• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.45-50
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• 2012

Recently developed polyketone fiber has various applications in the mechanical rubber goods as reinforcement because of its good mechanical properties. However, its surface is not suitable for good adhesion with the rubber matrix. Thus, a surface modification is essential to obtain the good interfacial adhesion. Plasma treatment, in this study, has been conducted to modify the surface of the polyketone fiber. The morphological changes of the fibers by oxygen plasma treatment were observed by using SEM and AFM. The chemical composition changes of PK fiber surface treated with oxygen plasma were investigated using an XPS (X-ray photoelectron spectroscopy). Finally, the effect of these changes on the interfacial adhesion between fiber and rubber was analyzed by using a microdroplet debonding test. By the plasma treatment, oxygen moieties on the fiber surface increased with processing time and power. The surface RMS roughness increases until the proper processing condition, but a long plasma processing time resulted in a rather reduced roughness because of surface degradation. When the treatment time and power were 60 s and 80 W, respectively, the highest interfacial shear strength (IFSS) was obtained between the PK fiber and natural rubber. However, as the treatment time and power were higher than 60 s and 80 W, respectively, the IFSS decreased because of degradation of the PK fiber surface by severe plasma treatment.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.214-214
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• 1999

다이아몬드를 반도체용 열방산용기판 등으로 사용하기 위해서는 수백 $\mu\textrm{m}$ 두께의 대면적 웨이퍼가 요구된다. 이를 위해서 DC are jet CVD, MW PACVD, DC PACVD 등이 개발되어, 현재 4"에서 8"까지의 많은 문제를 일으키고 있다. 본 연구에서는 multi-cathode DC PACVD법에 의한 4" 다이아몬드 웨이퍼의 합성과 합성된 막의 특성변화에 대한 연구를 수행하였다. 또한, 웨이퍼의 휨과 crack 발생거동과 대한 고찰을 통래 휨과 crack이 없는 웨이퍼의 제작방법을 고안하였다. 사용된 음극의 수는 일곱 개이며, 투입된 power는 각 음극 당 약 2.5kW(4.1 A-600V)이었다. 사용된 기판의 크기는 직경 4"이었다. 합성압력은 100Torr, 가스유량은 150sccm, 증착온도는 125$0^{\circ}C$~131$0^{\circ}C$, 수소가스네 메탄조성은 5%~8%이었다. 합성 중 막에 인가되는 응력은 합성 중 증착온도의 변화에 의해 제어하였다. 막의 결정도는 Raman spectroscopy 및 열전도도를 측정을 통해 분석하였다. 성장속도 및 다이아몬드 peak의 반가폭은 메탄조성 증가(5%~8%)에 따라 증가하여 각각 6.6~10.5$\mu\textrm{m}$/h 및 3.8~5.2 cm-1의 분포를 보였다. 6%CH4 및 7%CH4에서 합성된 웨이퍼에서 측정된 막의 열전도도는 11W/cmK~13W/cmK 정도로 높게 나타났다. 막두께의 uniformity는 최대 3.5%로 매우 균일하였다. 막에 인가되는 응력의 제어로 직경 4"k 합성면적에서 두께 1mm 이상의 균열 및 휨이 없는 다이아몬드 자유막 웨이퍼를 합성할 수 있었다.다이아몬드 자유막 웨이퍼를 합성할 수 있었다.active ion에 의해 sputtering 이 된다. 이때 plasma 처리기의 polymer 기판 후면에 magnet를 설치하여 높은 ionization을 발생시켜 처리 효과를 한층 높여 주었다. 이 plasma 처리는 표면 청정화, 표면 etching 이 동시에 행하는 것과 함께 장시간 처리에 의해 표면에서는 미세한 과, C=C기, -C-O-의 극성기의 도입에 의한 표면 개량이 된다는 것을 관찰할 수 있다. OPP polymer 표면을 Ar 100%로 plasma 처리한 경우 C-O, C=O 등의 carbonyl가 발생됨을 알 수 있었다. C-O, C=O 등의 carbynyl polor group이 도입됨에 따라 sputter된 Al의 접착력이 향상됨을 알 수 있으며, TEM 관찰 결과 grain size도 상당히 작아짐을 알 수 있었다.onte-Carlo 방법으로 처리하였다. 정지기장해석의 경우 상용 S/W인 Vector Fields를 사용하였다. 이를 통해 sputter 내 플라즈마 특성, target으로 입사하는 이온에너지 및 각 분포, 이들이 target erosion 형상에 미치는 영향을 살펴보았다. 또한 이들 결과로부터 간단한 sputtering 모델을 사용하여 target으로부터 sputter된 입자들이 substrate에 부착되는 현상을 Monte-Carlo 방법으로 추적하여 성막특성도 살펴보았다.다.다양한 기능을 가진 신소재 제조에 있다. 또한 경제적인 측면에서도 고부가 가치의 제품 개발에 따른 새로운 수요 창출과 수익률 향상, 기존의 기능성 안료를 나노(nano)화하여 나노 입자를 제조, 기존의 기능성 안료에 대한 비용 절감 효과등을 유도 할 수 있다. 역시 기술적인 측면에서도 특수소재 개발에 있어 최적의 나노 입자 제어기술 개발 및 나노입자를 기능성 소재로 사용하여 새로운 제품의 제조와 고압 기상

