• Journal of the Korean Society for Precision Engineering
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• v.22 no.7 s.172
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• pp.19-26
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• 2005

The objective of this study is to investigate the influence of process parameters, such as power of laser, cutting speed of laser and material thickness, on the practical cutting region and the kerfwidth fer the case of cutting of CSP IN sheet using high power Nd:YAC laser in continuous wave(CW) mode. In order to obtain the practical cutting region and the relationship between process parameters on the kerfwidth, several laser cutting experiments are carried out. The effective heat input is introduced to consider the influence of power and cutting speed of laser on the kerfwidth together. From the results of experiments, the allowable cutting region and the relationship between the effective heat input and kerfwidth fur the case of cutting of CSP 1N sheet using high power CW Nd:YAG laser have been obtained to improve the dimensionalaccuracyofthecutarea.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2000.11a
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• pp.639-642
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• 2000

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.19-20
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• 2007

• Journal of the Korean Society for Precision Engineering
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• v.13 no.6
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• pp.145-151
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• 1996

In sawing operation of cubic zirconia, the performance of diamond cutter blade is very dependent on the blade variables. This investigation presents experimental results which show the effects of the blade variables such as concentration, grain size of diamond, types of diamond abrasives, and bond materials on the behavior of the blades. Based on the experimental results an optimum blade condition for the sawing of cubic zirconia was recommended.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.7
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• pp.27-35
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• 2000

재료가공분야에의 레이저의 적용은 1960년대 후반부터 시작되었으며, 고출력 CO$_2$ 와 Nd:YAG 레이저가 많은 산업분야에서 보편화될 정도로 발전하여 왔다. 재료가공에서의 레이저의 적용분야는 금속의 절단, 용접 및 드릴링, 세라익의 스크라이빙, 플라스틱과 복합재의 절단 및 여러 가지 재료의 마킹 등을 포함한다. 이와 같은 모든 응용에서 공통적인 것이 레이저 조사에 의해 재료를 용융, 증발시키는 열적 메카니즘이다.(중략)

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.04b
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• pp.69-74
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• 1995

A theoretical analysis is presented on the mechanics of diamond blade sawing. Experimental results are also presented, which show the effects of cutting variables such as cutting speed, feed speed, cutting area, and concentration of deamond blade on the cutting forces. The analytical results aggreed well with experimental ones.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.286-286
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• 2004

초고속 정보통신망 구현에 필수적인 광학 연결용 부품인 광 Ferrule은 광섬유 커넥터의 중요부품으로서 우수한 치수정밀도와 내마모성을 갖추어야 한다. 현재, Ferrule로 사용되는 재료는 지르코니아, 알루미나 등 세라믹 물질이 많이 사용되고 있으며 기계적 강도나 내마모성 면에서는 우수하지만, 피연마속도가 석영섬유에 비해 현저히 작아서 특수한 연마방법을 채택해야 하며 성형성이나 가공성이 나빠 생산효율이 낮고 비용이 비싸다는 단점을 가지고 있다.(중략)

• Journal of the Korea Academia-Industrial cooperation Society
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• v.4 no.1
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• pp.1-6
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• 2003

A novel Solid Freeform Fabrication System, which makes prototype by cutting tapes at the boundary of object and accumulating the tapes, has been developed. In order to overcome the staircase shape at the surface of prototype, the laser beam is irradiated tangent to the surface. Five axis cutting system and the tangent cutting trajectory generation algorithm have been developed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1820-1823
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• 2003

A high speed feeding type laser cutting M/C is developed for precise cutting of sheet metal. This paper has been carried out to obtain cutting characteristics and optimal cutting conditions of the developed high speed feeding type laser cutting M/C by a design of experiments. Cutting speed. laser power. laser duty and gas pressure are control factors for the surface roughness. The major factors affecting the surface roughness and the optimum cutting conditions are studied with minimum experiments using Taguchi method.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 1999.10a
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• pp.502-506
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• 1999

Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, so it is important to control the chipping generation in the process of dicing. This paper deals with chipping of the silicon wafer dicing. The relationships between the dicing force and the wafer chipping are investigated. It is confirmed that the wafer chipping increases as the dicing force increases.