• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Journal of the Korea Society of Computer and Information
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• v.19 no.2
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• pp.109-115
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• 2014

The research on solar energy that we get from nature to cope with energy exhaustion is a very significant and inevitable task for us to do. Along with this, lately, in Korea, as part of new growth engine industry regarding low-carbon green growth, we have selected the LED(Light Emitting Diode) as low power consuming, eco-friendly lighting equipment and have been facilitating research and development on it and creating a variety of new industries utilizing it. What was developed here in this research was the photovoltaic LED lighting system applying lithium polymer batteries equipped with the excellent performance of lithium ion batteries as well as significantly low explosive hazard. Its photovoltaic panel was made to have 100W capacity, and for its power supply system, functional convenience was considered so that it could be equipped with both DC and AC power to be used as household electricity in a variety of ways.

• Journal of the Korean Society for Nondestructive Testing
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• v.30 no.4
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• pp.386-395
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• 2010

The steam generator management program(SGMP) has recently defined the procedures for the qualification of eddy current hardware and technique. These procedures provide two basic methods for qualification. The first way is to qualify the equipment or the probe by using the flaw mechanism and method of the pulled tubes from the heat exchangers or the artificial flawed tubes. The second way is to verify the equivalency with the characteristics of the qualified equipment or probe. In this case, the qualified equipment or probe may be modified to substitute or replace instruments or probes without re-qualification provided that the range of essential variables defined in the examination technique specification sheet are met. This study is to describe the result of the comparative performance evaluation of bobbin coil eddy current probes manufactured by KEPCO Research Institute and probes manufactured by a foreign manufacturer. As a result of this study, although there were minor differences between the two kinds of probes, it was evaluated that the two kinds of probes were almost identical in the significant performance characteristics described in the KEPCO Research Institute guideline.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.79-90
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• 2007

Prototype of $800{\ell}$ vacuum web coater (Vic Mama) consisting of ion source with low energy less than 250 eV for high speed surface modification and 4 magnetron sputter cathodes was designed and constructed. Its performance was evaluated through fabricating the adhesiveless flexible copper clad laminate (FCCL). Pumping speed was monitored in both upper noncoating zone pumped down by 2 turbo pumps with 2000 l/sec pumping speed and lower surface modification and sputter zone vacuumed by turbo pumps with 450 1/sec and 1300 1/sec pumping speed respectively. Ion current density, plasma density, and uniformity of ion beam current were measured using Faraday cup and the distribution of magnetic field and erosion efficiency of sputter target were also investigated. With the irradiation of ion beams on polyimide (Kapton-E, $38{\mu}m$) at different fluences, the change of wetting angle of the deionized water to polyimide surface and those of surface chemical bonding were analyzed by wetting anglometer and x-ray photoelectron spectroscopy. After investigating the deposition rate of Ni-Cr tie layer and Cu layer was investigated with the variations of roll speed and input power to sputter cathode. FCCL fabricated by sputter and electrodeposition method and characterized in terms of the peel strength, thermal and chemical stability.