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.153-153
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• 1999

platinum 유기착화합물을 사용하여 유리 기판 위에 Pt를 증착시켰다. Pt를 증착하기 위하여 Pt 착화합물을 용해 시킨 후, 유리 기판을 용액속에 담근 후 가열하여 Pt막을 증착하였다. 증착 후 Pt의 면저항은 200~75$\Omega$의 값을 나타내어 비교적 높은 저항값을 나타내었다. 높은 저항값을 낮추기 위해 진공 10-5Torr에서 50, 100, 150, 25$0^{\circ}C$로 열처리를 하였다. 이러한 저항값을 변화의 원인을 살펴보기 위하여 X-선 회절법을 이용하여 결정성의 변화를 살펴보았고, 화학적 조성의 변화는 X-ray 광전자 분광법을 이용하여 조사하였다. 열처리 전 Pt막은 비정질 상태를 나타내었으나, 6$0^{\circ}C$에서 30분간 열처리한 후에는 결정성이 증가하는 것으로 관찰되었다. 열처리 후 결정방향은 {111] 방향이 주 방향이였으며 [002] 방향의 피크도 관찰되었다. 따라서 성장된 막은 다결정 막임을 알 수 있었다. XPS를 이용하여 조성을 조사하여 본 결과 열처리하지 않은 시료의 경우 유기물과 반응하여 Pt의 피크가 넓게 나타나나 열처리 후에는 유기물이 분해되어 Pt의 고유한 피크를 관찰할 수 있었다. 따라서 전기전도도의 변화는 유기물의 분해를 통하여 순수한 Pt로 변해가면서 감소하는 것으로 생각되어 지며 결정성 또한 전기전도도 변화에 중요한 역할을 함을 알 수 있었다. 기존의 방법을 이용하여 Pt를 증착할 경우 기판과 쉽게 박리 되는 현상이 관찰되었으나 본 방법을 이용하여 증착된 Pt 박막의 경우 열처리 후에는 기판과의 접착력이 기존의 방법보다 뛰어나 박리되는 현상이 관찰되지 않았다.$ 이상에서 안정한 것을 볼 수 있었다. 텅스텐 박막은 $\alpha$ 및 $\beta$-W 구조를 가질 수 있으나 본 연구에서 성장된 텅스텐은 $\alpha$-W 구조를 가지는 것을 XRD 측정으로 확인하였다. 성장된 텅스텐 박막의 저항은 구조에 따라서 변화되는 것으로 알려져 있다. 증착조건에 따른 저항의 변화는 SiH4 대 WF6의 가스비, 증착온도에 따라서 변화하였다. 특히 온도가 40$0^{\circ}C$ 이상, SiH4/WF6의 비가 0.2일 경우 텅스텐을 증착시킨 후에 열처리를 거치지 않은 경우에도 기존에 발표된 저항률인 10$\mu$$\Omega$.cm 대의 값을 얻을 수 있었다. 본 연구를 통하여 산화막과의 접착성 문제를 해결하고 낮은 저항을 얻을 수 있었으나, 텅스텐 박막의 성장과정에 의한 게이트 산화막의 열화는 심각학 문제를 야기하였다. 즉, LPCVD 과정에서 발생한 불소 또는 불소 화합물이 게이트의 산화막에 결함을 발생시킴을 확인하였다. 향후, 불소에 의한 게이트 산화막의 열화를 최소화시킬 수 있는 공정 조건의 최저고하 또는 대체게이트 산화막이 적용될 경우, 개발된 연구 결과를 산업체로 이전할 수 있는 가능성이 높을 것을 기대된다.박막 형성 메카니즘에 큰 영향을 미침을 알 수 있었다. 또한 은의 전기화학적 다층박막 성장은 MSM (monolayer-simultaneous-multilayer) 메카니즘을 따름을 확인하였다. 마지막으로 구조 및 양이 규칙적으로 조절되는 전극의 응용가능성이 간단히 논의될 것이다.l 성장을 하였다는 것을 알 수 있었다. 결정성

