• Title/Summary/Keyword: 집적 광학

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Optical Characteristics of Two-dimensional Silicon Photonic Crystal Slab Structures with Air and Silica Cladding (공기 및 실리카 클래딩을 갖는 2차원 실리콘 광자 결정 슬랩 구조의 광학적 특성)

  • Lee, Yoon-Sik;Han, Jin-Kyu;Song, Bong-Shik
    • Korean Journal of Optics and Photonics
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    • 제20권4호
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    • pp.211-216
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    • 2009
  • Much research into two-dimensional (2-D) photonic crystal (PC) structures has been conducted for realization of ultrasmall optical integrated circuits. A 2-D silicon (Si) PC slab structure with air cladding (n=1) is one of the representative structures in 2-D PCs. While air-clad Si PC slab structures have good optical characteristics, their suspension in air can lead to mechanical weakness, making integration with some optical devices difficult. In this paper, we propose improving the mechanical robustness of PC structure by developing a 2-D Si PC structure with symmetric silica cladding (n=1.44) and comparing its optical properties to that of the air-clad structure. First, we investigate the optical properties of a 2-D Si PC slab structure with air cladding by using a 3-D finite difference time domain method. We determined that a photonic bandgap of 330 nm and a non-leaky propagating bandwidth of 100 nm in the optical communication range are possible. Next, we investigate the optical properties of 2-D Si PC slab structures with silica cladding. Even though the refractive index of the silica cladding is higher than that of air, we developed a silica-clad structure with good optical properties: a photonic band gap of approximately 230 nm and a non-leaky propagating bandwidth of 90 nm, comparable to that of the air-clad PC structures.

Quasi Phase-Matched Second Harmonic-Wave Generation based on Nonlinear-Optic Effect Utilizing Ti:PPLN Optical Waveguides (Ti:PPLN 광도파로를 이용한 비선형광학 기반의 의사 위상정합 2차 조화파 발생)

  • Jung, Hong-Sik;Jung, Young-Sik
    • Korean Journal of Optics and Photonics
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    • 제19권6호
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    • pp.408-415
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    • 2008
  • The characteristics of a ferroelectric-domain inverted grating fabricated by applying a high-voltage pulse at room temperature in Ti-diffused channel waveguides in z-cut $LiNbO_3$ (Ti:PPLN) were examined for channel waveguide quasi phase-matched secondharmonic generation devices. The fabrication conditions of uniform periodic domain-inversion were examined. Ti:PPLN with period ${\Lambda}=16.6{\mu}m$ for SHG were fabricated and the performances were measured. A normalized SHG efficiency as high as 473 (%/W) was obtained with 49 mm interaction length.

Nano-dispersion of the Organics in the Organic/Inorganic Sol-Gel Hybrid Matrices (유/무기 졸-겔 재료에 광기능성 유기물의 나노 분산)

  • 백인찬;석상일;진문영;이창진
    • Proceedings of the Materials Research Society of Korea Conference
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    • 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
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    • pp.218-218
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    • 2003
  • 21세기 정보기반사회에서는 정보처리량의 증가로 인한 대용량 정보 교환을 위하여 신호처리의 고속화/광대역화가 요구되어진다. 완전 광통신망의 구축에 의한 대용량의 광통신을 위해서는 고속이며, 집적화가 가능한 저가의 광전자 소자 개발이 필요하다. 광전자 소자 중 전기-광학 변조 효과를 이용한 광소자의 구현을 위한 소재로서 극성 배향된 비선형 광학 유기고분자 소재는 가공성이 뛰어나 원하는 형태의 광도파로로 제조할 수 있다는 장점에 많은 연구가 진행되고 있다. 그러나 아직 전기광학계수의 향상과 더불어 유기고분자가 가지고 있는 열 및 광화학적 안정성이 낮은 기본적인 문제점과 폴링(poling)에 의해 배향된 극성이 시간에 따라 완화되는 문제의 해결이 요구되고 있다. 이러한 문제점 해결을 위한 기초 연구로 유기물을 졸-겔 매트릭스에 나노 사이즈로 분산하는 방법으로 유기물의 내화학적 안정성을 향상하고자 시도하였다. 잘 알려져 있는 바와 같이 유/무기 하이브리드 졸-겔 재료는 광 투광성이 우수하고 저온에서의 재료 합성과 저가 공정이 가능하여 광기능성 유기물의 호스트(host) 재료로 많이 연구되고 있다. 본 연구에서는 MTMS(methyltrimethoxysilane)과 TEOS (tetra-ethoxyorthosilicate)를 0-100 mol%로 혼합하고 가수분해하는 방법으로 친수성/친유성 특성을 제어하여, 분산되는 유기물의 사이즈를 조정하였다. 각 실험 조건에 따른 유기물 분산체의 크기를 SEM 및 TEM으로 관찰하였으며, 나노 사이즈로 분산된 유/무기 졸-겔 코팅막의 광학적 특성을 프리즘 커플러를 이용하여 조사하였다.

