• Proceedings of the Korea Committee for Ocean Resources and Engineering Conference
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• 2006.11a
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• pp.150-153
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• 2006

점탄성 복합재는 간단한 작업으로 큰 감쇠 효과를 볼 수 있어 사용이 날로 늘어나고 있다. 그런데 점탄성 복합재의 특성은 온도에 민감하게 반응하며 변화한다. 그러므로 점탄성 복합재의 모드해석 시 온도 변화에 따른 해석이 필요하다. 본 논문에서는 한쪽면에 점탄성재를 부착한 Oberst beam을 일단고정 상태로 설치하여 실험 온도를 $-15{\sim}45^{\circ}C$로 변화시켜가며 전달함수를 이용하여 실험모드해석을 실행하였다. 그리고 온도 차이에 따른 모드형상을 비교하였다.

• Composites Research
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• v.27 no.4
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• pp.174-181
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• 2014

This study describes viscoelasticity analysis of carbon-fiber reinforced polymer matrix composite material. One of the most important problem during high temperature molding process is residual stress. Residual stress can cause warpage and cracks which can lead to serious defects of the final product. For the difference in thermal expansion coefficient and change of resin property during curing, it is difficult to predict the final deformed shape of carbon-fiber reinforced polymer matrix composite. The consideration of chemical shrinkage can reduce the prediction errors. For this reason, this study includes the viscoelasticity and chemical shrinkage effects in FE analysis by creating subroutines in ABAQUS. Analysis results are compared with other researches to verify the validity of the subroutine developed, and several stacking sequences are introduced to compare tested results.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.2
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• pp.17-28
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• 2012

It is known that thermo-mechanical properties of solder material and molding compound in WB-PBGA packages are considerably affected by not only temperature but elapsed time. In this paper, finite element analysis (FEA) taking material nonlinearity into account was performed for more reliable prediction on deformation behavior of a lead-free WB-PBGA package, and the results were compared with experimental results from moire interferometry. Prior to FEA on the WB-PBGA package, it was carried out for two material layers consisting of molding compound and substrate in terms of temperature and time-dependent viscoelastic effects of molding compound. Reliable deformation analysis for temperature change was then accomplished using viscoplastic properties for solder ball and viscoelastic properties for molding compound, and the analysis was also verified with experimental results. The result showed that the deformation of WB-PBGA packages was strongly dependent on material model of molding compound; thus, temperature and time-dependent viscoelastic behavior must be considered for the molding compound analysis. In addition, viscoelastic properties of B-type molding compound having comparatively high glass transition temperature of $135^{\circ}C$ could be recommended for reliable prediction on deformation of SAC lead-free WB-PBGA packages.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1993.10a
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• pp.191-196
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• 1993

본 연구에서는 이러한 방진궤도의 성능을 파악하고 또 적절한 방진궤도의 설계를 위하여 먼저 모형화하는 방법을 제시하였다. 이를 위해서는 궤도를 구성하는 방진요소의 특성을 결정하는 것이 필수적이므로 현재 사용되고 있 는 점탄성 방진재에 대하여 주파수, 온도, 초기 변형률, 동적변형률등 여러가 지 인자에 대한 물성치를 구하였으며, 이를 이용하여 궤도계의 진동전달 특 성을 파악하고 고찰하였다.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2013.04a
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• pp.237-238
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• 2013

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1995.04a
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• pp.292-297
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• 1995

본 연구에서는 점탄성 제진층이 탄성기판의 한 면에 피복된 2층 제진강파느이 모달 손실계수의 관점으로부터 부분도포에 의한 최적설계의 가능성을 검토하였다. 즉, 일정한 두께로 전면 도포되어 있는 2층의 제진층을 작은 크기의 조각(piece)으로 분할한 경우, 각각의 조각이 손실계수에 미치는 영향을 손실계수의 증감율로써 평가하고, 최소 영향부위의 조각을 최대 영향부위에 이동하여, 동일 질랴의 제진재로 최대의 제진효과를 얻을 수 있는 제진재의 최적 설계법을 제안한다. 수치계산은 주변고정 평판의 (1,1)(1,2)(1,3) 모드 성분에 대해 수행하여 최적설계에 의한 손실계수의 증가와 그때 제진재의 배열형상을 조사하였다. 본 수법에 의해 얻어진 결과는 실험결과와 비교 검토하여 본 최적화 수법의 타당성을 확인하였다. 또한, 제진재의 전면도포의 경우는 Ross-Ungar-Kerwin모델에서도 계산을 수행하여 본 수법의 결과와 비교하였다.

• Journal of the Korean Geosynthetics Society
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• v.12 no.2
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• pp.25-33
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• 2013

This study introduces strength characteristics of the anti-washout grouting material using viscous modifiers and its characteristics mixed with coarse materials. Especially, this study focused on the strength characteristics of the grouts mixed with sea water. It is found that the anti-washout grout mixed with sea water has enough strength and good resistance to segregation just like that with fresh water. Also, a small scale test was performed to evaluate the solidification characteristic of the anti-washout grout mixed with coarse fill materials. It is also found that the strength of anti-washout grout mixed with coarse fill materials is greater and better segregation resistance than those of conventional grout with fill materials.

• Journal of the Korea Institute of Military Science and Technology
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• v.21 no.1
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• pp.25-39
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• 2018

In this paper, an integrated analysis model for evaluating the underwater acoustic performance of the multilayered acoustic coatings containing visco-elastic composite layers with hollow glass microspheres is described. The model uses the effective medium theory considering the acoustic scattering and resonance effects of the inclusions. Also, the model incorporates the compressive deformation mechanism associated with hydrostatic pressure. The technique developed in this work was used as the acoustic layer design and performance analysis tools for the practical hull coatings and acoustic baffles in Korean next generation submarines.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.2
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• pp.245-253
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• 2010

The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

• 대한치과보철학회:학술대회논문집
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• 2002.11a
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• pp.101-102
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• 2002