been applied to high precision machine tools and instruments due to their high stiffness, high damping and excellent guided motion straightness. In this paper, we present a procedure for design and test of a high precision press with linear hydrostatic bearings. For a hydrostatic bearing set designed manufactured, measurements were made for the motion straightness, repeatability and bearing stiffness. They are found to be 1.36${\mu}m$/100mm, 0.19${\mu}m$/100mm and 1,261N/${\mu}m$ respectively. With some experience with the hydrostatic bearing, design aspects of the precision press is discussed.

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