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Optical Design of the Integrated Triplexer Fabricated by Micro Block Stacking Method (MBS 방법으로 제작한 집적형 Triplexer의 광학 설계)

  • Yoon, Hyun-Jae;Kim, Jong-Hyuk
    • Korean Journal of Optics and Photonics
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    • 제22권4호
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    • pp.191-197
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    • 2011
  • In this paper, we have designed an integrated triplexer which is the basic component for a FTTH(Fiber To The Home) system which can transmit CATV and voice/data at the same time in a single fiber. The integrated triplexer can be fabricated with a novel technique of "Micro-Block Stacking (MBS)" method which automatically aligns the optical components in the optical beam pass using accurate ceramic holders. We analyze the displacement of the optical focus according to the tolerances of the component dimensions and the assembly process using code V simulator. For the transmitter, the most serious shift of the focal points is caused by the displacements of the LD spot. So the focal point moves up to $72{\mu}m$ from the center point for ${\pm}25{\mu}m$, ${\pm}25{\mu}m$, ${\pm}30{\mu}m$ displacements. For the receiver the most serious shift of the focal points is caused by the displacements of a 0.8mm ball lens (for the analog receiving part) and a micro ball lens (for the digital receiving part), and the focal point moves up to $55{\mu}$ for ${\pm}55{\mu}m$, ${\pm}5{\mu}m$, ${\pm}55{\mu}m$ micro ball lens displacements.

Ultimate Heterogeneous Integration Technology for Super-Chip (슈퍼 칩 구현을 위한 헤테로집적화 기술)

  • Lee, Kang-Wook
    • Journal of the Microelectronics and Packaging Society
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    • 제17권4호
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    • pp.1-9
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    • 2010
  • Three-dimensional (3-D) integration is an emerging technology, which vertically stacks and interconnects multiple materials, technologies, and functional components such as processor, memory, sensors, logic, analog, and power ICs into one stacked chip to form highly integrated micro-nano systems. Since CMOS device scaling has stalled, 3D integration technology allows extending Moore's law to ever high density, higher functionality, higher performance, and more diversed materials and devices to be integrated with lower cost. The potential benefits of 3D integration can vary depending on approach; increased multifunctionality, increased performance, increased data bandwidth, reduced power, small form factor, reduced packaging volume, increased yield and reliability, flexible heterogeneous integration, and reduced overall costs. It is expected that the semiconductor industry's paradiam will be shift to a new industry-fusing technology era that will offer tremendous global opportunities for expanded use of 3D based technologies in highly integrated systems. Anticipated applications start with memory, handheld devices, and high-performance computers and extend to high-density multifunctional heterogeneous integration of IT-NT-BT systems. This paper attempts to introduce new 3D integration technologies of the chip self-assembling stacking and 3D heterogeneous opto-electronics integration for realizng the super-chip.

