• Title/Summary/Keyword: 전자 스페클 패턴 간섭법

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Ideal Phase map Extraction Method and Filtering of Electronic Speckle Pattern Interferometry (전자 스페클 간섭법에서의 이상적인 위상도 추출과 필터링 방법)

  • 강영준;이주성;박낙규;권용기
    • Journal of the Korean Society for Precision Engineering
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    • v.19 no.12
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    • pp.20-26
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    • 2002
  • Deformation phase can be obtained by using Least-Square fitting. In extraction of phase values, Least-Square Fitting is superior to usual method such as 2, 3, 4-Bucket Algorithm. That can extract almost noise-free phase and retain 2 $\pi$ discontinuities. But more fringes in phase map, 2 $\pi$ discontinuities are destroyed when that are filtered and reconstruction of deformation is not reliable. So, we adapted Least-Square fitting using an isotropic window in dense fringe. Using Sine/cosine filter give us perfect 2 $\pi$ discontinuities information. We showed the process and result of extraction of phase map and filtering in this paper.

A Study on Measurement and Analysis of In-Plane Deformations by Using Laser Speckle Interferometry (II) (레이저 스페클 간섭법을 이용한 면내 변형 측정 및 해석에 대한 연구 (II))

  • 강영준;노경완;나의균
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.12
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    • pp.113-119
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    • 1998
  • Recently Electronic Speckle Pattern Interferometry(ESPI) has been studied because it has the advantages to be able to measure the whole-field surface deformations of engineering components and materials in industrial areas with noncontact. The speckle patterns to be formed with interference phenomena of scattering light from rough surfaces illuminated by laser light have phase informations of surface deformations. In this study we used this interference phenomena and the phase shifting method to measure the inplane deformations, together with the use of digital image equipment to process the informations contained in the speckle pattern and to display consequent interferograms on TV monitor. FEA was performed before experiments and we obtained good agreement between the experimental results and FEA.

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A Study on Shape Measurement by Using Electronic Speckle Pattern Interferometry (전자 스페클 패턴 간섭법을 이용한 형상 측정에 관한 연구)

  • 강영준;김계성
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.10
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    • pp.156-164
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    • 1998
  • Electronic Speckle Pattern Interferometry(ESPI) has been used to measure surface deformations of engineering components and materials in industrial areas. ESPI, a non-contact and non-destructive technique, is capable of providing full-field results with high spatial resolution and high speed. One of the important application using electronic speckle pattern interferometry is electronic speckle contouring of a diffused object for 3-D shape analysis and topography measurement. Generally the electronic speckle contouring is suitable for providing measurement range from millimeters to several centimeters. In this study, we introduce the contouring method by modified dual-beam speckle pattern interferometer and the shift of the two illumination beams through optical fiber in order to obtain the contour fringe patterns. We also describe formation process of depth contour fringes and grid contour fringes by shifting direction of the two illumination beams. Before the experiments, we performed the geometric analysis for dual-beam-shifted ESPI contouring, and then, the electronic speckle contouring experiment with various specimens. For quantitative analysis of the contour fringes, we used 4-frame phase shifting method with PZT Finally, good agreement between the geometric analysis and experimetal results is obtained.

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Technology of Non-destructive Stress Measurement in Spot Welded Joint using ESPI Method (ESPI법에 의한 스폿 용접부의 비파괴적 응력측정 기술)

  • 김덕중;국정한;오세용;김봉중;유원일;김영호
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.1 no.1
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    • pp.23-26
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    • 2000
  • In spot welded joint. Electronic Speckle Pattern Interferometry(ESPI) method using the Model 95 Ar laser a video system and an image processor was applied to measure the stress Unlike traditional strain gauges or Moire method, ESPI method has no special surface preparation or attachments and can be measured in-plane displacement with non-contact and real time. In this experiment, specimens are loaded in parallel with a load cell. The specimens are made of the cold rolled steel sheet with 1mm thickness, are attached strain. gauges. This study Provides an example of how ESPI has been used to measure stress and strain inspecimen. The results measured by ESPI are compared with the data which was measured by strain gauge method under tensile testing.

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Improvement of Contour Fringes by using Addition of Incremental Images (화상 증분 축적법을 이용한 등고선 간섭무늬의 개선)

  • Kang, Young-June;Kim, Gye-Sung;Ryu, Weon-Jae;Kwon, Yong-Ki
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.12
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    • pp.190-197
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    • 1999
  • Electronic speckle contouring(ESC) is the optical method for measuring shape by using fringe-projection techniques in electronic speckle pattern interferometry. It has the advantage of being non-contacting and can also give a field view of the surface under investigation. Fringes in ESC represent the difference in depth along the view direction between the master wavefront and the test component. The contour maps of three-dimensional diffuse objects are obtained by small shifts of optical fiber carrying the dual-object-beams and 4-frame phase shift. We proposed the contouring method by shifting the collimated illumination beams through optical fiber in order to obtain the contour fringe patterns. And also, we performed addition of incremental addition of images and experiments based on it. we obtained both quantitative increment without decorrelation effect and qualitative improvement by reducing the noise of contour fringes.

