• Title/Summary/Keyword: 채용모드

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Introductions of Pre-Rake with Frequency Domain Equalizer and Cyclic Prefix Reduction Method in CDMA/TDD Multi-code Transmission (CDMA/TDD 다중코드 전송에서 주파수 도메인 등화기와 결합된 Pre-Rake 와 Cyclic Prefix 최소화 방법)

  • Lee, Jun-Hwan;Jeong, In-Cheol
    • Journal of Satellite, Information and Communications
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    • v.6 no.1
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    • pp.86-96
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    • 2011
  • In this paper we propose a Pre-rake system applied with a frequency domain equalizer in TDD/CDMA multi-code transmission. The Pre-rake system has been well known technique in TDD/CDMA to make a receiver simple. However, it still has residual losses of path diversity and signal to noise ratio (SNR). However, gathering all the residual paths demands an additional hardware such as a rake combiner at the receiver. For the reason Pre/Post-rake system has already been proposed at up/downlink correlated channel conditionunder the assumption of noisier channel. There is a trade-off between the first purpose of Pre-rake that makes hardware simple at the receiver and the performance improvement. From the point the frequency domain equalizer (FDE) can be considered in Pre/Post-rake to supply the receiver with the flexible equalizing methods with rather reduced complexity compared with time domain rake combiner or equalizers. Pre-rake itself increases the number of multipath, which results from the convolution of Pre-rake filter and wireless channel, and FDE must be well matched to Pre/Post-rake, while it considers the relationship of hardware complexity and the performance. In this paper, the Pre-rake/Post-FDE system is introduced at TDD/CDMA multi-code transmission. In addition, the cyclic prefix reduction method in the proposed system is introduced, and the theoretical analysis to the proposed system is given by assuming Gaussian approximation, and finally the numerical simulation results are provided.

A Study on Characteristic Analysis of Single-Stage High Frequency Resonant Inverter Link Type DC-DC Converter (단일 전력단 고주파 공진 인버터 링크형 DC-DC 컨버터의 특성해석에 관한 연구)

  • Won, Jae-Sun;Park, Jae-Wook;Seo, Cheol-Sik;Cho, Gyu-Pan;Jung, Do-Young;Kim, Dong-Hee
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.20 no.2
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    • pp.16-23
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    • 2006
  • This paper presents a novel single-stage high frequency resonant inverter link type DC-DC converter using zero voltage switching with high power-factor. The proposed topology is integrated half-bridge boost rectifier as power factor corrector(PFC) and half-bridge high frequency resonant converter into a single-stage. The input stage of the half-bridge boost rectifier works in discontinuous conduction mode(DCM) with constant duty cycle and variable switching frequency. So that a boost converter makes the line current follow naturally the sinusoidal line voltage waveform. Simulation results have demonstrated the feasibility of the proposed high frequency resonant converter. Characteristics values based on characteristics analysis through circuit analysis is given as basis data in design procedure. Also, experimental results are presented to verify theoretical discussion. This proposed inverter will be able to be practically used as a power supply in various fields as induction heating applications, fluorescent lamp and DC-DC converter etc.

A study on the implementation of a digital video/audio system to support multi-audio format (다양한 오디오 포맷을 지원하는 비디오/오디오 시스템 구현에 관한 연구)

  • Park In-Gyu
    • Journal of the Institute of Electronics Engineers of Korea CI
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    • v.43 no.4 s.310
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    • pp.123-132
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    • 2006
  • In this paper, the digital video and audio system is improved so that various digital video data formats in DVD disc, and digital audio data formats through the S/PDIF ports may be decoded. It is not easy to implement all decoding functions of video and audio by a DVD processor. The special structure in audio decoding circuit is proposed in this system so as to have simultaneously almost same video and audio performance in quality. By dividing the decoding circuit separately into video and audio part, the audio quality can be dramatically improved together with supporting several audio formats and with several effects. In order to satisfy the perfect audio system to support to audio decoding formats, it is just enough to get the expensive, complicated decoder. However, it may be not easy to get this expensive decoder in near future. Therefore it is rather to adopt the downloading method by which the host should download the appropriate code into memory by detecting the corresponding audio bit streams. It is proved that this method may be efficient in the point of sharing resource of audio data for video decoding.

