• The Bulletin of The Korean Astronomical Society
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• v.43 no.1
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• pp.40.1-40.1
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• 2018

외계행성 탐색시스템 18k 모자이크 CCD 카메라는 4개의 9k CCD로 구성되며 총 32개 채널의 영상영역과 리드아웃 회로를 가진다. 관측 영상에는 각 영상영역에 대한 오버스캔(overscan) 영역이 포함되는데, 영상 신호에 의한 오버스캔 영역의 바이어스(bias) 교란을 최소화하기 위해 리드아웃 회로의 인버팅 앰프에 대한 Common Mode Rejection Ratio(CMRR)를 미세 조정하였다. 그 결과 세 사이트의 평균 CMRR이 55 dB에서 73 dB로 향상되었고, 기존에는 영상 신호에 따른 오버스캔 바이어스 레벨의 선형적 관계가 약 2/1,000의 기울기를 가졌으나 조정 후에는 약 2/10,000로 바이어스 오차가 줄어들었다. CCD 리드아웃 회로의 미세조정과 클락(clock) 개선을 통해 물결무늬 잡음 제거 및 읽기 잡음 감소가 이루어졌으며, 향후의 추가적인 바이어스 안정화와 크로스톡 개선 방안이 검토되고 있다. 카메라 전자부 조정 과정 및 결과와 더불어, 카메라 듀어와 부대장비 유지보수, Polycold CryoTiger 냉각기 운영 및 개선 관련 노하우도 함께 발표한다.

• Journal of Fisheries and Marine Sciences Education
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• v.16 no.2
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• pp.210-217
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• 2004

Cooling technology has been a vital prerequisite for the rapid, if not explosive, growth of the electronic equipment industry. This has been especially true during the last 20 years with the advent of intergrated circuit chips and their applications in computers and related electronic products. The purpose of this study is to develop a telecommunication equipment cooling system using a thermoelectric module combined with cooling fan. Thermoelectric module is a device that can perform cooling only by input of electric power. In the present study, the cooling package using the thermoeletric module has been developed to improve the thermal performance. The cooling characteristics of the electronic chip was placed into the subrack and it can be rapidly assembled or disassembled in the equipment rack. As a preliminary experiment, the cooling performances between a conventional way using a cooling fin and a proposed method applying the thermoelectric module was comosed and analyzyed. The cooling performance at a simulated electronic component packaging a thermomodule operated well.

• Journal of the Institute of Electronics and Information Engineers
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• v.53 no.6
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• pp.155-166
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• 2016

It is important to configure capacitance(C) of the capacitor and the induction coefficient(L) of the work coil on the resonant circuit design stage in order to induce heating on the object by a precise and constant frequency components in the electromagnetic induction heating equipment. Work coil conducts a direct induction heating according to heating point and area of the object which has a fixed heat factor so that work coil is designed to has fixed value. On the other hands, Capacitor should be designed to be changed in order to be the higher the utilization of the entire equipment. It is extracted the samples by variation of single electrode capacity from the selection stage of raw materials for capacity to the stage of process design for output of the high frequency LC resonance of 700kHz on 1000 VAC maximum voltage and current to $200I_{MAX}$. It is suggested fundamental experiment results in order to prove relation for the optimal design of HF-LC resonance conduction-cooled capacitor based on the response of frequency characteristics and results of output parameters according to variation of the capacitance size.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.9
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• pp.5467-5473
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• 2014

This study examined the numerical analysis results with respect to the thermal behavior of a natural convection cooled pin-fin heat sink. The heat sink consisted of pin fins integrated with plate fins. The heat sinks were designed with two different types to fit the limited internal space. The two types of heat sinks designed were analyzed using the ANSYS software package, and the numerical analysis results were compared with the cooling performance of the two types of heat sinks. The results of the simulation were analyzed according to the temperature distribution and air flow characteristics, heat flux etc. This study examined the correlation of the cooling performance with the heat sink internal structure and fin shape. FEM (Finite Element Method) confirmed the cooling performance of heat sink type A under natural convection conditions as the best results. The results of the numerical simulation showed that the heat sink type A shape showed an approximately 70 percent better heat transfer rate with natural convection than that of type B.

• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.12
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• pp.1415-1420
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• 2014

3D printer is based on an additive manufacturing technology, which helps in creating the three-dimensional object using a 3D drawing. It is used in various fields, because it prints out a variety of three-dimensional products in a short period of time. In this paper, we consider a technique using the FDM(Fused Deposition Modeling) method by dissolving the ABS(Acrylonitrile Butadiene Styrene) resin among a diversity of printing technique and materials. This kind of the 3D printer prints out a product in high temperature and cools down it. In this process, a flection phenomenon is occurred according to the size of the printing product and the surrounding environment. Conventional methods for mitigating this phenomenon maintain the temperature at the optimum level, but they require using additional devices. In order to minimize the flection phenomenon in 3D printing products without additional devices, in this paper, we propose a noble technique, which creates holes on suitable positions when they are designed by 3D drawing tools. Also, we suggest mathematical model for the proposed method, and measure and analyse a printing output using a proposed technique.

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.4
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• pp.771-779
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• 1989

Numerical analysis by SIMPLE algorithm has been performed to predict the characteristics of flow and heat transfer in channels between the printed circuit boards of an electronic cabinet. It is assumed that the electronic parts release uniform heat flux per unit axial length to the cooling air. The air flow between channels is assumed fully developed laminar, incompressible, and mixed convective. In this study, the electronic parts are mounted on both sides of the prinked circuit boards by two kinds of configuration such as the zig-zag and the symmetric one. The Rayleigh numbers ranging from 0 to 10$^{6}$ are considered to predict the characteristics of the main flow and the secondary flow occurred by natural convection, the temperature distribution in channel, the heat transfer rate from heated electronic parts and the increase of friction factor by natural convection. As the results of numerical calculation, several conclusions are drawn as follows. The influence of natural convection on the flow characteristics appears strong when the Rayleigh number is above 10$^{4}$. The main axial flow rate decreases by a half or more at the Rayleigh number of 10$^{6}$ . Although the friction factor increases as Rayleigh number increases, the increasing rate of heat transfer is higher than that of the friction factor. The cooling efficiency of the zig-zig-configuration is superior to that of the symmetric configuration at same Rayleigh number.

• Journal of the Korean Institute of Telematics and Electronics C
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• v.36C no.5
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• pp.27-37
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• 1999

A CMOS ReadOut Integrated Circuit (ROlC) for InfraRed Focal Plane Array (IRFPA) detector is presented, which is a key component in uncooled thermal imaging systems. The ROIC reads out signals from $64\times64$ Barium Strontium Titanate (BST) infrared detector array, then outputs pixel signals sequentially after amplifying and noise filtering. Various design requirements and constraints have been considered including impedance matching, low noise, low power dissipation and small detector pitch. For impedance matching between detector and pre~amplifier, a new circuit based on MOS diode structure is devised, which can be easily implemented using standard CMOS process. Also, tunable low pass filter with single~pole is used to suppress high frequency noise. In additions, a clamping circuit is adopted to enhance the signal~to-noise ratio of the readout output signals. The $64\times64$ IRFPA ROIC is designed using $0.65-\mu\textrm{m}$ 2P3M (double poly, tripple metal) N~Well CMOS process. The core part of the chip contains 62,000 devices including transistors, capacitors and resistors on an area of about $6.3-mm\times6.7-mm$.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 1995.10a
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• pp.160-164
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• 1995

