• Title/Summary/Keyword: 집적 광학

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Optical Microphone Incorporating a Reflective Micromirror and a Dual-core Collimator (반사형 마이크로미러와 듀얼 코어 클리메이터를 이용한 광 마이크로폰)

  • Song, Ju-Han;Kim, Do-Hwan;Gu, Hyun-Mo;Park, Hyun-Jung;Lee, Sang-Shin;Cho, Il-Joo
    • Korean Journal of Optics and Photonics
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    • v.17 no.1
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    • pp.94-98
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    • 2006
  • An optical microphone based on a dual-core fiber collimator and a membrane type micromirror serving as an optical head and a reflective diaphragm respectively was implemented. The micromirror diaphragm is suspended by a thin silicon bar linked with a frame, thus it is subject to a displacement induced by acoustic waves. The optical head incorporating two collimators integrated in a single housing gives light to and receives it from the diaphragm, rendering the optical microphone structure simple and compact. This dual-core collimator having a slowing varying beam profile facilitates the initial alignment of the optical head with the diaphragm, especially the distance between them. For the assembled microphone, the static characteristics were investigated tofind the operation point defined as the optimum distance between the head and the diaphragm, and a frequency response with a variation of about $\pm$5 dB for the range of up to 3kHz was achieved.

AWG device characteristic dependence on the fabrication error limit (도파폭 공정오차에 따른 광도파 특성변화와 소자성능 저하)

  • 박순룡;오범환
    • Korean Journal of Optics and Photonics
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    • v.10 no.4
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    • pp.342-347
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    • 1999
  • As the waveguide width and the radius of curvature get smaller for the effort of monolithic fabrication of integrated photonic devices, the waveguide characteristics change significantly according to the change of the waveguide width or the radius of curvature. Especially, variation of the waveguide width due to fabrication process errors induces a phase error for each waveguide from the change of the propagation constant. Therefore, it is important to quantify these variation effects on the device characteristics for the design and fabrication of highly integrated photonic devices. Here, we analyze four different types of waveguides to get general characteristics in propagation constant change by utilizing the effective index method and the analytic solution method. Futhermore, the output characteristics of two AWG(Arrayed Waveguide Grating) devices are simulated by a highly-functional computer code. The simulated results have been found to be similar to the realistic device characteristics. The required fabrication error limit for the ridge-type InP-AWG device should be smaller than 0.02 ${\mu}{\textrm}{m}$ to get better channel crosstalk than-25 dB, while the required fabrication error limit for rib-type silica-AWG devices may be allowed up to 0.1 ${\mu}{\textrm}{m}$ to obtain better crosstalk than -30 dB.

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Optimal Design Method for a Plasmonic Color Filter by Using Individual Phenomenon in a Plasmonic Hybrid Structure (복합 플라즈몬 구조에서의 개별 모드 동작을 이용한 플라즈모닉 컬러 필터 최적의 설계 방법)

  • Lee, Yong Ho;Do, Yun Seon
    • Korean Journal of Optics and Photonics
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    • v.29 no.6
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    • pp.275-284
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    • 2018
  • In this study we propose a hybrid color-filter design method in which a nanohole array and a nanodisk array are separated by nanopillars of the material AZ 1500. We propose a design method for an RGB color filter, using the tendency of transmitted light according to each design variable. Especially we analyzed the intensity distribution of the electric field in the cross section, and set the height of the nanopillars so that the local surface-plasmon resonances generated in the two different arrays do not affect each other. The optical characteristics of the optimized color filter are as follows: In the case of the red filter, the ratio of the wavelength band expressing red in the visible broadband is 55.01%, and the maximum transmittance is 41.53%. In the case of the green filter, the ratio of the wavelength band expressing green is 40.20%, and the maximum transmittance is 42.41%. In the case of the blue filter, the ratio of the wavelength band expressing blue is 32.78%, and the maximum transmittance is 30.27%. We expect to improve the characteristics of color filters integrated in industrial devices by this study.