차세대 Embedded 마이크로프로세서 기술 동향

  • Lee, Hui
    • The Magazine of the IEIE
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    • v.28 no.7
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    • pp.49-55
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    • 2001
  • 1970년대에 개발된 마이크로 프로세서는 제어기기 분야 및 소형 컴퓨터에서 주로 사용되어 오다가 1980년대에 이르러 RISC(Reduced Instruction Set Computer) 구조의 도입으로 중대형 컴퓨터에 이르기까지 광범위하게 사용되고 있다. 또한 반도체 기술의 급격한 발전으로 슈퍼스칼라 구조가 마이크로 프로세서에서도 적용되고 있으며 동작 속도도 수백 MHz에 이르고 있다. 마이크로 프로세서는 프로그램을 수행하기 위해서 프로그램과 데이터를 메모리로부터 읽어 와야 한다. 그런데 메모리 용량은 빠른 속도로 증가하고 있지만 동작 속도는 마이크로 프로세서의 동작 속도에 크게 미치지 못하고 있다. 1980년에 DRAM의 접근 속도는 250nsec이었으나 1998년에 RDRAM의 동작속도는 300MHz로 70여배 빨라졌다. 그러나 마이크로프로세서는 1980년에 8086의 동작 속도가 8MHz이던 것이 1998년에는 팬티엄-2가 500MHz에 이르고 있다. 더욱이 팬티엄-2는 슈퍼스칼라 구조이므로 이를 감안하면 1GHz 이상에 이르러 120여 배 빨라진 것을 알 수 있다. 이와 같은 메모리 속도와 마이크로 프로세서 속도 차이에 더하여, 메모리와 마이크로 프로세서를 인쇄 회로 기판에서 연결하는데 따른 물리적 특성은 변화하지 않으므로 데이터 전송 폭을 넓히는 것에는 한계가 있다. 따라서 향후 컴퓨터 성능 발달을 제한하는 주요 요소 중 하나는 마이크로 프로세서와 메모리 사이의 데이터 전송 폭이다. 프로그램과 데이터가 메모리에 저장되는 본 뉴먼 방식의 컴퓨터에서 데이터 전송 폭을 줄이기 위해서는 코드 밀도(Code Density)가 높은 컴퓨터 구조를 연구하는 것이 필요하다. 한편 마이크로 프로세서는 실장 제어용으로 거의 모든 전자 제품 및 자동화 기기에서 채용하고 있다. 특히 냉장고, 에어콘, 전축, TV, 세탁기 등 가전기기와 Fax, 복사기, 프린터 등 사무용기기와 자동차, 선박, 자동화기계 등 사무 및 산업용 기기와 PDA(휴대용 정보 기기), NC(Network Computer) 등 정보 기기 그리고 각종 오락기, 노래 반주지 등 정보 기기 등에서 사용하는 실장 제어용 마이크로 프로세서 시장은 매년 10% 이상씩 성장하고 있으며, 21세기 산업을 주도하는 핵심 기술로 자리 매김하고 있다. 이러한 실장 제어용 기기는 마이크로 프로세서와 메모리 및 입출력 자이가 하나의 반도체에 집적되는 경우가 많다. 그런데 반도체 가격은 반도체 크기에 따라 결정되며, 가장 넓은 면적을 차지하는 것은 메모리이다. 따라서 반도체 가격을 낮추기 위해서는 메모리 크기를 줄여야 하며, 이를 위해서 또한 코드 밀도가 높은 컴퓨터 구조에 대한 연구가 필요하다. 최근에는 322비트 RISC 명령어를 16비트 명령어로 축약한 구조가 연구되었다. ARM-7TDMI는 ARM-7의 16비트 축약 명령어 구조이며, TR4101은 MIPS-R3000의 16비트 축약 명령어 구조이다. 이들 16비트 축약 명령어 RISC는 종래 RISC와의 호환성을 위하여 2가지 모드로 동작하므로 구조가 복잡하고, 16비트 명령어에서는 8개의 레지스타만을 접근할 수 있으므로 성능이 크게 떨어지는 단점을 가진다.

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A Study on Water Level Control of PWR Steam Generator at Low Power Operation and Transient States (저출력 및 과도상태시 원전 증기발생기 수위제어에 관한 연구)

  • Na, Nan-Ju;Kwon, Kee-Choon;Bien, Zeungnam
    • Journal of the Korean Institute of Intelligent Systems
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    • v.3 no.2
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    • pp.18-35
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    • 1993
  • The water level control system of the steam generator in a pressurized water reactor and its control problems are analysed. In this work the stable control strategy during the low power operation and transient states is studied. To solve the problem, a fuzzy logic control method is applied as a basic algorithm of the controller. The control algorithm is based on the operator's knowledges and the experiences of manual operation for water level control at the compact nuclear simulator set up in Korea Atomic Energy Research Institute. From a viewpoint of the system realization, the control variables and rules are established considering simpler tuning and the input-output relation. The control strategy includes the dynamic tuning method and employs a substitutional information using the bypass valve opening instead of incorrectly measured signal at the low flow rate as the fuzzy variable of the flow rate during the pressure control mode of the steam generator. It also involves the switching algorithm between the control valves to suppress the perturbation of water level. The simulation results show that both of the fine control action at the small level error and the quick response at the large level error can be obtained and that the performance of the controller is improved.

