• 전기의세계
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• v.37 no.1
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• pp.42-54
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• 1988

본 고에서는 화상표시장치로서의 모든 요건을 대부분 만족시키며 제조공정 등이 비교적 용이하고 평면화상표시장치의 대규모 생산에 알맞는 것으로 알려진 직류형 분말 EL을 이용한 표시장치 기술에 대해 논의한다. 서론에 이어 2장에서는 EL의 동작원리 및 동작특성에 대해 설명하고 3장에서는 투명 전극, EL 분말 처리과정 및 분말의 구리 도금 과정등 직류 EL용 재료의 제조방법 및 특성 등에 대해 기술한다. 4장에서 EL 평판제작 및 발광층 형성 과정에 관해 설명하고 이상의 방법으로 제작된 직류구동형 EL 평판의 열화형태 및 이들의 해결책에 대해 5장에 설명한다. 6장에서는 이들 평판표시장치를 구동하기 위한 주변 전자 회로의 집적화 기술에 대해 설명하며 마지막으로 결론 및 앞으로의 연구방향을 7장에 제시한다.

• Journal of Practical Engineering Education
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• v.16 no.2
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• pp.179-184
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• 2024

Printed circuit boards (PCBs) are a key component widely used in the production of electronic products, and not only quantitative growth but also qualitative developments such as integration cannot be ignored. Wave soldering equipment is commonly used equipment at manufacturing sites, but it is impossible to configure a dedicated equipment environment suitable for each PCB specification during the preliminary research and prototype development stage. It is neither suitable for development within limited time line nor manufacturing various product groups because only equipment setting conditions can be changed within a given time. In this study, we introduce a case of introducing a PCB pallet to enable selection of optimal process conditions within the limited environment described above. In addition, by presenting a discriminant that can determine in advance whether production is possible with current general-purpose equipment, it is expected that problems that may arise due to limitations in the general-purpose wave soldering equipment environment can be identified and resolved in advance. Ultimately, this palette makes it possible to shorten the development period and improve productivity.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.24-24
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• 2009

현재 조선소를 비롯하여 각종 산업 전반적으로 기존의 SCR 용접기를 대체하여 용접품질이 우수한 인버터 용접기가 널리 사용되고 있는 실정이다. 그러나 기존 인버터 용접기의 전원은 Mono 타입으로 이루어져 있어 대용량 인버터 용접기의 경우 대용량 스위칭 소자가 요구되어 제조원가가 높다. 그리고 문제 발생 시 용접기의 사용이 불가능하게 된다. 개발된 단위모듈을 병렬로 연결하여 대용량 용접기를 구성하게 되면 제조원가를 절감할 수 있으며 병렬로 연결되어 단위 모듈에 문제가 발생하여도 계속적인 사용이 가능하고, 주 회로를 작은 용량으로 분산시켜 전력을 제어하므로 높은 에너지 효율을 가지게 된다. 또한 인버터 용접기의 가장 중요한 성능인 스위칭 주파수에 있어서도 기존의 인버터 용접기는 20kHz의 스위칭 주파수를 가지지만 본 기술은 낮은 전력을 병렬로 연결하여 대용량을 동시에 제어가능 하므로 약 70kHz의 고속제어가 가능하다. 본 연구에서는 개발된 용량 170A단위모듈을 병렬로 연결하여 단위모듈 집적형 인버터 아크용접기 510A, 680A급의 부하테스트 실시 및 기본출력특성에 대하여 실험하였으며, GMAW에서 ${\Phi}1.6$ 솔리드 와이어를 이용하여 두께 20t의 후판 맞대기 용접에 적용실험을 실시하였다. 그 결과 모든 전류영역에서의 부하특성 및 출력특성이 양호하게 나타났으며, 후판 맞대기 용접에서는 SAW에 버금가는 생산성과 용접특성을 얻을 수 있었다.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.25 no.5A
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• pp.674-681
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• 2000

We proposed polymer based vertical asymmetric optical coupler. And we optimized the proposed device by coupling characteristic analysis In 1.33um wavelength, TE mode, we obtained very short coupling length(L=277.6um), high coupling efficiency(94%). The merits of proposed device are low propagation loss due to very short full device, low production cost and time, and high integrated fabrication. We will use this to fabricate optical switch, modulator and tunable WDM devices, etc.

• Journal of Digital Contents Society
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• v.5 no.4
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• pp.251-256
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• 2004

The flatness of a silicon wafer concerned with ULSI chip is one of the most critical parameters ensuring high yield of wafers. That is necessary to constitute the circuit with high quality for he surface of silicon wafer, which comes to be base to make the direct circuit of the semiconductor, Flatness, therefore, is the most important factor to guarantee it wafer with high quality. The process of polishing is one of the most crucial production line among 10 processing stages to change the rough surface into the flatnees with best quality. Currently at this process, it is general for an engineer in charge to observe, judge and control the model of wafer from the monitor of measuring equipment with his/her own eyes to enhance the degree of flatness. This, however, is quite a troublesome job for someone has to check of process by one's physical experience. The purpose of this study is to approach the model of wafer with digital contents and to apply the result of the research for an algorithm which enables to control the polishing process by means of measuring the degree of flatness automatically, not by person, but by system. In addition, this paper shows that this algorithm proposed for the whole wafer flatness enables to draw an estimated algorithm which is for the thickness of sites to measure the degree of flatness for each site of wafer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.105-105
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• 2006

