• Korean Journal of Materials Research
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• v.4 no.6
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• pp.687-694
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• 1994

Heteroepitaxial InP/GaAs layers were grown using the selective liquid phase epitaxy (SLPE) technique. It was observed that the optimum LPE conditions were $660^{\circ}C$ growth temperature, $5^{\circ}C$ supercooling, and $0.4^{\circ}C$/min cooling rate. Maximum expitaxial layer overgrowth (ELO) of 110-160$\mu \textrm{m}$ was obtained when the seed was aligned along (112) orientation. Initial melt-back of the substrate was observed but limited to the seed region so that flat In-Ga-As-P layers were grpwn throughout the GaAs substrates. The InP/GaAs heteroepitaxial structure could be obtained by growing an additional InP layer on top of the In-Ga-As-P layer.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.92-97
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• 2005

In this study, the effect of contact angles of PDMS and external voltage has been investigated. SU-8 (Microchem, USA) negative photoresist and PDMS are used to make the microchannel. The contact angle of the native PDMS is $105^{\circ}$. The native PDMS is treated with the oxygen plasma and the contact angle changes $19^{\circ}$, $46^{\circ}$ and $69^{\circ}$. As a result, the rate of increase in flow velocity is not directly proportional to the rate of increase of external voltage. This is because the electrical double layer is condensed and the zeta potential is increased with an increase of the external voltage. The flow velocity is highest for the contact angle of $19^{\circ}$ at the same external voltage. Hence we conclude that the thickness of electrical double layer and flow velocities vary with contact angle at the same external voltage.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2001.11a
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• pp.28-28
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• 2001

$Bi_2Te_3$계 열전반도체 재료는 200 ~ 400K 정도의 저온에서 에너지 변환 효율이 가장 높은 재료로서 열전냉각 및 발전재료로 제조볍 및 특성에 관한 많은 연구가 진행되어 왔다. 전자냉각 모듈의 제조에는 P형 및 N형 $Bi_2Te_3$계 단결정이 주로 사용되고 있으나. $Bi_2Te_3$ 단결정은 C축에 수직한 벽개면을 따라 균열이 쉽게 전파하기 때문에 소자 가공사 수윤 저하가 가장 큰 문제점으로 지적되고 있다. 이에 따라 최근 열전재료의 가공방법에 따른 회수율 증가 및 열전특성 향상에 관한 열간압출, 단조와 같은 연구가 활발히 이루어지고 있다. 본 연구는 가스분사법(gas atomizer)을 이용하여 용질원자 편석의 감소, 고용도의 증가,균일고용체 형성, 결정립미세화 둥 급속응고의 장점을 이용하여 화학적으로 균질한$Bi_2Te_3$계 열전재료 분말을 제조하고, 제조된 분발을 압출가공하여 기계적성질, 소자의 가공성 및 열전 성능 지수율 향상시키는데 연구 목적이 있다. 본 설험에서는 99.9%이상의 고순도 Bi. Te. Se. Sb를 이용하여, 고주파 유도로에서 Ar 분위기로 용융하고, 가스분사법를 이용하여 균질한 $Bi_2Te_3$계 열전재료 분만을 제조하였다. 분말표면의 산화막을 제거하기 위하여 수소분위기에서 환원처리를 행하였고, 된 분말을 Al 캔 주입하여 냉간성형 한 후 진공중에서 압출온도를 변화시켜 열간압출 가공을 행하였다. 압출 온도변화에 따른 압출재의 미세조직 및 열전특성에 중요한 영향을 미치는 C면 배향에 대한 결정방위 해석, 압출재의 압축강도 등을 분석하였으며, 압출온도에 따삼 미세조직 변화와 결정방위의 변화에 따른 열전특성의 관계를 해석하였다성시켰고 이들이 산인 HNO3에서 녹았기 때문이다. 본 연구에서 개발된 새로운 에칭 용액인 90H2O2 - 10HNO3 (vol%)의 에칭 원리가 똑같이 적용 가능한 다른 종류의 초경 합금에서도 사용이 가능할 것으로 판단된다.로 판단된다.멸과정은 다음과 같다. 출발물질인 123 분말이 211과 액상으로 분해될 때 산소가스가 배출되며, 이로 인해 액상에서 구형의 기공이 생성된다. 이들 중 일부는 액상으로 채워져 소멸되나, 나머지는 그대로 남는다. 특히, 시편 중앙에 서는 수십-수백 마이크론 크기의 커다란 기공이 다수 관찰된는데, 이는 기공의 합체로 만들어진 것이다. 포정반응 열처리 시 기공 소멸로 만들어진 액상포켓들은 주변 211 입자와 반응하여 123 영역으로 변한다. 이곳은 다른 지역과 비교하여 211 밀도 가 낮기 때문에, 미반응 액상이 남거나 211 밀도가 낮은 123 영역이 된다. 액상으로 채워지지 못한 구형의 기공들 중 다수가 123 결정 내로 포획되며, 그 형상은 액상/ 기공/고상 계면에너지에 의해 결정된다.단의 경우, 파단면이 매끄럽고 파변상의 결정립도 매우 미세하였으며, 산확물 의 용집도 찾아보기 어려웠 나, 접합부 파단의 경우에는 파변의 굴곡이 비교척 심하고 연성 입계파괴의 형태를 보였￡며, 결정립도 모채부 파단의 경우에 비해 조대하였다. 조대하였다. 셋째, 주상기간 중 총 에너지 유입률 지수와 $Dst_{min}$ 사이에 높은 상관관계가 확인되었다. 특히 환전류를 구성하는 주요 입자의 에너지 영역(75~l13keV)에서 가장 높은(0.80) 상관계수를 기록했다. 넷째, 회복기 중에 일어나는 입자들의 유입은 자기폭풍의 지속시간을 연장시키는 경향을 보이며 큰 자기폭풍일수록 현저했다. 주상에서 관측된 이러한 특성은 서브스톰 확장기 활동이 자기폭풍의

