• Title/Summary/Keyword: 절연 저항

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A Study on the Ohmic Contacts and Etching Processes for the Fabrication of GaSb-based p-channel HEMT on Si Substrate (Si 기판 GaSb 기반 p-채널 HEMT 제작을 위한 오믹 접촉 및 식각 공정에 관한 연구)

  • Yoon, Dae-Keun;Yun, Jong-Won;Ko, Kwang-Man;Oh, Jae-Eung;Rieh, Jae-Sung
    • Journal of IKEEE
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    • v.13 no.4
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    • pp.23-27
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    • 2009
  • Ohmic contact formation and etching processes for the fabrication of MBE (molecular beam epitaxy) grown GaSb-based p-channel HEMT devices on Si substrate have been studied. Firstly, mesa etching process was established for device isolation, based on both HF-based wet etching and ICP-based dry etching. Ohmic contact process for the source and drain formation was also studied based on Ge/Au/Ni/Au metal stack, which resulted in a contact resistance as low as $0.683\;{\Omega}mm$ with RTA at $320^{\circ}C$ for 60s. Finally, for gate formation of HEMT device, gate recess process was studied based on AZ300 developer and citric acid-based wet etching, in which the latter turned out to have high etching selectivity between GaSb and AlGaSb layers that were used as the cap and the barrier of the device, respectively.

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Analysis of Deterioration Characteristics by Filtering Processes at 6.6kV Power Cable Systems in Operation (운전 중인 6.6kV 전력 케이블 시스템의 필터링 과정에 의한 열화 특성 해석)

  • Um, Kee-Hong;Lee, Kwan-Woo
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.14 no.4
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    • pp.205-211
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    • 2014
  • With a development of modern industry, demand for electric power is rapidly increasing and the capacity of power transfer is required to become bigger and bigger. At power station, the high-voltage power cable is used as the only method in order to transfer electric power. In this paper, we have analyzed the deterioration characteristics of 6.6kV power cable systems in operation. For the time duration of 2000 days, we have measured the cable in operation in order to extract the data for the deterioration characteristics. By analyzing the data by means of several steps of filtering processes, we could obtain the linear relations of insulation resistances as a function of time. Furthermore, we can verify that the progress characteristics in deterioration process of 6.6kV power cable systems follows the process of heat deterioration.

Developing Equipment to Detect the Deterioration Status of 6.6kV Power Cables in Operation at Power Station (발전소에서 운전 중인 활성 6.6kV 전력 케이블의 고장상태를 파악하는 장치의 개발)

  • Um, Kee-Hong;Lee, Kwan-Woo
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.14 no.4
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    • pp.197-203
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    • 2014
  • The technology to predict and prevent an accident of the cable system in power station is required. The techniques of inactivated diagnosis, partial discharge and $tan{\delta}$, have been adopted to diagnoze the operating characteristics of cables, but it is not so easy to find out problems in cables in an inactive state before the cable accident happens. In this paper, we did a research on the 6.6kV high-power cables, installed at Korean Western Power Station Co., Ltd. in order to diagonize the cables, playing a major role at the station. We have developed an equipment to measure an insulation resistance based on the temperature and current of the cable. By installing the system in a power station, we could find abnormal status for evaluation of the lifetime. In the short term, by analyzing the data, we apply the research result to the diagnosis and evaluation of the 6.6kV power cables. In the long run, however, we plan to reduce the cost of the installation and operation of cable systems at power stations.

High Temperature Silicon Pressure Sensor of SDB Structure (SDB 구조의 고온용 실리콘 압력센서)

  • Park, Jae-Sung;Choi, Deuk-Sung;Kim, Mi-Mok
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.6
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    • pp.305-310
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    • 2013
  • In this paper, the pressure sensor usable in a high temperature, using a SDB(silicon-direct-bonding) wafer of Si/$SiO_2$/Si-sub structure was provided and studied the characteristic thereof. The pressure sensor produces a piezoresistor by using a single crystal silicon as a first layer of SDB wafer, to thus provide a prominent sensitivity, and dielectrically isolates the piezoresistor from a silicon substrate by using a silicon dioxide layer as a second layer thereof, to be thus usable even under the high temperature over $120^{\circ}C$ as a limited temperature of a general silicon sensor. The measured result for a pressure sensitivity of the pressure sensor has a characteristic of high sensitivity, and its tested result for an output of the sensor further has a very prominent linearity and hysteresis characteristic.

