• Journal of Welding and Joining
• /
• v.16 no.6
• /
• pp.77-85
• /
• 1998

Effects of non-cleaning and cleaning fluxes on the wetting properties and defects at flow soldered joints were investigated. Non-cleaning flux (R-type of 3.3% solid content) and cleaning flux (RMA-type of 15% solid content) were used. Wetting test was accomplished by wetting balance method with changing surface state of wetting specimen, CU. Sn-37%Pb solder was used for wetting test and flow soldering. As experimental results, the wetting time for vertical force from the surface tension being zero was mainly affected by surface state of the wetting specimen. Non-cleaning flux had a good wettability compared with cleaning flux. In case of non-cleaning flux, conveyor speed had a great affection to defects of bridge, icicle, and poor solder.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.03a
• /
• pp.192-192
• /
• 2003

오염된 폐수를 처리하는 과정으로 다양한 방법이 사용되고 있으나, 담체를 이용하여 미생물을 배양하고, 미생물에 의해 정수하는 방법이 이용되고 있다. 이를 위해서는 미생물을 배양을 위한 담체의 조건으로 다양한 크기의 연속기공을 갖고, 젖음성과 표면거칠기가 높으며, 이들 중 초기 미생물번식의 조건을 제공하는 기체 포집용 미세기공을 보유하고, 미생물이 성장할 수 있는 수백 $\mu\textrm{m}$까지의 다양한 크기의 연속된 기공을 갖는 미생물 담체용 다공성 세라믹스의 제조를 목적으로 본 연구를 행하였다. 본 연구는 다양한 크기의 기공분포를 형성하기 위하여 첨가물로 activated carbon과 무기염, 고분자 binder를 활성알루미나 기지재료에 사용하여 수열반응에 의해 각각의 물질이 형성할 수 있는 기공의 크기를 확인하고, 수 nm에서 수백 $\mu\textrm{m}$까지의 연속된 기공이 존재하는 담체를 제조하였다. 수열조건과 첨가물의 양에 따라 수은침투가압을 이용하여 기공의 크기와 분포를 측정하고 평균기공률을 얻을 수 있었고, 압축강도를 측정하고, 기공의 형상을 주사전자현미경을 통해 확인하였다.

• Journal of Korea Foundry Society
• /
• v.15 no.4
• /
• pp.360-367
• /
• 1995

Effects of metal coating treatment on SiC particle on wetting behavior and interfacial strength were studied. Experimental variables are included types of coated metallic films such as Cu and Ni-P, and temperatures of heat-treatment under vacuum. The experimental results concerning wetting phenomena of liquid Al on SiC, showed that coating treatment of metallic film on SiC particles remarkably improves the wetting behavior of liquid Al on SiC, especially in the case of Ni-P coating. The interfacial strength of Al/SiC composites made of coated SiC plate was higher than that of the composite with non-coated SiC plate although the coating treatment was not perfect.

• Korean Journal of Materials Research
• /
• v.10 no.1
• /
• pp.3-6
• /
• 2000

Liquid-liquid phase separation due to the very different density and composition occurs when the hypermonotectic alloys are solidified on the ground. Besides this, other factors such as preferential wetting and coalescence make it difficult to get uniform microstructures during the directional solidification of hypermonotectic alloys. Therefore a few novel solidification methods to get rid of such a nonuniformity have been reviewed and the recent experimental work using ultrasonic energy in conjunction with directional solidification has been presented. The uniformly solidified structures have been obtained when the ultrasonic of 20kHz applied to transparent organic system, Succinonitrile-Glycerol, varying ultrasonic amplitude and composition etc.

• Proceedings of the KWS Conference
• /
• 2006.10a
• /
• pp.175-177
• /
• 2006

Electrically Conductive Adhesives(ECAs) with solderable particles have been developed as an alternative to Pb-free solders. Our previous study proved that good wettability of solder particle is a prerequisite for the establishment of conduction paths. In this paper, two types of ECAs were formulated and the wetting characteristic low-melting-point Sn-In solder on Cu and Ni/Au pads was investigated. It was found that Sn-In solder in the developed resin material with reduction capability shows good wettability, especially on Cu pad.