• Journal of the Korea Concrete Institute
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• v.17 no.4 s.88
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• pp.489-498
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• 2005

Recently, the deterioration of concrete structures have been increased by the damage from salt, carbonization, freezing & thawing and the others. Therefore, the measures for the deterioration of concretes have been taken. Among them, it has been often used that surface treatment which cut off the deterioration factors of durability by protecting the surface of concrete. The water proof and repair materials for concrete mainly use organic materials such as epoxy, these materials excel in intial bonding force and resistance to chemical agents. But they cause difference in the modulus of elasticity and the rate of shrinkage and expansion of concrete, and thus result in such problems as scaling and spatting in the progress of time. Therefore in this study it develop the performance Improving agent of concrete surface that can block a deterioration cause such as $CO_2$ gas, chloride ion and water from the outside and enhance waterproofing ability by reinforcing the concrete surface when applying it to concrete structures.

• Restorative Dentistry and Endodontics
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• v.36 no.2
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• pp.125-131
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• 2011

Objectives: The purpose of this study was to evaluate the effect of surface treatment of FRC-Post on bonding strength to resin cements. Materials and Methods: Pre-surface treated LuxaPost (DMG), Rely-X Fiber Post (3M ESPE) and self adhesive resin cement Rely-X Unicem (3M ESPE), conventional resin cement Rely-X ARC (3M ESPE), and Rely-X Ceramic Primer (3M ESPE) were used. After completing the surface treatments of the posts, posts and resin cement were placed in clear molds and photo-activation was performed. The specimens were sectioned perpendicular to the FRC-Post into 2 mm-thick segments, and push-out strength were measured. The results of bond strength value were statistically analyzed using independent samples t-test and oneway ANOVA with multiple comparisons using Scheffe's test. Results: Silanization of posts affect to the bond strength in LuxaPost, and did not affect in Rely-X Fiber Post. Rely-X ARC showed higher value than Rely-X Unicem. Conclusions: Silanization is needed to enhance the bond strength between LuxaPost and resin cements.

• Restorative Dentistry and Endodontics
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• v.36 no.2
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• pp.139-148
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• 2011

Objectives: This study investigated the effect of the strength and wetting characteristics of adhesives on the bond strength to dentin. The experimental adhesives containing various ratios of hydrophobic, low-viscosity Bis-M-GMA, with Bis-GMA and TEGDMA, were made and evaluated on the mechanical properties and bond strength to dentin. Materials and Methods: Five experimental adhesives formulated with various Bis-GMA/Bis-MGMA/TEGDMA ratios were evaluated on their viscosity, degree of conversion (DC), flexural strength (FS), and microtensile bond strength (MTBS). The bonded interfaces were evaluated with SEM and the solubility parameter was calculated to understand the wetting characteristics of the adhesives. Results: Although there were no significant differences in the DC between the experimental adhesives at 48 hr after curing (p > 0.05), the experimental adhesives that did not contain Bis-GMA exhibited a lower FS than did those containing Bis-GMA (p < 0.05). The experimental adhesives that had very little to no TEGDMA showed significantly lower MTBS than did those containing a higher content of TEGDMA (p < 0.05). The formers exhibited gaps at the interface between the adhesive layer and the hybrid layer. The solubility parameter of TEGDMA approximated those of the components of the primed dentin, rather than Bis-GMA and Bis-M-GMA. Conclusions: To achieve a good dentin bond, a strong base monomer, such as Bis-GMA, cannot be completely replaced by Bis-M-GMA for maintaining mechanical strength. For compatible copolymerization between the adhesive and the primed dentin as well as dense cross-linking of the adhesive layer, at least 30% fraction of TEGDMA is also needed.

