• Proceedings of the KWS Conference
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• 2000.10a
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• pp.34-36
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• 2000

It is difficult to realize automation of welding of lattice type in shipbuilding and assembly processing of shipbuilding and steel structures. Usually, the welding parts of lattice type are welded manually. So there are limitations in continuous and stable quality controls and in increase in productivity because the welding quality depends on worker's skill. That is, automation in welding is necessary. This paper shows shows the development results of a moblie robot for welding of lattice type. Specially. algorithms for its mobile speed and seam tracking controls are introduced.

• Journal of Welding and Joining
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• v.10 no.4
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• pp.39-43
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• 1992

용접은 자동차, 중공업, 조선, 건설, 항공 등 주요 기간산업의 기반기술로서, 금속가공분야 가운데 특히 접합부문에 특별한 의미를 내포하고 있다. 그러나 기반기술로서의 중요성도 불구하고 국 내산업전반에서의 용접은 비교적 낙후된 모습을 보이고 있는 것이 부인할 수 없는 실정이다. 용접이란, 금속가공의 일개공정을 의미하는 용어로 간단히 정의될 수 있지만 용접공정이 원만히, 성공적으로 수행되기 위한 준비되고 연구되어야 할 분야는 매우 복잡하고 다양한 양상을 띄고 있는데 우선, 모재와 용가재를 용해하기 위한 열원으로서는 전기에너지, 화학연소 에너지, LASER, 가속전자, PLASMA가 응용되고 있으며 그 에너지를 유효하게 용접에 이용하기 위한 주변장치로서는 TORCH, JIG, 각종 전자적 SENSOR각 활용되고 있다. 또한, 모재의 재질에 따른 용접재료와 소모성자재의 선택이 부수적으로 따르게 되어 각각의 분야에는 그 특성에 준 하는 학문적 이론이 광범위하게 적용되고 있다. 각종 구조물 제작이 용접의 최종적인 목적이라고 할 때, 제작에 따른 재료와 모재형상, 그리고 각종 기능적 요구에 부합하기 위한 열원, 재료, 용접방법, 검사방법등의 선택은 종합적인 학문적 이론과 실제적 응용이 뒷받침 돼야 함을 전제 로써, 본고에는 용접전반의 문제중, 전기용접기기 및 용접관련 자동화 설비의 현주소 파악과 문 제의 접근측면에서만 간단히 기술하고자 한다.

• Proceedings of the Korean Vacuum Society Conference
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• 1998.02a
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• pp.90-90
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• 1998

전계 에미터 어레이(FEA)는 진공에서 전계률 인가하여 전극으로부터 전자률 방출시키는 전자원으로서, 마이크로파 소자 및 명판 디스플레이, 센서 둥에 이용된다 .. Transfer Mold 법 은 뾰족한 에미터 립과 게이트 절연막 및 게이트 전극 충올 형성한 후 유리와 같은 기판에 이전 시키는 방법으로, 이러한 방법은 Mold 형태 위에 코탱 충의 두께 조절과, 게이트와 립 높이 조절이 가능하며, 그리고 유리 기판 위에 접착하여 대면적의 평판 디스플레이를 제작 할 수 었다는 장점이 있다[1,2]. 본 연구에서는 일반적으로 사용되는 실리콘 기판올 습식 식 각하여 Mold률 제작하는 방법 대선에, 측벽 스페이스 구조률 이용한 새로운 방법의 Mold 형태률 이용하여 게이트률 가진 에마터 립올 제작하였다. 먼저 실리콘 기판 위에 산화막올 증착하고 그 위에 게이트 전극파 게이트 절연막을 LPCVD 방법으로 증착하여 구명 형태로 패터닝 한 후, BPSG(Boro Phospher Silicate Glass) 박막올 증착하여 고온에서 훌러 내려 뾰족한 형태의 주형(Mold)률 제작한 후 TiN율 증착하여 정전 접합(an여ic bon벼ng)이나 레 진(resine)둥으로 유리률 접합한 후 KOH 용액으로 실리콘 기판옵 뒷면부터 식각해 낸다. 그 다옴, 립과 게이트 위에 있는 절연막올 제거한 후 뾰족한 전계 에미터 어레이륭 제조하 였다. 자세한 제조 공정 및 제작된 에미터 립의 특성은 학회에서 발표될 예정이다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.22-22
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• 2009

