• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.150-153
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• 2006

점탄성 복합재는 간단한 작업으로 큰 감쇠 효과를 볼 수 있어 사용이 날로 늘어나고 있다. 그런데 점탄성 복합재의 특성은 온도에 민감하게 반응하며 변화한다. 그러므로 점탄성 복합재의 모드해석 시 온도 변화에 따른 해석이 필요하다. 본 논문에서는 한쪽면에 점탄성재를 부착한 Oberst beam을 일단고정 상태로 설치하여 실험 온도를 $-15{\sim}45^{\circ}C$로 변화시켜가며 전달함수를 이용하여 실험모드해석을 실행하였다. 그리고 온도 차이에 따른 모드형상을 비교하였다.

• Composites Research
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• v.27 no.4
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• pp.174-181
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• 2014

This study describes viscoelasticity analysis of carbon-fiber reinforced polymer matrix composite material. One of the most important problem during high temperature molding process is residual stress. Residual stress can cause warpage and cracks which can lead to serious defects of the final product. For the difference in thermal expansion coefficient and change of resin property during curing, it is difficult to predict the final deformed shape of carbon-fiber reinforced polymer matrix composite. The consideration of chemical shrinkage can reduce the prediction errors. For this reason, this study includes the viscoelasticity and chemical shrinkage effects in FE analysis by creating subroutines in ABAQUS. Analysis results are compared with other researches to verify the validity of the subroutine developed, and several stacking sequences are introduced to compare tested results.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Journal of the Korea Institute of Military Science and Technology
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• v.21 no.1
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• pp.25-39
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• 2018

In this paper, an integrated analysis model for evaluating the underwater acoustic performance of the multilayered acoustic coatings containing visco-elastic composite layers with hollow glass microspheres is described. The model uses the effective medium theory considering the acoustic scattering and resonance effects of the inclusions. Also, the model incorporates the compressive deformation mechanism associated with hydrostatic pressure. The technique developed in this work was used as the acoustic layer design and performance analysis tools for the practical hull coatings and acoustic baffles in Korean next generation submarines.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• Aerospace Engineering and Technology
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• v.3 no.1
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• pp.257-266
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• 2004

A three node triangular element with drilling rotations incorporating improved higher-order zig-zag theory(HZZT) is developed to accurately assess the stress distribution through thickness of the laminated plate and analyze the vibration of pretwisted composite plates with embedded damping layer. Shear force matching conditions are enforced along the interfaces between the embedded damping patch and the border patch. The natural frequencies and model loss factors are calculated for cantilevered pretwisted composite blade with damping core with the present triangular element, and compared to experiments and MSC/NASTRAN using a layered combination of plate and solid elements.

• Aerospace Engineering and Technology
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• v.4 no.1
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• pp.9-17
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• 2005

The aeroelastic stability enhancement of composite hingeless rotor system through the structural damping increase has been investigated. In order to increase structural damping of the rotor system, constrained layer damping (CLD) treatment is applied to the composite flexures. Modal analysis of composite flexures with attached viscoelastic and constraining layers are performed using MSC/NASTRAN, and the effectiveness of CLD treatments are validated through modal test. The composite flexures with CLD are applied to a hingeless rotor system. The rotor system is tested in hovering condition and it is shown that in-plane damping is increased by means of CLD treatments.

• Composites Research
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• v.12 no.2
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• pp.1-9
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• 1999

The piezoelectric material connected to external electric networks possesses frequency dependent stiffness and loss factor which are also affected by the shunting circuit. The external electric networks are generally specialized for two shunting circuits: one is the case of a resistor alone and the other is the combination of a resistor and an inductor. For resistive shunting, the material properties exhibit frequency dependency similar to viscoelastic materials, but are much stiffer and more independent of temperature. Shunting with a resistor and inductor introduces an electrical resonance, which can change the characteristics of structural resonance optimally in a manner analogous to a PMD (proof mass damper). Passive damping enhancement of composite beam using piezoelectric material connected to external electrical networks is achieved and presented in this paper.

• Composites Research
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• v.34 no.6
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• pp.426-433
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• 2021

The carbon fiber reinforced plastic manufacturing process has a problem in that a dimensional error occurs due to thermal deformation such as residual stress, spring-in, and warpage. The main causes of thermal deformation are various, including the shape of the product, the chemical shrinkage, thermal expansion of the resin, and the mold effect according to the material and surface condition of the mold. In this study, a viscoelastic model was applied to the plate model to predict the thermal deformation. The effects of chemical shrinkage and thermal expansion of the resin, which are the main causes of thermal deformation, were analyzed, and the analysis technique of the 3-D viscoelastic model with and without mold was also studied. Then, the L-shaped mold effect was analyzed using the verified 3D viscoelastic model analysis technique. The results show that different residual deformation occurs depending on the surface condition even when the same mold is used.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.8
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• pp.1653-1665
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• 2002

One of the most significant problems in the processing of composite materials is residual stresses. The residual stresses may be high enough to cause cracking in the matrix even before external loads are applied and can degrade the integrity of composite structures. In this study, thermo-viscoelastic residual stresses occurred in the polymeric composite cylinder are investigated. This type of structure is used for the launch vehicle fuselage. The time and degree of cure dependent thermo-viscoelastic constitutive equations are developed and coupled with a thermo-chemical process model. These equations are solved with the finite element method to predict the residual stresses in the composite structures during cure. A launch vehicle experiences high thermal loads during flight and re-entry due to aerodynamic heating or propulsion heat, and the thermal loads may cause thermal buckling on the structure. In this study the thermal buckling analysis of composite cylinders are performed. Two boundary conditions such as all clamped and all simply supported are used for the analysis. The effects of laminates stacking sequences, shapes and residual stresses on the critical buckling temperatures of composite cylinders are investigated. The thermal buckling analysis is performed using ABAQUS.