Preparation of $Pb(Zr,\;Ti)O_3$ thin films by MOCVD using ultrasonic spraying (초음파분무를 이용한 MOCVD법에 의한 $Pb(Zr,\;Ti)O_3$박막의 제조)

  • Kim, Dong-Young;Lee, Choon-Ho;Park, Sun-Ja
    • Korean Journal of Materials Research
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    • v.2 no.1
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    • pp.43-51
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    • 1992
  • Thin films of )$Pb(Zr, \;TiO_3$ are fabricated by MOCVD using ultrasonic spraying. The films having perovskite structure are made at low deposition temperature, $300-450^{\circ}C$. The phase and composition of the films vary with the composition of the starting solution and the deposition temperature. Dielectric constant of the films is 187 at 1MHz. Ferroelectric hysterysis loop measurements indicate a remanant polarization of $5.5{\mu}C/cm^2$, and coercive field of 65kV/cm. Resistivity of thin films is about $10^{11}{\Omega}cm$ and the breakdown electric field abort 35kV/cm.

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A Study on the Analysis of Heat and Metallurgical Structure of Connection Parts for Residual Current Protective Devices (저압용 누전차단기 접속부의 발열 및 금속 조직 분석에 관한 연구)

  • Choi Chung-Seog;Shong Kil-Mok;Kim Dong-Ook;Kim Dong-Woo;Kim Young-Seok
    • Fire Science and Engineering
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    • v.18 no.4
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    • pp.57-63
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    • 2004
  • We investigated heat properties of connection terminal in residual current protective devices(RCD) according to contact pressure for low voltage appliance. And we analyzed voltage and current waveform and oxide propagation when the poor-contact happened between terminal and wire. When contact pressure between terminal and connection wire was not applied, the heat was generated and an oxide was formed on the surface of the wire. The temperature of the insulation surrounding terminal was ascended sharply by poor-contact, micro-sparks and continuous arc sound happened in interior terminal. When the poor-contact by vibration occurred inner conductor of terminal and wire, an oxide was propagated on contact surface and the temperature was increased at 869℃. Thus, we found that the risk of electrical disaster is high in terminal and connection wire parts.

Implementation of a DSP Based Fuel Cell Hardware Simulator (DSP기반 연료전지 하드웨어 시뮬레이터 구현)

  • Oum, Jun-Hyun;Lim, Young-Cheol;Jung, Young-Gook
    • Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.23 no.1
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    • pp.59-68
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    • 2009
  • Fuel cell generators as the distributed generation system with a few hundred watt$\sim$a few hundred kilowatt capacity, can supply the high quality electric power to user as compared with conventional large scale power plants. In this paper, PEMFC(polymer electrolyte membrane fuel cell) generator as micro-source is modelled by using PSIM simulation software and DSP based fuel cell hardware simulator based on the PSIM simulation model is implemented. The relation of fuel cell voltage and current(V-I curve) is linearized by first order function on the ohmic area in voltage-current curve of fuel cell. The implemented system is composed of a PEMFC hardware simulator, an isolated full bridge dc boost converter, and a 60[Hz] voltage source PWM inverter. The voltage-current-power(V-I-P) characteristics of the implemented fuel cell hardware simulator are verified in load variation and transient state and the 60[Hz] output voltage sinusoidal waveform of the PWM inverter is investigated under the resistance load and nonlinear diode load.

