• Journal of the Microelectronics and Packaging Society
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• v.8 no.1
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• pp.45-51
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• 2001

The effects of wettability and surface oxidation on the low temperature and ultra-fine solder bump formation have been studied. Difference sequences of near eutectic In-Ag and eutectic Bi-Sn solders were evaporated on Au/Cu/Cr or Au/Ni/Ti Under Bump Metallurgy (UBM) pads. Solder bumps were formed using lift-off method and were reflowed in Rapid Thermal Annealing (RTA) system. The solder bumps in which In was in contact with UBM in In-Ag solder and the solder bumps in which Sn was in contact with UBM in Bi-Sn solder showed better bump formability during reflow than other solder bumps. The ability to form spherical solder bumps was affected mainly by the wettability of solders to UBM pads.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.4
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• pp.7-15
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• 2000

The purpose of this work is to evaluate the solderahility and characteristics of solder joints. Bridge defect of solder joint was examined in natural atmosphere and $N_2$ condition. Consequently, wettability was excellent for each of Sn-Pb plated Cu specimen, Sn plated Cu specimen, and Cu polished in $N_2$ condition. The wetting time in $N_2$ condition was shorter than that of natural atmosphere condition, showing the decreasing values of about 0.2~0.45 seconds. The max. wetting force under the $N_2$ condition was more increasing that of natural atmosphere condition, showing the increasing values of about 1.8~2.8 N. With the result of wetting balance test, the wetting time ($t_2$) and wetting farce according to increasing amount of $N_2$ from 10 1/min to 30 1/min, the wetting time ($t_2$) was reduced about 0.25 second and wetting force was increased about 2.3 N. In non-cleaning flux, when $N_2$ gas is applied, it is compensated to decrease of wettability. In the case of using the $N_2$ gas, the wettability was improved. The reason for improving wettability is due to preventing the formation of dross. The generation rate of bridge in $N_2$ condition decreased than that of natural atmosphere, and when the specimen had a fine pitch, the rate of bridge defects was considerably decreased in $N_2$ condition, showing the decreasing rate of 25~75%.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.43-47
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• 2001

Sn-3Ag-8Bi-5In was developed for the intermediate melting point solder. Although In-contained solder is expensive, its melting point is lower than these of Sn-Ag-Cu alloys. Sn-3Ag-8Bi-5In solder used for this research has a melting range of 188~$204^{\circ}C$. On this study wetting characteristics of Sn-3Ag-8Bi-5In were evaluated in order to investigate its availability as a Pb-free solder. Wettabilities of Sn-37Pb and Sn-3.5Ag solders were also studied to compare these of the Sn-3Ag-8Bi-5In. Experimental results showed that the zero-cross-time and wetting time at $240^{\circ}C$ for the Sn-3Ag-8Bi-5In were 1.1 and 2.2 second respectively. These values are a little better than these of Sn-37Pb and Sn-3.5Ag solders. The equilibrium wetting farce of the Sn-3Ag-8Bi-5In was 5.8 mN at $240^{\circ}C$, and it was tuned out to be a little higher than that of Sn-3.5Ag and lower than that of Sn-37Pb.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.215-215
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• 2015

Ag-Cu 공정 합금을 이용한 스테인리스 강의 brazing 거동에 미치는 산소의 영향을 조사하고 최적 brazing 조건을 도출하기 위하여 304L 스테인리스 강에 대한 다양한 산소농도의 Ag-Cu 공정 합금의 젖음성을 실험적으로 측정하였다. 0.02~0.07wt%의 범위에 해당하는 산소를 함유하였을 때 양호한 젖음 특성을 나타내었고, sandwich brazing 테스트를 통하여 유사한 조건에서 건전한 접합면을 얻을 수 있었다.

• Polymer(Korea)
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• v.29 no.6
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• pp.581-587
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• 2005

Commercial polyurethane film (PU) was modified with Ar plasma ionized in dielectric barrier discharge (DBD) plate-type reactor under atmospheric pressure. We measured the change of the contact angle and the surface fee energy with respect to the plasma treatment conditions such as treatment time, RF-power, and Ar gas flow rate. We also optimized the plasma treatment conditions to maximize the surface peroxide concentration. At the plasma treatment time of 70 sec, the power of 120 W and the Ar gas flow rate of 5 liter per minute (LPM), the best wettability and the highest surface fee energy were obtained. The 1,1 diphenyl-2-picrylhydrazyl (DPPH) method confirmed that the surface peroxide concentration was about 2.1 nmol/$\cm^{2}$ at 80 W, 30 sec, 6 LPM.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.40 no.10
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• pp.659-666
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• 2016

A numerical study, using the molecular dynamics simulation method, was carried out to investigate the wetting characteristics of water droplets on a solid square pillar surface with variable periodic edge length patterns at the nanoscale. In this study, the pillar plane was supposed to be rectangular or square shaped. In addition, the surface area was increased while the shape of the pillar plane was kept fixed. In the case of the square pillar, the edge length increased from $4.24{\AA}$ to $12.72{\AA}$. Also, the rectangular pillar had two types of length edges. In this case, one edge length was fixed at $8.48{\AA}$ and the other edge length was increased from $4.24{\AA}$ to $12.72{\AA}$. Through these length changes, the hydrophobicity and hydrophilicity of a water droplet on the variable pillar surfaces were analyzed.