• Journal of ILASS-Korea
• /
• v.20 no.3
• /
• pp.181-186
• /
• 2015

This study presents the dynamic wetting characteristics of an impact droplet on hole-patterned textured surfaces. The flat surfaces were manufactured by a drilling machine to generate the micro-order holes, leading to make the surface hydrophobic. Other flat surfaces were fabricated by the anodizing technique to make hydrophilic texture surfaces with a nanometer order. For hydrophilic and hydrophobic textured surfaces with similar texture area fractions, the impinging droplet experiments were conducted and compared with flat surface cases. As results, an anodized textured surface decreases apparent equilibrium contact angle and increases contact diameters, because of increase in contact area and surface energy. This is attributed to more penetration inside holes from larger capillary pressure on nanometer-order holes. On the other hand, temporal evolution of the contact diameter is smaller for the hydrophobic textured surface from less penetration on the micro-order holes.

• Proceedings of the KAIS Fall Conference
• /
• 2008.11a
• /
• pp.368-370
• /
• 2008

대한민국 대표 축제로 자리 잡은 보령머드축제의 핵심 프로그램인 머드 셀프마사지 행사의 재미와 다양성을 부여하기 위하여, 색상이 함유된 머드에 관한 연구를 수행하였다. 머드 고유의 낮은 명도를 조절하고자 이산화티탄을 첨가하여 머드의 질감을 유지하면서 색상이 발현되는 이산화티탄의 함량을 실험하고, 결정된 혼합비율에 황색산화철을 첨가하여 색상의 발현도를 색차계, 육안검사, 사용감 등으로 판단하였다. 결정된 색상은 물에 젖음 시 발색정도와 세척상태를 검토하여 보령머드 축제 프로그램인 머드 셀프마사지 행사에 사용하여 축제의 다양성을 높이고 또한 한국의 고유색인 오방색을 나타낼 수 있는 유색머드를 개발하고자 하였다.

• Journal of the Korean Ceramic Society
• /
• v.37 no.12
• /
• pp.1172-1177
• /
• 2000

최근 콘크리트 보호 재료는 코팅을 이용하는 과거의 방법에서 함침을 이용하는 기법으로 전환하였다. 이중 발수제는 콘크리트의 표면의 특성을 변화시키는 것으로 친수성의 콘크리트를 소수성 물질을 결합시켜 물에 의한 젖음을 방어하는 것으로 콘크리트에 사용하였을 경우 콘크리트의 고유한 표면 장력을 작게 변화시키고 장력이 큰 물질 중의 하나인 물의 흡수를 방어하게 한다. 본 실험은 발수제의 성능 평가를 위하여 다공질의 재료인 콘크리트의 접촉각을 측정하여 그 변화를 관찰하였으며, 발수제들의 우수한 기능 중의 하나인 통기성을 시편의 중량 감소로 측정하였다. 발수제로 n-octyl ethoxy silane을 사용한 콘크리트 시편의 흡수 능력은 사용하지 않은 것의 약 10% 정도로 측정되었으며 시편의 수분 중량 감소는 7일 동안 90~130%로 관찰되어 통기성이 유지되어 콘크리트의 강도 유지에 효과적임을 알 수 있었다. 또한 겉보기 접촉각은 처리하지 않은 시편에서 24~33$^{\circ}$로 측정되었으나 처리된 시편의 최초면에서 130~141$^{\circ}$이었으며 2mm의 연마면에서는 127~132$^{\circ}$로 측정되어 콘크리트 표면 장력 변화가 유지되고 있음을 알 수 있었다.

• Journal of Welding and Joining
• /
• v.20 no.5
• /
• pp.106-112
• /
• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• Journal of Welding and Joining
• /
• v.18 no.6
• /
• pp.74-82
• /
• 2000

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.