• Journal of the Korea Concrete Institute
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• v.28 no.4
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• pp.473-480
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• 2016

The purpose of this study is to provide analytical method to reasonably evaluate the complicated failure behaviors of shear friction of reinforced concrete shear wall specimens using grade 500 MPa high-strength bars. A total of 16 test specimens with a variety of variables such as aspect ratio, friction coefficient of interface in construction joint, reinforcement details, reinforcement ratio in each direction, material properties were selected and the analysis was performed by using a non-linear finite element analysis program (RCAHEST) applying the modified shear friction constitutive equation in interface based on the concrete design code (KCI, 2012) and CEB-FIP Model code 2010. The mean and coefficient of variation for maximum load from the experiment and analysis results was predicted 1.04 and 17% respectively and properly evaluated failure mode and overall behavior characteristic until failure occur. Based on the results, the analysis program that was applied modified shear friction constitutive equation is judged as having a relatively high reliability for the analysis results.

• Composites Research
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• v.27 no.6
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• pp.248-253
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• 2014

In this study, tapered double cantilever beam specimens are designed with the variable of angle to investigate the fracture property at the bonded surface of adjoint structure. These specimens are made with four kinds of models as the length of 200 mm and the slanted angles of bonded surfaces on specimens of $6^{\circ}$, $8^{\circ}$, $10^{\circ}$ and $12^{\circ}$. By investigating experiment and analysis result of these specimens, the maximum loads are happened at 120 N, 137 N, 154 N and 171 N respectively in cases of the specimens with slanted angles of $6^{\circ}$, $8^{\circ}$, $10^{\circ}$ and $12^{\circ}$. As the analysis result approach the experimental value, it is confirmed to have no much difference with the values of experiment and analysis. It is thought that the material property can be investigated effectively on shear behavior of the material composed of aluminum foam bonded with adhesive through simulation instead of experiment by applying this study method.

• Journal of Sensor Science and Technology
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• v.7 no.1
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• pp.67-72
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• 1998

The crystallized CuPc and PbTe films are formed by thermal evaporation and pulsed ArF excimer laser ablation. Structural and electrical properties of thin film is observed by XRD and current-voltage(I-V) curves. From XRD analysis, both PbTe and CuPc thin films show a-axis oriented structure. For the measurement of photovoltaic effect, the transverse current-voltage curve of CuPc/Si, PbTe/Si and PbTe/CuPc/Si junctions have been analyzed in the dark and under illumination. The PbTe/CuPc/Si junction exthibits a strong photovoltaic characteristics with short circuit current($J_{sc}$) of $25.46\;mA/cm^{2}$ and open-circuit voltage($V_{oc}$) of 170 mV. Quantum efficiency and power conversion efficiency are calculated to be 15.4% and $3.46{\times}10^{-2}$, respectively. Based on the results of QE and ${\eta}$, the photocurrent process of PbTe/CuPc/Si junction can be explained as following three effective steps; photocarrier generation in the CuPc layer, carrier separation at PbTe/CuPc interface, and finally a transportation of electrons through the PbTe layer.

