• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.11 no.1
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• pp.12-19
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• 2015

As a measure of improving the mechanical properties of a diffusion bonded joint of a ferritic/martensitic steel (FMS), the post-bonding heat treatment (PBHT) is applied. In the temperature range of normalizing condition ($950-1,050^{\circ}C$), diffusion bonding is employed with compressive stress (6 MPa). Due to the martensite structure distributed in the matrix, Vicker's hardness values of the as-bonded are much higher than those of the as-received. Through the PBHT for 1 h at $720^{\circ}C$, hardness values are recovered to as low as those of the as-received condition. Also, tensile properties of PBHT are similar to those of the as-received at up to the test temperature of $550^{\circ}C$, when the diffusion bonding is carried out over $1,000^{\circ}C$. Based on the creep-rupture testing performed at $650^{\circ}C$ in air environment, the joint efficiency of the PBHTed specimens is about 80% in, which is higher than that of the as-bonded specimens.

• Journal of Korean Society of Steel Construction
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• v.12 no.2 s.45
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• pp.143-150
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• 2000

Depending upon the combination of tolerances specified in the standards on bolt, nut and washer for high tension bolt sets, there arises center-to-center deviation between bolt and washer. This deviation nay cause loss of effective contact area between nut- and washer-faces, which leads to some dispersion of the torque coefficient K. By adapting circular arc surface instead of flat surface for the nut, it is shown through numerical analyses that the dispersion of the torque coefficient can be minimized. In this way, optimum radius of curvature of the nut bearing surface is proposed.

• Proceedings of the KWS Conference
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• 2001.05a
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• pp.228-231
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• 2001

Elastic-plastic fracture toughness $J_{1c}$ can be used as an effective design criterion in elastic plastic fracture mechanics. Most of these systems are operated at high temperature and $J_{1c}$ values are affected by temperature. therefore, the $J_{1c}$ valuse at high temperature must be determined for use of integrity evaluation and designing of such systems. Elastic-plastic fracture toughness $J_{1c}$ tests were performed on SA516 carbon steel plate and test results were analyzed according to ASTM E 813-8, ASTM 1813-89. Safety and integrity are required for reactor pressure vessels vecause pthey are operated in high temperature. there are single specimen method, which used as evaluation of safety and integrity for reactor pressure vessels. In this study, elastic-plastic fracture toughness$(J_{1c})$ and $J-\Delta{a}$ of SA 516/70 steel used as reactor pressure vessel steel are measured and evaluated at room Temperature, $150^{\circ}C$, $250^{\circ}C$ and $370^{\circ}C$ according to unloading compliance method.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.63-67
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• 2011

We investigated effects of bonding conditions on the peel strength of rigid printed circuit board (RPCB)/ flexible printed circuit board (FPCB) joints bonded using a thermo-compression bond method, The electrodes on the FPCB were coated with Sn by a dipping process. We confirmed that the bonding temperature and bonding time strongly affected the bonding configuration and strength of the joints. Also, the peel strength is affected by dipping conditions; the optimum dipping condition was found to be temperature of $270^{\circ}C$ and time of 1s. The bonding strength linearly increased with increasing bonding temperature and time until $280^{\circ}C$ and 10s. The fracture energy calculated from the F-x (Forcedisplacement) curve during a peel test was the highest at bonding temperature of $280^{\circ}C$.

• Journal of the Korean Society of Radiology
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• v.8 no.7
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• pp.371-376
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• 2014

The process of flip-chip bump bonding, Au wire bonding and encapsulation were sucessfully developed and modularized. The CdTe sensor and ROIC were optimally jointed together at $150^{\circ}C$ and $270^{\circ}C$ respectively under24.5 N for 30s. To make SnAg bump on ROIC easy to be bonded, the higher bonding temperature was established than CdTe sensor's. In addition, the bonding pressure was lowered minimally because CdTe Sensor is easier to break than Si Sensor. CdTe multi-energy sensor module observed were no electrical failures in the joints using developed flip chip bump bonding and Au wire bonding process. As a result of measurement, shearing force was $2.45kgf/mm^2$ and, it is enough bonding force against threshold force, $2kgf/mm^2s$.