• Applied Chemistry for Engineering
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• v.31 no.2
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• pp.230-236
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• 2020

In this study, an adhesive tape with water and impact resistance for mobile devices was developed using a UV-curable urethane acrylate based polymer as a substrate. The substrate fabricated by UV-curable materials shows hydrophobicity and poor wettability, which significantly deteriorates the interface-adhesions between the substrate and acrylic adhesive. In order to improve the interface adhesion, 3-glycidoxy-propyl trimethoxysilane (GPTMS), a silane coupling agent having epoxy functional groups, was selected and incorporated into UV-curable urethane acrylate based polymer resins in various contents. The changes of the chemical composition according to the contents of GPTMS was studied with Fourier-transform infrared spectroscopy (FT-IR), energy-dispersive X-ray spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) to know the surface bonding properties. Also mechanical properties of the substrate were characterized by tensile strength, gel fraction and water contact angle measurements. The peel strengths at 180° and 90° were measured to compare the adhesion between the substrate and adhesive according to the silane coupling agent contents. The mechanical strength of the urethane acrylate adhesive tape decreased as the silane coupling agent increased, but the adhesion between the substrate and adhesives increased remarkably at an appropriate content of 0.5~1 wt%.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.9
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• pp.27-33
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• 2016

Phenolic resin has excellent heat resistance and good mechanical properties as a thermosetting resin. However, its thermosetting characteristics cause it to produce a non-recyclable waste in the form of sprue and runner which is discarded and represents up to 15~20% of the overall products. Forty thousand tons of phenolic resin sprue and runner are disposed of (annually). The (annual) cost of such domestic waste disposal is calculated to be 20 billion won. In this study, discarded phenol resin scraps were pulverized and treated by silanes to improve their interfacial adhesion with HDPE. The sizes of the pulverized pulverulent bodies and fine particles were (100um~1000um) and (1~100um), respectively. The pulverized phenol resin was treated with 3-(methacryloyloxy) propyltrimethoxysilane and vinyltrimethoxy silane and the changes in its characteristics were evaluated. The thermal properties were evaluated by DSC and HDT. The mechanical properties were assessed by a notched Izod impact strength tester. When the silane treated phenol resin was added, the heat distortion temperature of HDPE increased from $77^{\circ}C$ to $96^{\circ}C$ and its crystallinity and crystallization temperature also increased. Finally, its impact strength and tensile strength increased by 20% and 50%, respectively, in comparison with the non-treated phenol resin.

• Applied Chemistry for Engineering
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• v.30 no.5
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• pp.597-605
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• 2019

In order to improve the adhesion of water-based adhesive, gemini type nonionic reactive surfactants were synthesized and applied to water-based adhesives. The surfactants were synthesized by using maleic acid and polyoxyethylene cetyl ether having different length of ethylene oxide and confirmed by FT-IR and $^1H-NMR$. Their appearance was light yellow wax. The cloud point of the compound was more than $78^{\circ}C$. The measured critical micelle concentration (c.m.c) was $1.0{\times}10^{-4}{\sim}7.0{\times}10^{-4}mol/L$ and surface tension at c.m.c was 25.9~32.0 mN/m. As the number of ethylene oxide increased, the emulsifying power was improved. The foaming height of each compound by Ross-Miles method was 1.4~4.5 cm. The synthesized surfactants was then used as an emulsifier in emulsion polymerization of water-based adhesives and its physical properties were evaluated. The solid contents of prepared adhesives was 59%. The average particle size and initial tackiness of the prepared adhesives were 164~297 nm and ball no. of 20~32, respectively. The peel strength was $1.8{\sim}2.1kg_f/mm$. The retention rate of adhesives viscosity was evaluated to 99% during 30 days. Therefore, synthesized gemini type nonionic reactive surfactants are expected to be applied as an emulsifier for the high adhesive force.

• Journal of the Korean Society of Propulsion Engineers
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• v.21 no.1
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• pp.1-7
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• 2017

As a part of studies to lower the infrared (IR) emissivity from the surface of exhaust nozzle in the turbo jet engine, stainless steel plate was coated with copper particle/meta-aramid resin composites and the IR emissivity of the plate were investigated. Binders of filler particles based on synthetic polymers generally undergo thermal decomposition before $300^{\circ}C$. It was found that the meta aramid resin was thermally stable after the test at $320^{\circ}C$, confirming the excellent thermal stability. Contents of copper particles in the composites were varied from 0 to 70% by volume. It was observed that the copper particle/meta aramid resin composites showed good adhesion after the tests at $320^{\circ}C$. The specimen coated with the composite containing 50 vol% of copper particles showed the lowest IR emissivity, 0.6, at $320^{\circ}C$.