• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1277-1280
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• 2005

A high-aspect-ratio and high-resolution stainless steel shadow mask for organic thin-film transistors (OTFTs) circuit has been fabricated by a new method which combines photochemical machining, micro-electrical discharge machining (micro-EDM), and electrochemical etching (ECE). First, connection lines and source-drain holes are roughly machined by photochemical etching, and then the part of source and drain holes is finished by the combination of micro-EDM and ECE processes. Using this method a $100\;\mu{m}$ thick stainless steel (AISI 304) shadow mask for inverter can be fabricated with the channel length of $30\;\mu{m}\;and\;10\;\mu{m}\;respectively.\;The\;width\;of\;connection line\;is\;150\;\mu{m}$. The aspect ratio of the wall is about 5 and 15, respectively. Metal lines and source-drain electrodes of OTFTs were successfully deposited through the fabricated shadow mask.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3307-3309
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• 1999

Electrochemical discharge machining (ECDM) is a very recent technique in the fabrication of the micro-electro-mechanical system ( MEMS ) devices. This paper presents the experimental results of the machining of micro-holes on pyrex glass substrates by use of ECDM. Electrolyte is used with a KOH aqueous solution, cathode with copper, anode with platinum, and tool feed system is applied with gravity feed system. Already established experimental results were taken under the condition of constant voltage frequency. However in this paper, the effect of variation of the voltage frequency and duty ratio is considered. In this experiment, it is measured the ECDM performances with variation of the voltage frequency and duty ratio under the conditions of constant other machining variables. ECDM performances are described by the hole depth, and the top hole diameter.