• Korean Journal of Materials Research
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• v.5 no.6
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• pp.743-747
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• 1995

The relationship between the variation of crystallinity and the resultant self-bonding strength of PEEK was examined by using DSC in conjunction with the shear test. DSC measurement of the crystallinity produced at different bonding conditions demonstrated that even though PEEK specimens contain the same amount of crystallinity, the resultant self-bonding strength is sensitively dependent on bonding history. It also showed that all crystallization during the bending process occurs only in the healing and annealing stage and no additional crystallization occurs in the cooling stage.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.36 no.7
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• pp.697-703
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• 2012

In this study, duodenogastric reflux has been investigated according to pyloroplasty and the path of the gastric tube in esophageal reconstruction. The paths of the gastric graft (front and rear paths) were determined from the CT images of ten patients, and the gastric tube model was constructed using an RP technique. The gastric tubes were connected to the pylorus models with and without pyloroplasty. Various distal pressures and pulse widths were applied, and the volume and maximum height of the refluxate were measured. The results show that the volume and height of the refluxate increase with the distal pressure, and the front path leads to a smaller volume and lesser height of the refluxate than the rear path if pyloroplasty is conduced. The volume of the refluxate is markedly increased by a larger pulse width, but its effect on the maximum height depends on whether pyloroplasty is conducted.

• Journal of Chest Surgery
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• v.34 no.10
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• pp.763-768
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• 2001

Background: The high pressure zone(HPZ) at the gastroesophageal junction is an important barrier for prevention of gastroesophageal reflux. Smooth muscle layers in the lower esophageal sphincter mainly contributes to HPZ at the throacoabdominal junction. The purpose of this study was to investigate the manometric characteristics of the thora-coabdominal junction in patients after surgical removal of the lower esophageal sphincter. Material and Method: Twenty two patients with prior esophagogastrectomy(10 Ivor-Lewis method and 12 left thoracotomy) and 30 normal adults(control group) were studied manometrically. Result: Esophageal manometry showed a HPZ and pressure inversion points distal to the anastomosis in 12 of 22 patients(2 of 10 patients with Ivor-Lewis method and 10 of 12 patients with left thoracotomy) and a HPZ in 30 of 30 normal adults. The location of HPZ front nostril was not significant different between the two groups(42.5$\pm$0.9cm in patients and 43.9$\pm$2.1cm in the control), while the length of HPZ was shorter in patients than in the control(2.13$\pm$0.6cm vs 2.83$\pm$0.59cm). By SPT and RPT, pressures of HPZ at rest were lower in patients(13.78$\pm$1.63mmHg, 28.58$\pm$6.06mmHg) than in control(20.3$\pm$4.95mmHg, 42.80$\pm$15.91mmHg). The HPZ relaxed partially in response to deglutition(84.4% in patient, 90.5% in control group) and contracted in response to increased intra- abdominal pressure induced by leg lifts(HPZ/ Intra-abdominal pressure= 1.81$\pm$0.23 in patient, 2.13$\pm$ 0.58 in control group).

• Journal of Sensor Science and Technology
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• v.1 no.2
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• pp.131-145
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• 1992

This paper has been described a process technology for the fabrication of Si-on-insulator(SOI) transducers and circuits. The technology utilizes Si-wafer direct bonding(SDB) and mechanical-chemical(M-C) local polishing to create a SOI structure with a high-qualify, uniformly thin layer of single-crystal Si. The electrical and piezoresistive properties of the resultant thin SOI films have been investigated by SOI MOSFET's and cantilever beams, and confirmed comparable to those of bulk Si. Two kinds of pressure transducers using a SOI structure have been proposed. The shifts in sensitivity and offset voltage of the implemented pressure transducers using interfacial $SiO_{2}$ films as the dielectrical isolation layer of piezoresistors were less than -0.2% and +0.15%, respectively, in the temperature range from $-20^{\circ}C$ to $+350^{\circ}C$. In the case of pressure transducers using interfacial $SiO_{2}$ films as an etch-stop layer during the fabrication of thin Si membranes, the pressure sensitivity variation can be controlled to within a standard deviation of ${\pm}2.3%$ from wafer to wafer. From these results, the developed SDB process and the resultant SOI films will offer significant advantages in the fabrication of integrated microtransducers and circuits.

• Journal of Practical Engineering Education
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• v.6 no.2
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• pp.105-110
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• 2014

In this work, mechanical characteristics of titanium diaphragm have been studied as a potential robust substrate and a diaphragm material for automotive tire pressure sensor. Lamination process techniques combined with traditional micromachining processes have been adopted as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on titanium diaphragm have been designed, fabricated and characterized. The fabrication process for micromachined titanium devices keeps the membrane and substrate being at the environment of 20 MPa pressure and $200^{\circ}C$ for a half hour and then subsequently cooled to $24^{\circ}C$. Each sensor uses a stainless steel substrate, a laminated titanium film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The finite element method is adopted to investigate residual stresses formed in the process. Besides, out-of-plane deflections are calculated under pressures on the diaphragm. The sensitivity of the fabricated device is $9.45ppm\;kPa^{-1}$ with a net capacitance change of 0.18 pF over a range 0-210 kPa.