• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.19-24
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• 2009

Formation of an adhesion/barrier layer and a seed layer by sputtering techniques followed by electroplating has been one of the most widely used methods for the filling of through-Si via (TSV) with high aspect ratio for 3-D packaging. In this research, the adhesion and diffusion-barrier properties of the $TaN_x$ film deposited by reactive sputtering were investigated. The adhesion strength between Cu film and $SiO_2$/Si substrate was quantitatively measured by $180^{\circ}$ peel test and topple test as a function of the composition of the adhesive $TaN_x$ film. As the nitrogen content increased in the adhesive $TaN_x$ film, the adhesion strength between Cu and $SiO_2$/Si substrate increased, which was attributed to the increased formation of interfacial compound layer with the nitrogen flow rate. We also examined the diffusion-barrier properties of the $TaN_x$ films against Cu diffusion and found that it was improved with increasing nitrogen content in the $TaN_x$ film up to N/Ta ratio of 1.4.

• Journal of Adhesion and Interface
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• v.12 no.3
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• pp.88-93
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• 2011

Optimal dispersion and fabrication conditions of carbon nanotube (CNT) embedded in phenolic resin were determined by electrical resistance measurement; and interfacial property was investigated between plasma treated carbon fiber and CNT-phenolic composites by electro-micromechanical techniques. Wettability of carbon fiber was improved significantly after plasma treatment. Surface energies of carbon fiber and CNT-phenolic nanocomposites were measured using Wilhelmy plate technique. Since surface activation of carbon fiber, the advancing contact angle decreased from $65^{\circ}$ to $28^{\circ}$ after plasma treatment. It was consistent with static contact angle results of carbon fiber. Work of adhesion between plasma treated carbon fiber and CNT-phenolic nanocomposites was higher than that without modification. The interfacial shear strength (IFSS) and apparent modulus also increased with plasma treatment of carbon fiber.

• Applied Chemistry for Engineering
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• v.24 no.2
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• pp.148-154
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• 2013

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.

• Journal of Adhesion and Interface
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• v.6 no.3
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• pp.1-9
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• 2005

This study investigated the influence of atmospheric plasma factors such as RF power, treatment time, the gap distance between discharge and sample, and the gas flow rate of Ar on the surface property by using the design of experiment (DOE) method. The plasma treatment time (s), plasma power (W), gap distance (mm) between discharge and sample, and flow rate of Ar gas were in order of important factors for changing the surface free energy of PMMA plates. As a result, the most effective factor for improving the surface free energy of PMMA plates is the distance (mm) from discharge glow to sample plate. Because of the interaction between plasma power (W) and treatment time (s), the power dose (J) factor which multiply plasma power (W) by treatment time (s) should be significantly considered. The optimum condition for maximizing the surface free energy of PMMA plate was found at 1500J of power dose. Through XPS and AFM analysis, we also observed the change of chemical composition, surface morphology and roughness before and after plasma treatment. It is considered that the change of surface free energy of PMMA plate with plasma treatment is influenced by the introduction of polar functional group as well as the increase of surface roughness.

• Journal of Adhesion and Interface
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• v.18 no.1
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• pp.13-24
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• 2017

In this study, nanoparticles which encapsulated hydrophobic antimicrobial compounds with 50wt% of payload and 70%of solid content were prepared. These nanoparticles could be dispersed at water as well as various medium. Water dispersible organic-inorganic (O-I) hybrid nanoparticles were first prepared using alkoxysilane-functionalized amphiphilic polymer precursors through a conventional sol-gel process. Hydrophobic antimicrobial compound, Eugenol encapsulated nanoparticles were prepared using these O-I hybrid nanoparticles through a new nanoprecipitation process. The effect of various preparation on the size of nanoparticles, amount of payload, antimicrobial activity, and release rate of encapsulated compounds was investigated. All eugenol-encapsulated O-I nanoparticles regardless of preparation condition showed the same minimal inhibitory concentration (MIC) (50mg/ml) and 99% of antimicrobial activity for every strain. Their antimicrobial activity could maintain longer than two weeks. Especially, eugenol-encapsulated O-I nanoparticles prepared using tetraethoxysilane (TEOS) exhibited the highest payload (50wt%) and the lowest release rate which was owing to higher inorganic content in the O-I nanoparticles. And these O-I nanoparticles dispersed in hexanediol (HD) showed the highest antimicrobial activity and solid content (70wt%) because HD acted as a solvent as well as a antimicrobial agent.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2011.03a
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• pp.29-29
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• 2011

