• 제목/요약/키워드: 정밀 비전

검색결과 222건 처리시간 0.025초

다자유도 구동스테이지와 비전시스템을 이용한 플립칩 본더 개발 (Development of the Flip-Chip Bonder using multi-DOF Motion Stage and Vision System)

  • 황달연;전승진;김기범
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2003년도 춘계학술대회 논문집
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    • pp.1717-1722
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    • 2003
  • In this paper we developed flip-chip bonder using XY stage, liner-rotary actuator and vision system. We depicted the major parts of the developed flip-chip bonder. Then we discussed several problems and their solutions such as vision and motion control, pick-up module position accuracy, separation of chip from the blue taped hoop, etc. We used a post guide to improve the horizontal positional accuracy against the long arm. Also, we used an ejector module and synchronization technique for easy chip separation from the blue tape.

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비전 시스템을 이용한 실시간 섬유결점 검사기 개발 (Development of Real-Time Vision-Based Fabric Inspection System)

  • 조지승;정병묵;박무진
    • 한국정밀공학회지
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    • 제20권9호
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    • pp.92-99
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    • 2003
  • Quality inspection of textile products is an important problem for fabric manufacturers. This paper presents an automatic vision-based system for quality control of web textile fabrics. Typical web material is 1-3m wide and is driven with speeds ranging from 20m/min to 200m/min. At the present, the quality assessment procedures are performed manually by expert. But worker can not detect more than 60% of the present defect and inspect the fabric if moving faster than 30m/min. To increase the overall quality and homogeneity of textile, an automated visual inspection system is needed fur the productivity. However, the existing inspection system are too expensive to purchase for small companies. In this paper, the proposed PC based real-time inspection algorithm gives low cost textile inspection system, high detection rate with good accuracy and low rate of false alarms. The method shows good results in the detection of several types of fabric defects.

경사절삭 모델에 의한 상향 엔드밀링절삭 해석 (Analysis of the Up End Milling Process by Transforming to the Equivalent Oblique Cutting Model)

  • 이영문;송태성;심보경
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.902-906
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    • 2000
  • In end milling process the undeformed chip thickness and the cutting force components vary periodically with phase change of the tool. In this study, up end milling process is transformed to the equivalent oblique cutting. The varying undeformed chip thickness and the cutting force components in end milling process are replaced with the equivalent average ones. Then it can be possible to analyze the chip-tool friction and shear process in the shear plane of the end milling process by the equivalent oblique cutting model. According to this analysis, when cutting SM45C steel. 82% of the total energy is consumed in the shear process and the balance is consumed in the friction process.

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비전을 이용한 자동차 Support Hinge의 너트용접 검사 시스템 개발 (Development of Inspection System of Welded Nuts on Support Hinge using Machine Vision)

  • 김성민;이영춘;이성철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.307-308
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    • 2006
  • This paper is about the development of automatic inspection system of welded nuts on Support hinge using machine vision for the improvement of working condition. Until now, projection welding process was performed by operator. Also, inspection of welded nuts is performed manually and recorded by the operator's naked eye. So these processes caused the produce of poorly-made articles. To improve this manual operation, inspection system using machine vision is introduced. Test algorithm, lighting system and program showed good results to the designed inspection system and led to the increment of productivity.

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3차원 절삭시 칩-공구 마찰 및 전단 특성 해석 (Analysis of Chip-Tool Friction and Shear Characteristics in 3-D Cutting Process)

  • 이영문;최원식;송태성;박태준;장은실
    • 한국정밀공학회지
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    • 제16권6호
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    • pp.190-196
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    • 1999
  • In this study, a procedure for analyzing chip-tool friction and shear processes in 3-D cutting with a single point tool has been established. The edge of a single point tool including circular nose is modified to the equivalent straight edge, then 3-D cutting with a single point tool is reduced to equivalent oblique cutting. Transforming the conventional coordinate systems and using the measured three component of cutting forces, force components on the rake face and the shear plane of the equivalent oblique cutting system can be obtained. And it can be possible to assess the chip-tool friction and shear characteristics in 3-D cutting with a single point tool.