IT 산업 및 반도체 산업이 발전함에 따라 초소형, 고집적화 시스템의 요구에 대응하기 위해서 고해상도 및 고정밀의 패턴 구현에 관한 많은 연구가 진행되고 있다. 이러한 연구는 각종 산업제품의 PCB(Printed Circuit Board) 및 디스플레이 장치인 PDP(Plasma Display Panel), LCD(Liquid Crystal Display) 등에 적용되어 널리 응용되고 있다. 현재 널리 사용되는 인쇄 회로 기판은 마스킹 후 선택적 에칭 방식을 적용하여 금속 배선을 형성하는 방식을 적용하고 있다. 이러한 방식은 설계가 변경될 경우 마스크를 다시 제작해야 하는 번거로움이 있어 설계 변경이 용이하지 않고 더욱 길어진 생산시간의 증가로 인하여 생산성 및 집적도가 떨어지게 된다. 따라서 최근에는 이러한 한계를 극복하기 위한 방안이 여러 가지 측면에서 시도되고 있으며, 그 중에서도 Inkjet Printing 기술에 대한 관심이 증가하고 있다. 본 연구에서는 Inkjet Printing 방식을 적용하여 금속 배선을 형성하고 선폭과 두께의 오차를 줄여 배선의 Tolerance 를 개선할 수 있는 방안을 제안하였다. Inkjet Printing 방식을 이용한 기존의 금속 배선 형성은 고해상도의 DPI(Dot Per Inch)에서 잉크 액적이 뭉치는 Bulge 현상이 발생되어 원하는 형상 및 배선의 폭을 구현하는데 어려움이 있었다. Bulge 현상은 배선의 불균일성을 야기할 뿐만 아니라 근접한 배선의 간섭에도 영향을 미처 금속 배선의 기능을 할 수 없는 단점을 발생시킨다. 따라서 본 연구에서는 이러한 Bulge 현상을 줄이고 배선간의 간섭을 방지하여 원하는 배선을 용이하게 형성할 수 있는 순차적 인쇄 방식을 적용하였다. 본 연구에서는 노즐직경 35um 의 Inkjet Head 와 나노 Ag 입자 잉크를 사용하여 Glass 표면 위에 배선을 형성하고 배선의 폭과 두께를 측정하였다. 또한 순차적 인쇄 방식을 적용하여 700DPI 이상의 고해상도에서 나타날 수 있는 Bulge 현상이 감소하였음을 관찰하였으며 금속 배선의 Tolerance를 10%내외로 유지할 수 있음을 확인하였다.

• Journal of Sensor Science and Technology
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• v.10 no.3
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• pp.173-179
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• 2001

The currently used semiconductor pressure sensors are piezoresistive and capacitive type. Especially, semiconductor micro pressure sensors have a great deal of attention because of their small size. However, its fabrication processes are difficult, so that its yield is poor. For the purpose of resolving the drawbacks of the existing silicon pressure sensors, we demonstrate a new type of pressure sensor using PSFET(pressure sensitive field effect transistor) and investigate its operational characteristics. We used PZT(Pb(Zr,Ti)$O_3$) as a pressure sensing material. PZT thin films were deposited on a gate oxide of MOSFET by an rf-magnetron sputtering method. To abtain the stable phase, perovskite structure, furnace annealing technique have been employed in PbO ambient. The sensitivity of the PSFET was 0.38 mV/mmHg.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.2
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• pp.829-834
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• 2011

Exposure process is the most important technology to fabricate highly integrated circuit. Up to now, mask type lithography process has been generally used. However, it is not efficient for small quantity and/or frequently changing products. Therefore, maskless lithography technology is raised in exposure process. In this study, relations between multi-beam energy and overlay were analyzed. Exposure experiment of generating pattern was performed. It was from presented scan line by multi- beam simulation. As a result, optimal scan line distance was proposed by simulation, and micro pattern accuracy could be improved by exposure experiment using laser direct imaging system.

• The Transactions of the Korean Institute of Power Electronics
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• v.14 no.5
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• pp.343-354
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• 2009

In this paper, a magnetic-less dc-dc switching converter realizing an integrable power conversion system is described. Instead of magnetic devices, the inductive impedance range of piezoelectric transducers is utilized to store and resonate the energy for soft-switching. Piezoelectric devices have no windings and deliver the power by the electrodes, which lead to mass product through semiconductor-manufacturing process. This paper presents a resonant-type step-up dc-dc power converter employing a disk-type piezoelectric transducer, analyzing the operation principles and the frequency control characteristics. Also, a topology extension of the single stage converter into cascaded multi-stage is presented and analyzed with the operation principles and control characteristics. For verification of the analysis, a 10W output dc-dc power converter hardware was implemented. The hardware experiments shows a good frequency control and power efficiency greater than 96% in the single stage. A hardware prototype of the extended multi-stage one was also realized and tested. The results shows that the converter has the same frequency control performance and high efficiency such as 93%.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.5
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• pp.17-23
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• 2017

Optical current sensors are suitable for operation in high voltage and high current environments such as power plants due to they are not affected by electromagnetic interference and have excellent insulation characteristics. However, as they operate in a harsh environment such as large temperature fluctuation and mechanical vibration, high reliability of the sensor is required. Therefore, many groups have been working on enhancing the reliability. In this work, an integrated optical current sensor incorporating polarization-rotated reflection interferometer is proposed. By integrating various optical components on a single chip, the sensor exhibits enhanced stability as well as the solution for low-cost optical sensors. Using this, we performed the characterization for the actual field application. By using a large power source, the current of 0.3 kA~36 kA was applied to the photosensor and the linear operation characteristics were observed. The error of the sensor was within $0{\pm}.5%$. Even when operating for a long time, the error range of the sensor was kept within $0{\pm}.5%$. In addition, the measurement of the frequency response over the range of 60 Hz to 10 kHz has confirmed that the 3-dB frequency band of the proposed OCT is well over 10 kHz.