• Proceedings of the KWS Conference
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• 2001.10a
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• pp.168-170
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• 2001

• Journal of the Microelectronics and Packaging Society
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• v.7 no.2
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• pp.47-53
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• 2000

The fluxless wetting properties of TSM-coated glass substrate were evaluated by the wetting balance method. We could estimate the wettability of the TSM with new parameters obtained from the wetting balance test for one side-coated specimen. It was more effective in wetting to use Cu as a wetting layer and Au as a protection layer than to use Au itself as a wetting layer. The SnSb solder showed better wettability than SnAg, SnBi, and SnIn solders. The contact angle of the one side-coated glass substrate to the Pb-free solders could be calculated from the farce balance equation by measuring the static force and the tilt angle.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.211-214
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• 2007

Sn-0.3Ag-0.7Cu 조성의 젖음 특성과 반응 특성을 Sn-1.0Ag-0.5Cu 및 Sn-3.0Ag-0.5Cu 합금의 결과와 비교, 분석하였다. 또한 Sn-0.3Ag-0.7Cu 조성의 용융 및 응고 특성을 DSC로 측정하고, 인장시험을 통한 stress-strain curve를 관찰하였다. 아울러 할로겐 함유량이 많은 플럭스를 사용하여 Sn-0.3Ag-0.7Cu 조성의 젖음 특성을 향상 시킬 수 있는지를 조사하였으며, Sn-0.3Ag-0.7Cu 조성에 미량의 In을 첨가하여 젖음 특성의 개선 정도를 분석하였다. 그 결과 할로겐 함유량이 높은 플럭스를 사용한 경우보다 미량의 In을 첨가한 경우에서 wettability의 향상을 보다 효과적으로 유도할 수 있음을 관찰할 수 있었다.

• Proceedings of the Korea Water Resources Association Conference
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• 2009.05a
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• pp.895-899
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• 2009

실제 하천에서는 지형적 이산화에 따른 복잡성으로 인해 마름/젖음 현상이 발생하며 그로 인해 작은 수심에서 수치해석의 안정성에 영향을 주어 해석을 불가능하게 한다. 자연수로는 저수시 및 평수시에 물을 소통시키는 주수로부와 홍수시 수위 상승에 따라 주수로부에서부터 범람하게 되는 홍수터로 구성된다. 홍수터는 홍수류의 일시적인 저장이나 하류로 흐름을 전달하는 복합수로의 부분으로 사용된다. 자연수로에서 이와같은 흐름구조는 불규칙한 단면형상, 조도계수 등에 의해서 더욱 복잡하게 나타난다. 본 연구에서는 복잡한 지형과 자연 하천구조에 대한 동역학적인 흐름특성을 해석하고 오염물질의 이송-확산 해석 및 토사이송 해석과 연계하기 위해서 개발된 RAM-2 모형에 동수역학적 해석을 실시하였다. RAM-2 모형에는 대상하도에 대한 마름/젖음의 처리를 위해 흐름의 시간별 수위상승 및 하강 속도를 고려한 Deforming Grid 기법을 적용하였으며, 이에 대한 적용성을 검토하기 위해 마름/젖음 조건을 가지는 실험수로와 홍수터를 가진 사다리꼴 단면 그리고 실제 하도에 대해 적용하여 그 결과를 살펴보았다.

• Journal of Korean Ophthalmic Optics Society
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• v.14 no.2
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• pp.27-30
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• 2009

Purpose: Transmittance at UV-visible spectra range was measured to confirm the effect of wet/dry state of commercially available SCL on human eyes. Method: Commercially available five SCLs fabricated by different materials were selected to measure optical properties according to humidity. Results: A relatively high transmittance above about 80% in the visible spectra range of the SCLs were observed. In the UV spectra range, the wet samples showed higher transmittance than those dried except an unusual case. Conclusions: All the samples having a high optical properties in the visible spectra range exhibit a high transmittance in the UV region. Further research will be needed to develop new materials having a sharp absorption edge in the UV spectra range.

• The Magazine of the Society of Air-Conditioning and Refrigerating Engineers of Korea
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• v.40 no.11
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• pp.18-24
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• 2011

• Polymer(Korea)
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• v.34 no.1
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• pp.52-57
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• 2010

The low viscous epoxy resin(bisphenol F) with carboxylic acid as the reductants was introduced for high performance and reliability in the ACA with a low melting point alloy filler system. The curing characteristics of the epoxy resin and temperature dependant viscosity characteristic of epoxy resin at the melting temperature of LMPA were investigated by dynamic mode of differential scanning calorimetry (DSC) and rheometer, respectively. Based on these thermo-rheological characteristics of epoxy resin and LMPA, the optimum process system was designed. In order to remove the oxide layer on the surface of LMPA particle, three different types of carboxyl acid-based reductant were added to the epoxy resin. The wetting angles were about $18^{\circ}$ for carboxypropyldisilioxane, and $20.3^{\circ}$ for the carboxy-2-methylethylsiloxane, respectively.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.05a
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• pp.189-192
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• 2002

Sn-Cu-Ni계 솔더 합금에 소량의 Bi와 In을 첨가하여 새로운 무연솔더 합금 개발을 진행하였다. Sn-0.7%(Cu+Ni)에 2~5% Bi, 2~10% In을 첨가하여 각각의 열적, 전기적, 기계적 특성을 평가하였다. 솔더합금의 융점은 200~222$^{\circ}C$, 응고온도범위는 20~37$^{\circ}C$로 중.고온계 솔더로서 적용이 가능하다. 실험 조성별 솔더 합금중 실용적, 경제적인 면을 고려하여 Sn-0.7%(Cu+Ni)-3.5%Bi-2%In이 최적의 합금조성으로 판단된다. 이 합금은 융점이 22$0^{\circ}C$정도이며 응고범위는 $25^{\circ}C$, 강도 면에서는 타 합금에 비해 상당히 우수한 값을 나타내었으며 연신율은 비교적 낮은 값을 나타내었다. 다른 기계적, 전기적 특성은 타 솔더 합금과 유사하거나 우수한 편이었으며 젖음특성도 양호하였다.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.51-57
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• 2008

In this paper, wetting and interfacial reaction properties for low Ag containing Sn-Ag-Cu Pb-free solder alloy, i.e., Sn-0.3Ag-0.7Cu were investigated and compared with those of Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu. Melting behavior and stress-strain curves of some Sn-xAg-xCu alloys were also measured using a differential scanning calorimeter(DSC) and a tensile test machine, respectively. In order to enhance insufficient wetting properties of Sn-0.3Ag-0.7Cu alloy, the improvement of wetting properties were analyzed by applying fluxes containing higher content of halide or indium adding of 0.2wt.% into the solder alloy. It was concluded that the small addition of indium is more effective for the improvement of wettability in low temperature range of $230{\sim}240^{\circ}C$ than applying flux containing higher content of halide.

• Journal of Surface Science and Engineering
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• v.35 no.1
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.