• Korean Chemical Engineering Research
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• v.46 no.2
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• pp.402-407
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• 2008

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.

• Korean Chemical Engineering Research
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• v.58 no.1
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• pp.64-68
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• 2020

In this study, metal copper clad laminate can be prepared using epoxy composite filled with thermally conductive fillers. In order to improve the thermal conductivity of epoxy composites, it is important factor to form conductive networks through appropriate packing of conductive fillers in epoxy composite matrix and to decrease the amount of thermally resistant junctions involving a epoxy composite matrix layer between adjacent filler units. This is because epoxy has a thermal conductivity of only 0.2-0.3W, so in order to maintain high thermal conductivity, thermally conductive fillers are connected to each other, so that the gap between particles can be reduced to reduce thermal resistance. The purpose of this study is to find way to achieve highly thermally conductive in the epoxy composite matrix filled with Al₂O₃ and Boron Nitride(BN) filler by filler loading and uniform dispersion. As a results, the use of Al₂O₃/BN hybrid filler in epoxy matrix was found to be effective in increasing thermal conductivity of epoxy composite matrix due to the enhanced connectivity offered by more continuous thermally conductive pathways and uniform dispersion without interfacial voids in epoxy composite matrix. In addition, surface treatmented s-BN improves the filler dispersion and adhesion between the filler and the epoxy matrix, which can significantly decrease the interfacial thermal resistance and increase the thermal conductivity of epoxy composite matrix.