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Characteristics of A Diaphragm-Type Fiber Optic Fabry-Perot Interferometric Pressure Sensor Using A Dielectric Film (유전체 박막을 이용한 다이아프램형 광섬유 Fabry-Perot 간섭계 압력센서의 특성)

  • Kim, M.G.;Yoo, Y.W.;Kwon, D.H.;Lee, J.H.;Kim, J.S.;Park, J.H.;Chai, Y.Y.;Sohn, B.K.
    • Journal of Sensor Science and Technology
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    • v.7 no.3
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    • pp.147-153
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    • 1998
  • The strain characteristics of a fiber optic Fabry-Perot pressure sensor with high sensitivity using a $Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$ (N/O/N) diaphragm is experimentally investigated. A 600 nm thick N/O/N diaphragm was fabricated by silicon anisotropic etching technology in 44 wt% KOH solution. An interferometric fiber optic pressure sensor has been manufactured by using a fiber optic Fabry-Perot intereferometer and a N/O/N diaphragm. The 2 cm length fiber optic Fabry-Perot interferometers in the continuous length of single mode fiber were produced with two pieces of single mode fiber coated with $TiO_{2}$ dielectric film utilizing the fusion splicing technique. The one end of the fiber optic Fabry-Perot interferometer was bonded to a N/O/N diaphragm. and the other end was connected to an optical setup through a 3 dB coupler. For the N/O/N diaphragm sized $2{\times}2\;mm^{2}$ and $8{\times}8\;mm^{2}$, the pressure sensitivity was measured 0.11 rad/kPa and 1.57 rad/kPa, respectively, and both of the nonlinearities were less than 0.2% FS.

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Study on the Improvement of BGA Solderability in Electroless Nickel/Gold Deposit (무전해 Ni/Au 도금에서의 BGA Solderability 특성 개선에 관한 연구)

  • 민재상;황영호;조일제
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.55-62
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    • 2001
  • With a spread of BGA, CSP and fine pitch devices, the need of flatter surface finish in bare board is becoming more critical in solderability. The electroless Ni/Au plating has a solution of these needs and also has being spread to apply to surface finish for bare board in many electronic goods. But, the electroless Ni/Au plating had several issues such as Ni oxidation and phosphorous contents. Before this study, we studied on the effect of BGA solderability in electroless Ni/Au plating and chose some major factors such as the oxidation property of NiP plating and warpage of board. Firstly, we made test board with various plating conditions and improved the plating property through the improvement of NiP oxidation reducing P content. Also, we minimized the warpage of board with the improvement of inner layer structure and the analysis of warpage. For the evaluation of solderability, we analyzed the warpage of board and the plating property after mounting BGA on the board with optimizing conditions. The solder joint of BGA is investigated by SEM(Scanning Electronic Microscope) and OM(Optical Microscope). The composition of joint is used by EDS(Energy Dispersive Spectroscopy). We analyzed the fracture strength and mode by ball shear teser.

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Nano-scale Patterning on Diamond substrates using an FIB (FIB를 이용한 다이아몬드 기판 위의 나노급 미세 패턴의 형상 가공)

  • Song, Oh-Sung;Kim, Jong-Ryul
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.6
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    • pp.1047-1055
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    • 2006
  • We patterned nano-width lines on a super hard bulk diamond substrate by varying the ion beam current and ion beam sources with a dual beam field ion beam (FIB). In addition, we successfully fabricated two-dimensional nano patterns and three-dimensional nano plate modules. We prepared nano lines on a diamond and a silicon substrate at the beam condition of 30 kV, 10 pA $\sim$ 5 nA with $Ga^+$ ion and $H_2O$ assisted ion sources. We measured each of the line-width, line-depth, etched line profiles, etch rate, and aspect ratio, and then compared them. We confirmed that nano patterning was possible on both a bulk diamond and a silicon substrate. The etch rate of $H_2O$ source can be enhanced about two times than that of Ga source. The width of patterns on a diamond was smaller than that on a silicon substrate at the same ion beam power The sub-100 nm patterns on a diamond were made under the charge neutralization mode to prevent charge accumulation. We successfully made a two-dimensional, 240 nm-width text of the 300-lettered Lord's Prayer on a gem diamond with 30 kV-30 pA FIB. The patterned text image was readable with a scanning electron microscope. Moreover, three dimensional nano-thick plate module fabrication was made successfully with an FIB and a platinum deposition, and electron energy loss spectrum (EELS) analysis was easily performed with the prepared nano plate module.

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A Study on Characteristics and Modeling of CMV by Grounding Methods of Transformer for ESS (ESS용 변압기의 접지방식에 의한 CMV 모델링 및 특성에 관한 연구)

  • Choi, Sung-Moon;Kim, Seung-Ho;Kim, Mi-Young;Rho, Dae-Seok
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.4
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    • pp.587-593
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    • 2021
  • Since 2017, a total of 29 fire accidents have occurred in energy storage systems (ESSs) as of June 2020. The common mode voltage (CMV) is one of the electrical hazards that is assumed to be a cause of those fire accidents. Several cases of CMV that violate the allowable insulation level of a battery section are being reported in actual ESS operation sites with △-Y winding connections. Thus, this paper evaluates the characteristics of CMV. An ESS site was modeled with an AC grid, PCS, and battery sections using PSCAD/EMTDC software. As a result of a simulation based on the proposed model, it was confirmed that characteristics of CMV vary significantly and are similar to actual measurements, depending on the grounding method of the internal transformer for PCS. The insulation level of the battery section may be severely degraded as the value of CMV exceeds the rated voltage in case of a grounding connection. It was found that the value of CMV dramatically declines when the internal transformer for PCS is operated as non-grounding connection, so it meets the standard insulation level.