Effectiveness of Beam-propagation-method Simulations for the Directional Coupling of Guided Modes Evaluated by Fabricating Silica Optical-waveguide Devices (광도파로 모드 간의 방향성 결합현상에 대한 빔 진행 기법 설계의 효율성 및 실리카 광도파로 소자 제작을 통한 평가)

  • Jin, Jinung;Chun, Kwon-Wook;Lee, Eun-Su;Oh, Min-Cheol
    • Korean Journal of Optics and Photonics
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    • v.33 no.4
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    • pp.137-145
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    • 2022
  • A directional coupler device, one of the fundamental components of photonic integrated circuits, distributes optical power by evanescent field coupling between two adjacent optical waveguides. In this paper, the design process for manufacturing a directional coupler device is reviewed, and the accuracy of the design results, as seen from the characteristics of the actual fabricated device, is confirmed. When designing a directional coupler device through a two-dimensional (2D) beam-propagation-method (BPM) simulation, an optical structure is converted to a two-dimensional planar structure through the effective index method. After fabricating the directional coupler device array, the characteristics are measured. To supplement the 2D-BPM results that are different from the experimental results, a 3D-BPM simulation is performed. Although 3D-BPM simulation requires more computational resources, the simulation result is closer to the experimental results. Furthermore, the waveguide core refractive index used in 3D-BPM is adjusted to produce a simulation result consistent with the experimental results. The proposed design procedure enables accurate design of directional coupler devices, predicting the experimental results based on 3D-BPM.

A Study on Wafer-Level 3D Integration Including Wafer Bonding using Low-k Polymeric Adhesive (저유전체 고분자 접착 물질을 이용한 웨이퍼 본딩을 포함하는 웨이퍼 레벨 3차원 집적회로 구현에 관한 연구)

  • Kwon, Yongchai;Seok, Jongwon;Lu, Jian-Qiang;Cale, Timothy;Gutmann, Ronald
    • Korean Chemical Engineering Research
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    • v.45 no.5
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    • pp.466-472
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    • 2007
  • A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.

A Study on the Electromigration Characteristics in Ag, Cu, Au, Al Thin Films (Ag, Cu, Au, Al 박막에서 엘렉트로마이그레이션 특성에 관한 연구)

  • Kim, Jin-Young
    • Journal of the Korean Vacuum Society
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    • v.15 no.1
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    • pp.89-96
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    • 2006
  • Recent ULSI and multilevel structure trends in microelectronic devices minimize the line width down to less than $0.25{\mu}m$, which results in high current densities in thin film interconnections. Under high current densities, an EM(electromigration) induced failure becomes one of the critical problems in a microelectronic device. This study is to improve thin film interconnection materials by investigating the EM characteristics in Ag, Cu, Au, and Al thin films, etc. EM resistance characteristics of Ag, Cu, Au, and Al thin films with high electrical conductivities were investigated by measuring the activation energies from the TTF (Time-to-Failure) analysis. Optical microscope and XPS (X-ray photoelectron spectroscopy) analysis were used for the failure analysis in thin films. Cu thin films showed relatively high activation energy for the electromigration. Thus Cu thin films may be potentially good candidate for the next choice of advanced thin film interconnection materials where high current density and good EM resitance are required. Passivated Al thin films showed the increased MTF(Mean-time-to-Failure) values, that is, the increased EM resistance characteristics due to the dielectric passivation effects at the interface between the dielectric overlayer and the thin film interconnection materials.