• Journal of the Korea institute for structural maintenance and inspection
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• v.15 no.2
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• pp.61-69
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• 2011

Fiber Reinforced Plastic (FRP) sheets have been widely used to retrofit and rehabilitate RC structures, while in case of retrofitting steel structures, there are no codes and researches. It stems from configuration of member and characteristics of bonding behavior. This study focused on the static behavior of steel beams reinforcement by AFRP sheets. The main objective of the experimental programme was the evaluation of the force transfer mechanism, the increment of the beam load carrying capacity and the bending stiffness. A bending test was conducted on a H-shaped steel beam, with aramid FRP sheets bonded to its flanges. The mid-span deflection and the strain from three points along AFRP sheets were recorded Test results exhibit that the increment of the load-carrying capacity with reference to a mid-span deflection level of 15 mm(1/125mm of the clear span) was equal to 9.4% and for the two layers case, an elastic stiffness increment is slightly higher than one layer case.

• Journal of Dental Rehabilitation and Applied Science
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• v.29 no.3
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• pp.209-223
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• 2013

This study was to evaluate the stress distributions of prefabricated, customized abutments and fixtures according to their material and shape by three-dimensional finite element analysis. And to investigate the fatigue life and fracture characteristics. Mandibular models were fabricated by reconstruction of the CT scan of patients with normal occlusion. A total of six finite element models were designed, a load of 100 N was applied on the buccal cusps vertically, and 30 degree obliquely. 10 specimens each were fabricated for the more clinically widely used 4 type abutments and were loaded according to ISO 14801. Differences in stress distribution patterns were not found according to the materials of the abutments and fixtures. But a slight difference in the stress level was detected. Customized abutment groups showed lower crown stress levels. One-piece zirconia implant showed the lowest bone stress levels. In the fatigue test, highest values were measured in group 7. Prefabricated abutments showed less variation of fatigue life (P<0.05). Use of customized abutments can improve the fracture resistance of restorations. Especially, use of customized zirconia abutments reinforced by titanium screw connecting parts is recommended.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.55-61
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• 2000

Sn-37Pb and Sn-3.5Ag-0.7Cu solder balls of 0.3 mm diameter were reflow soldered with the variation of soldering peak temperature and conveyer speed of reflow machine. The peak temperatures far soldering were changed in the range of 220~$240^{\circ}C$ for Sn-37Pb and 230~$260^{\circ}C$ for Sn-3.5Ag-0.7Cu. As the results of experiments, optimum soldering condition for Sn-37Pb was $230^{\circ}C$ of soldering temp., 0.7~0.8 m/min of conveyer speed. The optimum condition for the Sn-3.5Ag-0.7Cu was $250^{\circ}C$ and 0.6 m/min. The maximum shear strength for the soldered joints of Sn-37Pb was 555 gf and of Sn-3.5Ag-0.7Cu was 617 gf. Thickness of the intermetallic compound Cu6Sn5 on the soldered interface was 1.13~1.45 $\mu\textrm{m}$ for Sn-37Pb and 2.5~4.3 $\mu\textrm{m}$ for Sn-3.5Ag-0.7Cu.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.9
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• pp.15-22
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• 2000

The effects of carrier transport and input power on the extinction ratio was theoretically analyzed in a 1.55${\mu}m$ InGaAsP/InGaAsP multiple-quantum-well(MQW) electroabsorption(EA) modulator. Poisson's equation, current continuity equations for electrons and holes, and optical field distribution were self-consistently solved by considering electric field dependent absorption coefficients. The field screening effect due to the carrier accumulation in heterointerface and the space-charge region occurred more seriously at the input side of modulator as input optical intensity increased. It was revealed that extinction ratio could be steeply degraded for modulator with the length of 200${\mu}m$ when an input power exceeds 10mW. A degradation of extinction ratio due to the field screening effect would be more significantly at high-performance devices such as a 1.55${\mu}m$DFB-LD/EA-modulator integrated source where optical coupling efficiency is almost complete or a very high-speed modulator with its length as short as a few tens ${\mu}m$.