• Elastomers and Composites
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• v.44 no.2
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• pp.175-181
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• 2009

The solution polymerization was conducted to synthesize pressure sensitive adhesive for polarizer film using acrylic monomers. 2-Ethylhexyl acrylate, butyl acrylate, acrylic acid were used as acrylic monomers, benzoyl peroxide as initiator, ethyl acetate as solvent. The ratio of monomers was 2-ethylhexyl acrylate: butyl acrylate: acrylic acid = 25:50:3.6 reflecting $-40^{\circ}C$ of glass transition temperature in the pressure sensitive adhesive. The amount of initiator was determined as 0.09% to monomer considering wetting power and initial tackiness. The ratio of monomer to solvent was determined as 1:1.7 considering wetting power and transmissivity. The transmissivity of pressure sensitive adhesive increased with decreasing both viscosity and molecular weight due to reducing of refractive index by low entanglement between molecules. In the measurement of pot life, it was found that the storage stability was good at 1:1.7 of monomer: solvent without large change of viscosity during 200 min.

• Proceedings of the Korea Water Resources Association Conference
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• 2020.06a
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• pp.299-299
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• 2020

국내외 발생하는 재난 중 70% 이상이 물과 관련된 재해로 분류되며, 집중호우와 태풍으로 인한 하천범람 및 내수침수 등으로 많은 피해를 발생시키고 있다. 특히 최근 발생하는 피해 양상은 과거에 발생하지 않았던 극한 강우로 인해 돌발적으로 발생하는 경우가 빈번하게 발생하고 있어 이에 따라 사전에 예측하여 미리 대비하는 선제적인 홍수 대비 시스템이 요구되고 있다. 선제적인 홍수 대비 시스템의 구축 여부는 정확한 하천 흐름 예측을 필요로 한다. 하지만 하천의 흐름은 댐붕괴, 제방붕괴, 하천 하상의 변동 등 다양한 상황에서 급격한 흐름의 변동이 발생하며, 이는 하천 흐름 예측에 장애물로 작용하여 정확도를 떨어뜨리는 요인이 된다. 특히 국내에는 산악지형과 수공구조물에 의한 불연속 단면이 다수 존재하고 있어 그 예측 결과에 대한 정확성에 대한 요구가 더욱 부각되고 있다. 그렇기 때문에 해당 문제를 해결하기 위한 다양한 기법들이 개발되어 실무에 적용되고 있으나 어떤 기법이 국내 하천특성에 적합한지 파악할 수 없으며, 그 정확성과 안정성에 측면에서 여전히 많은 문제점을 가지고 있는 실정이다. 본 연구에서는 불연속 흐름이 빈번하게 발생하는 국내 하천 특성에 적합한 수치 기법을 확인하고자 유량보존특성을 만족하는 유한체적기법 중 국내외적으로 다수 사용되었던 기법들을 비교 및 평가하였다. 불연속 흐름의 대표적인 예제로서 'Dam-break problem'과 충격파 해석 및 홍수기와 갈수기에 따른 하천 하상의 마름/젖음에 대한 평가를 할 수 있는 Toro's Riemann problems에 적용하여 비교하였으며 그 결과 값을 정량적인 수치로 나타내었다. 이를 통해 국내 하천 특성에 적합한 수치 기법을 선정하였으며. 향후 국내하천 환경을 만족할 뿐만 아니라 하천 종사자들의 요구에도 부합한 하천흐름해석 모형의 개발 시 많은 기여가 될 것이라 판단된다.

• Journal of the Korean Ceramic Society
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• v.38 no.7
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• pp.608-614
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• 2001

수지결합질 탄소재의 사출성형시 중요한 요소는 열유변학적 거동이다. 수지결합질 탄소재의 열유변성, 기계적 물성은 충진제(흑연)의 표면상태에 영향을 받는다. Coupling 처리에 의한 충진제의 표면개질은 binder와의 젖음성과 호환성 등에 영향을 미쳐 수지결합질 탄소재의 특성을 향상시킨다. 본 연구에서는 충진제의 표면개질을 위해 실란 coupling 처리하였다. 충진제의 표면에 코팅된 실라놀은 FT-IR과 침수거동 관찰결과 충진제 표면에 단층으로 코팅되었음을 보였다. Coupling 처리는 충진제 표면에 활성을 가함으로써 수지결합질 탄소재의 열유변학적 거동과 기계적 물성에 기여하였다.

• Journal of the Korean Ceramic Society
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• v.32 no.4
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• pp.405-412
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• 1995

In order to estimate the wettability of the borosilicate glasses with different composition on the noble metals of gold and silver, the measurements of the contact angle between the solid and the liquid were made at various temperatures and holding times using the sessil-drop method. The wetting behavior and the adhesion of the phases were strongly influenced by the thermal or the physical characteristics of the materials. The dependence of wetting angle ($\theta$) on the holding time (t) could be represented by the relation of $\theta$=a.tb, whereby the wettability of the systems was quantitatively compared. Also with increasing content of borosilicate glass in the glass-gold matrix composite, the tensile strength was decreased whereas the elastic modulus was increased.