Depth Extraction of Integral Imaging Using Correlation (상관관계를 활용한 집적 영상의 깊이 추출 방법)

  • Kim, Youngjun;Cho, Ki-Ok;Kim, Cheolsu;Cho, Myungjin
    • Journal of the Korea Institute of Information and Communication Engineering
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    • 제20권7호
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    • pp.1369-1375
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    • 2016
  • In this paper, we present a depth extraction method of integral imaging using correlation between elemental images with phase only filter. Integral imaging is a passive three-dimensional (3D) imaging system records ray information of 3D objects through lenslet array by 2D image sensor, and displays 3D images by using the similar lenslet array. 2D images by lenslet array have different perspectives. These images are referred to as elemental images. Since the correlation can be calculated between elemental images, the depth information of 3D objects can be extracted. To obtain high correaltion between elemental images effectively, in this paper, we use phase only filter. Using this high correlation, the corresponding pixels between elemental images can be found so that depth information can be extracted by computational reconstruction technique. In this paper, to prove our method, we carry out optical experiment and calculate Peak Sidelobe Ratio (PSR) as a correlation metric.

Visual quality enhancement of three-dimensional photon-counting integral imaging using background noise removal algorithm (배경 잡음 제거 알고리즘을 적용한 3차원 광자 계수 집적 영상의 화질 향상)

  • Cho, Ki-Ok;Kim, Young jun;Kim, Cheolsu;Cho, Myungjin
    • Journal of the Korea Institute of Information and Communication Engineering
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    • 제20권7호
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    • pp.1376-1382
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    • 2016
  • In this paper, we present a visual quality enhancement technique for conventional three-dimensional (3D) photon counting integral imaging using background noise removal algorithm. Photon counting imaging can detect a few photons from desired objects and visualize them under severely photon-starved conditions such as low light level environment. However, when a lot of photons are generated from background, it is difficult to detect photons from desired objects. Thus, the visual quality of the reconstructed image may be degraded. Therefore, in this paper, we propose a new photon counting imaging method that removes unnecessary background noise and detects photons from only desired objects. In addition, integral imaging can be used to obtain 3D information and visualize the 3D image by statistical estimations such as maximum likelihood estimation. To prove and evaluate our proposed method, we implement the optical experiment and calculate mean square error.

Three-Dimensional Visualization and Recognition of Micro-objects using Photon Counting Integral Imaging Microscopy (광자 계수 집적 영상 현미경을 사용한 마이크로 물체의 3차원 시각화와 인식)

  • Cho, Myungjin;Cho, Giok;Shin, Donghak
    • Journal of the Korea Institute of Information and Communication Engineering
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    • 제19권5호
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    • pp.1207-1212
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    • 2015
  • In this paper, we propose three-dimensional (3D) visualization and recognition techniques of micro-objects under photon-starved conditions using photon counting integral imaging microscopy. To capture high resolution 2D images with different perspectives in the proposed method, we use Synthetic Aperture Integral Imaging (SAII). Poisson distribution which is mathematical model of photon counting imaging system is used to extract photons from the images. To estimate 3D images with 2D photon counting images, the statistical estimation is used. Therefore, 3D images can be obtained and visualized without any damage under photon-starved conditions. In addition, 3D object recognition can be implemented using nonlinear correlation filters. To prove the usefulness of our technique, we implemented the optical experiment.

Plane-based Computational Integral Imaging Reconstruction Method of Three-Dimensional Images based on Round-type Mapping Model (원형 매핑 모델에 기초한 3차원 영상의 평면기반 컴퓨터 집적 영상 재생 방식)

  • Shin, Dong-Hak;Kim, Nam-Woo;Lee, Joon-Jae;Kim, Eun-Soo
    • Journal of the Korea Institute of Information and Communication Engineering
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    • 제11권5호
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    • pp.991-996
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    • 2007
  • Recently, a computational reconstruction method using an integral imaging technique, which is a promise three-dimensional display technique, has been actively researched. This method is that 3-D images can be digitally reconstructed at the required output planes by superposition of all of the inversely enlarged elemental images by using a hypothetical pinhole array model. However, the conventional method mostly yields reconstructed images having a low-resolution, because there are some intensity irregularities with a grid structure at the reconstructed mage plane by using square-type elemental images. In this paper, to overcome this problem, we propose a novel computational integral imaging reconstruction (CIIR) method using round-type mapping model. Proposed CIIR method can overcome problems of non-uniformly reconstructed images caused from the conventional method and improve the resolution of 3-D images. To show the usefulness of the proposed method, both computational experiment and optical experiment are carried out and their results are presented.