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Vision을 이용한 MLGA Chip 장착시스템 개발 (Vision based MLGA Chip Mounting System)

  • 노병옥;유영기;김안식;김영수
    • 한국정밀공학회지
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    • 제18권11호
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    • pp.161-167
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    • 2001
  • In this study, the control of mounting system for MLGA package was developed using machine vision for the control of rotation position compensation and mounting position of X-Y table. Two types of materials, polymer and alumina, were used for the dielectric insulator of the MLGA. The illumination system and the algorithm of position compensation which is suitable for these materials was developed. We found that the mounting accuracy enough to the degree of${\pm}10{\mu}m$ when MLGA was mounted on the PCB.

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시각측정시스템의 캘리브레이션 및 측정성능 검토 (Calibration and INvestigation into Measurement Performance of a Visual Sensing System)

  • 김진영;조형석
    • 한국정밀공학회지
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    • 제16권8호
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    • pp.113-121
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    • 1999
  • It is necessary to calibrate measurement systems to enhance its measurement accuracy. The visual sensing system that is presented in our previous work has to be calibrated, too. It is a multiple mirror system for three-dimensional measurement, which is composed of a camera and a series of mirrors. It is important to calibrate the positions and orientations of the mirrors relative to the camera because they have direct influence on the relationship between the image plane and the task space. This paper presents the calibration method for the visual sensing system. To confirm the measurement performance of the implemented system. its measurement accuracy in measuring the locations in three-dimensional space is investigated. A series of experiments for measuring the locations of the circle-shaped marks are performed. Experimental results show that the sensing system can be effectively used for three-dimensional measurement.

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반도체 절단 공정의 웨이퍼 자동 정렬에 관한 연구 (A study on the automatic wafer alignment in semiconductor dicing)

  • 김형태;송창섭;양해정
    • 한국정밀공학회지
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    • 제20권12호
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    • pp.105-114
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    • 2003
  • In this study, a dicing machine with vision system was built and an algorithm for automatic alignment was developed for dual camera system. The system had a macro and a micro inspection tool. The algorithm was formulated from geometric relations. When a wafer was put on the cutting stage within certain range, it was inspected by vision system and compared with a standard pattern. The difference between the patterns was analyzed and evaluated. Then, the stage was moved by x, y, $\theta$ axes to compensate these differences. The amount of compensation was calculated from the result of the vision inspection through the automatic alignment algorithm. The stage was moved to the compensated position and was inspected by vision for checking its result again. Accuracy and validity of the algorithm was discussed from these data.

멀티 라인 레이저 비전 센서를 이용한 고속 용접선 추적 기술 (High speed seam tracking using multi-line laser vision sensor)

  • 성기은;이세헌
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.584-587
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    • 2002
  • A vision sensor measure range data using laser light source. This sensor generally use patterned laser which shaped single line. But this vision sensor cannot satisfy new trend which needs laster and more precise processing. The sensor's sampling rate increases as reduced image processing time. However, the sampling rate can not over 30fps, because a camera has mechanical sampling limit. If we use multi line laser pattern, we will measure multi range data in one image. In the case of using same sampling rate camera, number of 2D range data profile in one second is directly proportional to laser line's number. For example, the vision sensor using 5 laser lines can sample 150 profiles per second in best condition.

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신발 러핑 경로 생성을 위한 3차원 스캐너 개발에 관한 연구 (A Study on the Development of the 3-D Seamier for Shoe Roughing)

  • 강동배;손성민;김화영;안중환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2002년도 추계학술대회 논문집
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    • pp.396-399
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    • 2002
  • A roughing process is the one of most important shoe manufacturing processes. Especially, it is indispensable to manufacture the leather shoes such as dress shoes, safety shoes, golf shoes, etc. The roughing process relies greatly on the operator's skill and experience. Therefore, the automation of roughing process is necessary to establish the improvement of productivity. We are trying to develop the Automatic Roughing Machine controlled by NC. As pre-study to do this, we need to measure the roughing path for NC, because there is no study on this pan and no reference about this. In this study, we proposed the 3-Dimensional Scanner System to measure the roughing path with new concept. The developed 3-D scanner System generates the roughing path using the 3 images obtained from 3 CCD cameras. The experimental results show that the proposed system can measure accurately the roughing path.

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