Histopathological Studies of Witches' Broom Infected Jujube Trees Treated by Oxytetracycline (옥시테트라싸이클린을 처리한 대추나무 빗자루병 감염목의 병태해부학적 연구)

  • Im Hyong Bin;La Yong Joon;Lim Ung Kyu;Chang Tag Jung;Shin Jai Doo;Lee Soon Hyung
    • Korean Journal Plant Pathology
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    • v.1 no.2
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    • pp.101-108
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    • 1985
  • Histopathological changes in the witches'-broom mycoplasma (MLO) infected jujube trees after trunk injection of oxytetracycline HCl (OTC) solution were investigated by using light microscope, fluorescence microscope and electron microscope. In contrast to the healthy leaves, adaxial and abaxial bundle sheath extensions in the major veins of diseased leaves were highly developed, but mesophyll cells were very small, loose and necrosed. In the diseased leaves, excessive phloem was formed, xylem differentiation was supressed and polyphenols were accumulated. Jujube trees treated with 500ml of 2000ppm solution of OTC showed complete remission of witches'-broom symptoms above the injection site, but cells in the sheath extention were hypertrophied and sieve tube necrosis occurred in the secondary phloem of major veins. MLO-specific fluorescence was not observed in the samples of diseased jujube trees treated with OTC, while those from non-treated infectedstress distinctly showed a moderate amount of MLO-specific fluorescence. In the observation under the electron microscope, sieve element of diseased tissues and its associated companion cells were found to have collapsed. Parenchymas cells contained many large starch filled plastids and most samples of diseased and OTC-treated tissues showed an abnormal accumulation of starch compared to the healthy controls. Mycoplasma-like organisms were observed only within mature sieve elements in diseased tissues, but never in OTC-treated tissues.

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Feasibility of Optoelectronic Neural Stimulation Shown in Sciatic Nerve of Rats (흰쥐의 좌골 신경 자극을 통한 광전 자극의 가능성에 대한 연구)

  • Kim Eui tae;Oh Seung jae;Baac Hyoung won;Kim Sung june
    • Journal of Biomedical Engineering Research
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    • v.25 no.6
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    • pp.611-615
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    • 2004
  • A neural prostheses can be designed to permit stimulation of specific sites in the nervous system to restore their functions, lost due to disease or trauma. This study focuses on the feasibility of optoelecronic stimulation into nervous system. Optoelectronic stimulation supplies, power and signal into the implanted optical detector inside the body by optics. It can be effective strategy especially on the retinal prosthesis, because it enables the non-invasive connection between the external source and internal detector through natural optical window 'eye'. Therefore, we designed an effective neural stimulating setup by optically based stimulation. Stimulating on the sciatic nerve of a rat with proper depth probe through optical stimulation needs higher ratio of current spreading through the neural surface, because of high impedance of neural interface. To increase the insertion current spreading into the neuron, we used a parallel low resistance compared to load resistance organic interface and calculated the optimized outer parallel resistance for maximum insertion current with the assumption of limited current by photodiode. Optimized outer parallel resistance was at a range of 500Ω-700Ω and a current was at a level between 580uA and 650uA. Stimulating current efficiency from initial photodiode induced current was between 47.5 and 59.7%. Various amplitude and frequency of the optical stimulation on the sciatic nerve showed the reliable visual tremble, and the action potential was also recorded near the stimulating area. These result demonstrate that optoelectronic stimulation with no bias can be applied to the retinal prosthesis and other neuroprosthetic area.

Fine Structure and Detoxification Kinetics in Kupffer Cells after Injection of Endotoxin in Rats (내독소 투여에 의한 Kupffer 세포의 미세형태학적 해독반응)