Electrical Properties and Preparation of 6FDA/4-4'DDE Polyimide Thin films by Bapor Deposition Polymerization method (진공증착중합법을 이용한 6FDA/4-4'DDE 폴리이미드 박막의 제조와 전기적 특성)

  • 이붕주;김형권;이덕출
    • Journal of the Korean Vacuum Society
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    • v.7 no.3
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    • pp.229-236
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    • 1998
  • In this paper, thin films of Polyimide (PI) were fabricated by vapor deposition polymerization method (VDPM) of dry processes. The film's properties with curing temperature and electrical properties were studies. The synthesis of hexafluoroisopropyliden-2,2-bis[phthalic anhydride](6FDA) and 4, 4'-diamino diphenyl ether (DDE) was carried out by vapor deposition polymerization(VDP) with the same deposition rate. The evaporation temperature of 6FDA and DDE were $214^{\circ}C$ and $137^{\circ}C$, respectively, so as to preserve balance of stoichiometry. The polymic acid (PAA) made by VDPM were changed to PI by thermal curing. The uniformity and density of PI thin films were increased according to increasing curing temperature. The relative permittivity and dissipation loss factor were 3.7 and 0.008 at the frequency of 100Hz~200KHz, respectively, for the fabricated in the curing temperature of $300^{\circ}C$. Also, the resistivity was about 1.05$\times$$ 10^{15}$$\Omega$cm at $30^{\circ}C$.

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(CyOz)-SiHx 전구체로 중착된 저유전상수 유동박막의 산소 분압에 따른 특성 연구

  • Lee, Chae-Min;O, Hyo-Jin;Kim, Hun-Bae;Park, Ji-Su;Park, Dae-Won;Jeong, Dong-Geun;Kim, Dae-Gyeong;Chae, Hui-Yeop
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.344-344
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    • 2013
  • 칩의 크기가 감소함에 따라 RC (Resistance, Capacitance) 지연, 전력소비증가 및 신호잡음 등이 문제가 되어왔다. RC지연 문제는 배선에 알루미늄 보다 비저항이 낮은 구리를 사용하고 절연막으로 유전상수가 낮은 물질을 사용하여 개선될 수 있다. 이와 같은 맥락에서 점차 저유전상수 박막의 필요성은 증가하고 있다. 그러므로 이를 개선하기 위해 저 유전상수 값을 가지는 물질을 개발 혹은, UV나 플라즈마 그리고 열을 이용하여 처리하는 연구가 절실히 요구되고 있으며, 현재 많은 연구가 진행되고 있다. 이 논문에서 저유전박막은 HDP-CVD (High Density Plasma Chemical Vapor Deposition) 시스템에서 (CyOz)-SiHx와 O2의 비율을 각각 변화시키면서 증착 되었다. (CyOz)-SiHx와 O2의 비율은 60/150, 60/180, 60/210, 60/240로 증가하면서 증착하였다. 그리고 surface profilometer을 이용하여 박막의 증착율을 측정하고 LCR meter를 이용하여 정전용량을 측정하여 유전상수 값을 얻었다. 박막의 화학적 조성과 구조는 FTIR (Fourier Transform Infrared Spectroscopy)로 측정하였다. 박막의 유동 특성은 SEM (Scanning electron microscope) 이미지로 살펴보았다.

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Fabrication and Characteristics of FET-type Pressure Sensor Using Piezoelectric PZT Thin Film (압전체 PZT 박막을 이용한 FET형 압력 센서의 제작과 그 특성)

  • Kim, Young-Jin;Lee, Young-Chul;Kwon, Dae-Hyuk;Sohn, Byung-Ki
    • Journal of Sensor Science and Technology
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    • v.10 no.3
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    • pp.173-179
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    • 2001
  • The currently used semiconductor pressure sensors are piezoresistive and capacitive type. Especially, semiconductor micro pressure sensors have a great deal of attention because of their small size. However, its fabrication processes are difficult, so that its yield is poor. For the purpose of resolving the drawbacks of the existing silicon pressure sensors, we demonstrate a new type of pressure sensor using PSFET(pressure sensitive field effect transistor) and investigate its operational characteristics. We used PZT(Pb(Zr,Ti)$O_3$) as a pressure sensing material. PZT thin films were deposited on a gate oxide of MOSFET by an rf-magnetron sputtering method. To abtain the stable phase, perovskite structure, furnace annealing technique have been employed in PbO ambient. The sensitivity of the PSFET was 0.38 mV/mmHg.

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