아라미드 섬유는 열에 강한 튼튼한 방향족 폴리아마이드 섬유이다. 아마이드는 "85%이상의 아미드(CO-NH)기가 두 개의 방향족 고리에 직접 연결된 합성 폴리아미드로부터 제조된 섬유"로 정의된다. 아라미드 섬유는 크게 파라계와 메타계로 대별되는데 본 연구에서 사용한 파라계 아라미드는 인장강도, 강인성, 내열성이 뛰어나며 고강력 고탄성률을 지니고 있다. 일반적인 유기 섬유와는 다른 우수한 성질을 바탕으로 부직포, UD laminatig, staple 등의 형태로 크게 섬유보강 고무 복합재료 등의 각종 복합재료, 로프, 케이블, 방탄방호용과 같은 산업자재의 용도로 자동차, 우주항공, 정보통신, 국방, 등 다양한 관련 산업분야에서 사용이 확대되고 있는 고부가 소재이며 가격대비 성능비가 우수하기 때문에 세계적으로 산업용 섬유 및 초고성능 섬유시장에서 비중이 증가될 것으로 예상되고 있다. 본 연구에서는 Para-Aramid 필라멘트를 이용하여 ATY를 생산할 때 제조공정조건에 따른 ATY 물성을 알아보고 고강도를 요구하는 방화복, 고무 보강용 섬유 등의 소재에 맞는 ATY 사가공 최적공정조건을 도출하여 체계화된 data-base를 구축하여 생산성 향상 및 품질개선과 함께 산업자재용 직물개발에 응용하고자 한다. 아라미드를 ATY로 제조할 경우, 표면에 생기는 loop로 인하여 타소재와 접착시, 접착제 담지 성능이 향상되어 접착력이 상승되는 반면, 아라미드 ATY가 기존의 아라미드의 물성보다 저하되는 약점을 가지고 있으므로 이를 보완하기 위해 본 연구에서는 ATY 제조공정에서 중요 공정인자인 사속, heater 온도, over feed ratio를 변화시켜 시료를 제조하여 이들의 물성을 분석하여 최적의 물성을 갖는 ATY 사가공 공정을 도출함으로써 물성이 저하되는 문제를 보완 가능할 것으로 기대된다. 물성분석은 강신도, 초기탄성률을 각각 측정하여 인장특성을 확인하였으며, 습열수축률과 건열수축률을 측정하여 시료의 열수축률에 대해 측정을 하였다. 표면의 루프 발현 정도를 보기 위하여 Crimp Rigidity(CR%), 형태 불안정성(instability)등을 측정하였으며, 영상 현미경 시스템을 사용하여 ${\times}40$ 배율로 표면특성을 측정하였다.

• Journal of Conservation Science
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• v.34 no.6
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• pp.595-604
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• 2018

In this study, in a bid to develop natural bioadhesives for paper craft, the hanji industry, and preserving cultural assets, complex polysaccharides were extracted from brown and red algae and used as an ingredient in adhesives. Brown algae include sea trumpet, kelp, sea oak, and sea mustard, whereas red algae include Pachymeniopsis elliptica agar-agar weed, Gloiopeltis tenax, and hunori. The polysaccharides were extracted after transforming them from non-aqueous Ca complexes contained in each of the brown and red algae into water-soluble polysaccharides containing alkali metals with a solubility level of 1. and extracted Subsequently, only the polysaccharides were extracted using alcohol precipitation. The adhesion tensile strengths of kelp, a brown algae, and Pachymeniopsis elliptica, a red algae, were 21.58 and 32.99 kgf, respectively. They thus demonstrated better adhesion than that of solid glue products such as water plants (18.45 kgf) and glue sticks (20.45 kgf). The extraction yield of these polysaccharides is supposed to be determined according to their extracted environments; however, no difference in adhesion strength was seen. Further, it was found that the shapes of polysaccharides were determined by their growing environment instead of extraction environment. Use of multi-step alcohol precipitation method during extraction enabled the removal of the constituents except protein and other polysaccharides, thereby demonstrating a stable outcome without cultivation of mold. Furthermore, there was no occurrence of mold even after production of the adhesives by the simple solution method, which demonstrates the adhesive's potential as an environment-friendly adhesive material.

• Korean Chemical Engineering Research
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• v.45 no.2
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• pp.149-154
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• 2007

Nanoimprint lithography (NIL) is useful technique because of its low cost and high throughput capability for the fabrication of sub-micrometer patterns which has potential applications in micro-optics, magnetic memory devices, bio sensors, and photonic crystals. Usually, a chemical surface treatment of the stamp is needed to ensure a clean release after imprinting and to protect the expensive original master against contamination. Meanwhile, adhesion promoter between resin and substrate is also important in the nanoscale pattern. In this work, we have investigated the effect of surface treatment using silane coupling agent as release layer and adhesion promoter for UV-Nanoimprint lithography. Uniform SAM (self-assembled monolayer) could be fabricated by vapor deposition method. Vapor phase process eliminates the use of organic solvents and greatly simplifies the handling of the sample. It was also proven that 3-acryloxypropyl methyl dichlorosilane (APMDS) could strongly improve the adhesion force between resin and substrate compared with common planarization layer such as DUV-30J or oxygen plasma treatment.

• Journal of the Korean Wood Science and Technology
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• v.44 no.5
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• pp.617-621
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• 2016

On-site survey on glue-laminated board (GLB) manufacturers of Malaysia, Indonesia, and China was conducted to identify the cause of interception of regulated pest from imported GLBs from those countries, and to suggest optimal manufacturing processes of GLB for preventing quarantine risk associated with imported GLBs. The cause of pest interception was improper manufacturing processes, such as air drying or inadequate kiln drying of green laminae, improper storage of dried laminae before finger jointing and edge gluing, and/or incomplete packing of GLBs. In particular, Paulownia GLB manufacturing processes used in China, including air drying of laminae, were mostly poor in terms of preventing quarantine risk associated with imported GLBs. From now on, for preventing quarantine risk associated with imported GLBs, importers have to ask foreign manufacturers spontaneously to use proper manufacturing processes (adequate kiln drying of green laminae, proper storage of dried laminae, and complete packaging of final GLBs).

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.13-16
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• 2013

A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.