  • Choi, Joon-Hyuk;Choi, Won-Hee;Lee, Tae-Sook
    • Journal of Yeungnam Medical Science
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    • v.10 no.2
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    • pp.313-337
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    • 1993
  • The aim of this study was to clarify the role of Kupffer cells in the mechanism of endotoxin-induced liver injury. The study on fine structure of Kupffer cells was performed after the injection of endotoxin. The endotoxin(Escherichia coli lipopolysaccharide 026 : B6. 1.5mg/100 g of body weight) was intraperitoneally injected in Sprague-Dewley rats. Animals were sacrificed at 1/4, 1/2, 1, 2, 4, 8, 16, 24, 72 and 120 hours after the injection of endotoxin. Livers were extirpated and processed to be examined by light and electron microscopy. The results obtained were summerized as follows: Early changes observed in liver after endotoxin injection included the increased number and hypertrophy of Kupffer cells, infiltration of neutrophils and presence of fibrin thrombi within the sinusoids. The continuous increase of the Kupffer cells in number with hypertrophy, congestion and infiltration of inflammatory cells within the sinusoids were observed. Hepatocytes showed fatty change and occasional necrosis. At 72 hours the congestion decreased. At 120 hours the number of Kupffer cells was increased, but the morphology of Kupffer cells became similar to that of the control group. The numbers and sizes of primary and secondary lysosomes and amount of euchromatin of Kupffer cells increased. Swellings and increase in number of mitochondria, Golgi complex, smooth endoplasmic reticulum, rough endoplasmic reticulum were evident. Microthrombi were present within the sinusoids. The swelling of rough endoplasmic reticulum and mitochondria, decrease of glycogen particles, fatty change, hypoxic vacuoles, pyknotic nuclei and occasional necrosis were observed in hepatocytes. At 72 hours the number of secondary lysosomes in Kupffer cells decreased. At 120 hours the morphology of Kupffer cells became similar to that of the control group. According to these results, it was postulated that the endotoxin was initially taken up by pinocytosis into Kupffer cells and degraded in secondary lysosomes of activated Kupffer cells. Kupffer cells may play an important role in the defense mechanism of liver during endotoxemia. The dysfunction of Kupffer cells and ischemia by sinusoidal microthrombi may cause liver injury.

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A Study of on the Method to Select Manufacturing Activities Sensitive to Regional Characteristics by Analyzing the Locational Hierarchy (입지계층분석을 활용한 산업단지 유치 업종 결정에 관한 연구)

  • So, Jin-Kwang;Lee, Hyeon-Joo;Kim, Sun-Woo
    • Land and Housing Review
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    • v.2 no.4
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    • pp.559-568
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    • 2011
  • This study aims at listing up those manufacturing activities sensitive to regional characteristics by analyzing locational hierarchy designed on the urban rank-size rule. This locational hierarchy by manufacturing activities is expected to provide a ground for the proper supply of an industrial complex. The analysis of the locational hierarchy by manufacturing activities can work as a method of observing the characteristics of the distribution of location for each economic activity by analyzing the trend in the change of manufacturing location. Consequently, it can be used to determine the appropriate manufacturing activities for the industrial complex of a particular region. Here, the locational hierarchy is analyzed depending on the base of the basic local government such as Gun(district level) and Si(city level), and manufacturing activities are categorized by Korea Standard Industry Code. Those activities demonstrating growth pattern are Manufacture of Electronic Equipment(KSIC 26), Manufacture of Medical Precision Optical Instruments Watch(KSIC 27), Manufacture of Motor Vehicles (KSIC 30, 31), etc. With proper infrastructures, these activities can be located everywhere. Those sectors on the decline pattern in the locational hierarchy can be summarized as Manufacture of Tobacco Products(KSIC 12), Manufacture of wearing apparel Fur Articles(KSIC 14), etc. Those sectors scattered widely in the locational hierarchy are Manufacture of Food Products(KSIC 10), Manufacture of Coke Petroleum Products(KSIC 19), Manufacture of Chemical Products(KSIC 20), Manufacture of Electronic Equipment(KSIC 26). These particular manufacturing activities can be operated in those regions in a sufficient supply of unskilled workers regardless of proper infrastructures. Those activities that have a tendency to reconcentrate on larger cities are Manufacture of Textiles(KSIC 13), Manufacture of Wearing Apparel Clothing Fur Articles(KSIC 14), Manufacture of Other Transport Equiptmen(KSIC 31). In most cases, these sectors tend to favor their existing agglomerated areas and concentrate around large cities. Therefore, it is inefficient to promote these sectors in small or medium-sized cities or underdeveloped regions. The establishment of developmental strategies of an industrial complex can gain greater competitiveness by observing such characteristics of the locational hierarchy.