Laser forming is a promising technology in manufacturing, such as in the shipbuilding, automobile, microelectronics, aerospace and other manufacturing industries. This process forms the sheet metal by utilization of laser-induced thermal stresses. Laser forming process has been studied extensively for rectangular shape geometry. This basic study presents the change in deformation behavior of sheet metal during transition from linear to curved geometries and irradiations as well. A series of experiments have been conducted on a wide range of specimen geometries such as quarter-circular and half circular plate. The reasons for this behavior have been analyzed. Results are compared and analyzed by simulations using ABAQUS. Influence of developed stresses on the bending has been investigated. This study provides the more understanding of forming mechanism influenced by geometry effect.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2010.11a
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• pp.636-641
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• 2010

A preburner for the staged combustion in the high performance liquid rocket engine is being developed and strength experiments and finite element analyses on specimens, which simulate the brazing joint of the preburner, were performed and the results were compared. One specimen simulate the joints near oxygen injectors of head by the funance brazing and two specimens the joints of the combustion chamber cooling channel by vacuum brazing. The experiments were burst ones with strain gauges.

• Proceedings of the KIEE Conference
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• 1993.07b
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• pp.1057-1059
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• 1993

Some interested phenomena, which were appeared near the bonding interface, were investigated by angle lapping and delineation method, SEM, and TEM observations. Voids, defects, material continuity, and interfacial oxide stability were observed and discussed in the fusion-bonded Bi-Si or Si-$SiO_2$/Si wafer pairs.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2001.10a
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• pp.724-728
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• 2001

In this study, the dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. The dielectric breakdown characteristics origin in epoxy composites were examined and various effects of dielectric breakdown on epoxy composites were also discussed. As a result, first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. And the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since this suggests that silane coupling agent improves interfacial combination and relaxs electric field concentration. Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1%, the applied field value needed to be under 21.5㎹/cm.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2002.11a
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• pp.779-783
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• 2002

The dielectric breakdown of epoxy composites used for transformers was experimented and then its data were simulated by Weibull distribution probability. As a result, first of all, speaking of dielectric breakdown properties, the more hardener increased the stronger breakdown strength at low temperature because of cross-linked density by the virtue of ester radical. And the breakdown strength of specimens with filler was lower than it of non-filler specimens because it is believed that the adding filler forms interface and charge is accumulated in it, therefore the molecular motility is raised, the electric field is concentrated, and the acceleration of electron and the growth of electron avalanche are early accomplished. In the case of filled specimens with treating silane, the breakdown strength become much higher since this suggests that silane coupling agent improves interfacial combination and relaxs electric field concentration. Finally, from the analysis of weibull distribution, it was confirmed that as the allowed breakdown probability was given by 0.1%, the applied field value needed to be under 21.5MVcm.

• Journal of the Korean Wood Science and Technology
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• v.33 no.1 s.129
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• pp.7-16
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• 2005

This study was carried out to evaluate the structural property of double shear bolted connections in Korean Larch. For the main member, sawn lumber and Glulam were used in which thickness of lumber is 39 mm, 89 mm, 139 mm, 189 mm and Glulam 80 mm, 140 mm, 170 mm. For the side member, sawn lumber and steel plate were used in which thickness of lumber is the same of the main member and steel plate is 6mm. And connections were jointed by M12, M16, M20 bolts which were usually used for wood constructions in Korea. Directions of loading to connections were perpendicular and parallel to grain of main and side member. First, through the dowel bearing test, the dowel bearing strength was evaluated and through the bolt bending tests, the bolt bending strength was evaluated. And then experiments for the connection were performed. Obtained results from experiments were compared with calculated values by EYM and analyzed. Strength of double shear bolted connections in Korean Larch was similar or higher than calculated value by EYM. Especially when the side member was made by the sawn lumber, it was similar to the calculated value. In failure mode, the mode was effected by the knot and the dry defect. In the thin main member, it was shown mode I and as the thickness of the main member was thicker, it was changed into mode III.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.32 no.5
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• pp.212-217
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• 2022

Large thermal stress due to the difference between silicon carbide and graphite's coefficients of thermal expansion could be formed during crystal growing process of silicon carbide (SiC) at high temperature. The large thermal stress could separate the SiC seed crystals from graphite components, which bring about the drop of the seed crystal during crystal growth. However, the bonding properties of SiC seed crystal module has hardly reported so far. In this study, SiC and graphite were bonded using 3 types of bonding agents and a three-point bending tests using a mixed-mode flexure test were conducted for the bonded samples to evaluate the bonding characteristics between SiC and graphite. Raman spectroscopy, X-ray Photoelectron Spectroscopy, and X-ray Computed Tomography were used to analyze the bonding characteristics and the microstructures of the SiC-graphite interfaces bonded with the bonding agents. As results, an excellent bonding agent was chosen to fabricate SiC seed crystal module with 50 mm in diameter. An SiC single crystal with 50 mm in diameter was successfully grown without falling out during top seeded solution growth of SiC at high temperature.