정보통신 시스템의 고속/고밀도화 요구에 따라 개발되고 있는 ATM(Asynchronous Transfer Mode) 교환기 시스템은 팬을 이용한 강제대류냉각 방식의 채택과 시스템이 설치되는 장소에 따른 여러 환경조건에 의한 진동 문제가 발생될 수 있다. 시스템의 진동으로 인한 피해중 커넥터 접촉부에서 전기적 특성의 변화는 고속으로 전송되는 신호의 왜곡을 유발시킬 수 있어 시스템 개발시 이에 대한 충분한 연구 및 시험이 요구되고 있다. 진동환경에서 커넥터 접촉부는 접촉면의 상대운동으로 인한 접촉저항의 증가와 순간적인 신호전달 중단을 가져오게 되며, 특히 PCB/Connector Assembly에서 커넥터 접촉부는 PCB(Printed Circuit Board)의 장착 조건 및 동적 거동에 따라 전기적 특성이 변할 수 있다. 시스템에서 커넥터의 동적 거동을 이해하기 위해서는 PCB를 포함하는 시스템내 여러 요소의 동적 특성 이해와 복잡한 해석과정이 요구되며, 시스템 개발자는 진동 환경에서 이것의 시험 결과에 따라 커넥터의 사용을 결정해야 할 것이다. 커넥터의 전기적 특성 시험법은 IEC, EIA드 여러 국제 규격에 제시되어 있으며, 본 연구의 대상이 된 ATM교환기 시스템에서 PCB/Connector Assembly의 진동환경에서 접촉저항 측정과 관련된 접촉저항 임계치 및 측정법은 IEEE 규격 및 Bellcore 규격에 규정되어 있다. Bellcore에는 주어진 진동시험주기 전후에 IEC 규격의 LLCR(Low Level Contact Resistance) 측정회로를 이용한 측정법이 규정되어 있고, 냉각팬 및 주위 환경진동이 가해지는 동안의 영향에 대한 시험법은 규정되어 있지 않다. 본 연구에서는 한국통신의 전자장비 운용환경시험 조건의 진동에서 ATM 교환기 시스템에 사용되는 PCB/Connector Assembly 커넥터 접촉부의 접촉저항 변화와 PCB 진동에 의한 영향을 시험하였다.proach)등이 제시되었고 평면파 영역에 한하여 해서되어져 왔다. 본 논문에서는 분할 접근 방법(Segmentation Approach)을 이용하여 다공 요소로 이루어진 소음기를 해석하는데 적용하였다.로 성능 및 안정도에 영향을 미치므로 주의 깊게 선정해야 한다. 방법의 실질적인 적용에는 어려움이 있다. 본 연구에서는 기존의 방법들의 단점을 극복할 수 있는 새로운 회귀적 모우드 변수 규명 방법을 개발하였다. 이는 Fassois와 Lee가 ARMAX모델의 계수를 효율적으로 추정하기 위하여 개발한 뱉치방법인 Suboptimum Maximum Likelihood 방법[5]를 기초로 하여 개발하였다. 개발된 방법의 장점은 응답 신호에 유색잡음이 존재하여도 모우드 변수들을 항상 정확하게 구할 수 있으며, 또한 알고리즘의 안정성이 보장된 것이다.. 여기서는 실험실 수준의 평 판모델을 제작하고 실제 현장에서 이루어질 수 있는 진동제어 구조물에 대 한 동적실험 및 FRS를 수행하는 과정과 동일하게 따름으로써 실제 발생할 수 있는 오차나 error를 실험실내의 차원에서 파악하여 진동원을 있는 구조 물에 대한 진동제어기술을 보유하고자 한다. 이용한 해마의 부피측정은 해마경화증 환자의 진단에 있어 육안적인 MR 진단이 어려운 제한된 경우에만 실제적 도움을 줄 수 있는 보조적인 방법으로 생각된다.ofile whereas relaxivity at high field is not affected by τS. On the other hand, the change in τV does not affect low field profile but strongly in fluences on both inflection fie이 and the maximum relaxivity value. The results shows a fluences on both inflection field and the maximum relaxivity v

• Solar Energy
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• v.12 no.3
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• pp.70-83
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• 1992

The interaction between the surface radiation and the mixed convection transport from an isolated thermal source, with a uniform surface heat flux input and located in a rectangular enclosure, is stuied numerically. The enclosure simulates a practical system such an air cooled electric device, where an air-stream flows through the openings on the two vertical walls. The heat source represents an electric component located in such an enclosure. The size of this cavity is $0.1[m]{\times}0.1[m]$. The inlet velocity is assumed as 0.07[m/s] and the inlet temperature is maintained as $27^{\circ}C$. The inflow is kept at a fixed position. Laminar, two dimensional flow is assumed, and the problem lies in the mixed convection regime, governed by buoyancy force and surface readiation. The significant variables include the location of the out-flow opening, of the heat source and the wall emissivity. The basic nature of the resulting interaction betwwn the externally induced air stream and the buoyancy-driven flow generated by the source is investigated. As a result, the best location of the heat source to make the active heat transfer is 0.075[m] from the left wall on the floor. The trends observed are also discussed in terms of heat removal from practical systems such as electric circuitry.

• Journal of the Korea Society of Computer and Information
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• v.20 no.4
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• pp.11-16
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• 2015

Data center, not only the development of globally of cloud-based IT solutions, As the big data, education, use of development electronic equipment of communication means is increased, Demand of domestic and international data center has increased steadily. Due to the increase of data center demand, heat generation of server rack due to the development of IT equipment is also increasing continuously. Calculating heat value of the data center, because more than 99% of the power usage of IT server is converted into heat, the calorific value as the size and capacity of the server is larger will increase. In this paper, to center the cooling system of air-cooled, and research and development of air conditioning systems for energy reduction of data center, through performance analysis and simulation, it has been analyzed that there is energy savings.