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A Study on the Strain Analysis of Cracked Plate by Electronic Speckle Pattern Interferometry (전자처리 Speckle Pattern 간섭법에 의한 균열평판의 Strain 해석에 관한 연구)

  • 김경석;양승필
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.6
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    • pp.1382-1390
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    • 1995
  • Electronic Speckle Pattern Interferometry (ESPI) with a CW laser, a video system and an image processor was utilized to measure the in-plane displacement. Unlike traditional strain gauges or Moire method. ESPI method measure the in-plane displacement on real time with out any surface preparation on surface attachment. The specimen has a crack of 10*0.1 mm in the middle of plate and strain gauge was also attached on that surface to compare with ESPI method. This study reveled the ESPI method to measure the displacement and distribution of strain in the specimen. It was shown in tensile tests that the measurement by ESPI method was comparable with strain gauge.

Non-destructive Inspection of Semiconductor Package by Laser Speckle Interferometry (레이저 스페클 간섭법을 이용한 반도체 패키지의 비파괴검사)

  • Kim, Koung-Suk;Yang, Kwang-Young;Kang, Ki-Soo;Choi, Jung-Gu;Lee, Hang-Seo
    • Journal of the Korean Society for Nondestructive Testing
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    • v.25 no.2
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    • pp.81-86
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    • 2005
  • This paper proposes a non-destructive ESPI technique to quantitatively evaluate defects inside a semiconductor package. The inspection system consists of the ESPI system, a thermal loading system and an adiabatic chamber. The technique is high feasibility for non-destructive testing of a semiconductor and overcomes the weaknesses of previous techniques, such as time-consumption and difficult quantitative evaluation. Most defects are classified as delamination defects, resulting from the insufficient adhesive strength between layers and from non-homogeneous heat spread. Ninety percent of the tested samples had delamination defects which originated at the corner of the chip and nay be related to heat spread design.

Quantitative Determination of Out-of-plane Displacement by Shearography (Shearography의 1차도함수로부터 면외변위의 정량적 추출)

  • Kim, Koung-Suk;Yoon, Hong-Seok;Park, Chan-Ju;Choi, Jung-Suk
    • Proceedings of the KSME Conference
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    • 2004.11a
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    • pp.772-776
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    • 2004
  • The paper describes the quantitative determination of out-of-plane displacement from result of Shearogrpahy, which can measure the first-order partial derivative of out-of-plane displacement directly. However, the differential sensitivity of Shearography is related to the amount of shearing, which is manually adjustable in optical interferometer and affects the quantitative determination. The relationship between those is inspected by comparing ESPI with Shearography. From the result, the amount of shearing plays a modulation factor of out-of-plane displacement and small amount of shearing gives good agreement with out-of-plane displacement.

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레이저 스페클법에 의한 부분관통된 원공판의 면내변위 정량적 평가

  • Baek, Tae-Hyun;Kim, Myung-Soo;Kim, Hwan;Lee, Chun-Tae;Park, Tae-Geun
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.179-179
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    • 2004
  • 최근 산업계 기술 동향은 첨단화, 고정도화 그리고 초소형화하고 있으며, 초정밀 가공 기술(nano technology)의 발전에 따른 고정밀의 계측기술이 요구되고 있는 실정이며, 기계구조 재료가 다양한 조건 하에서 사용되어지고 있다. 이에 따라 새로운 정밀계측기술 또한 급속히 발전하고 있으며, 특히 비접촉 정밀 계측 분야에서는 레이저(laser)를 이용한 광계측 방법이 선호되고 있다. 레이저를 이용한 비접촉 계측방법은 기계구조물의 미소하중, 미소균열검출, 미소변형계측, 정밀계측 등의 분야에 장점을 가지고 있어 관심이 높아지고 있다.(중략)

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The Development of In-Plane Displacement Measurement System on Laser Speckle Interferometry (레이저 스페클 간섭법을 이용한 면내변위 측정시스템 개발)

  • Yoon H.S.;Kim K.S.;Park C.J.;Choi T.H.;Choi J.S.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2005.06a
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    • pp.556-560
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    • 2005
  • The measurement method by Laser Speckle Interferometry which uses the interference law which will grow precedes and with it explains a resolution measurement ability and together the change of place arrowhead and general measurement, at real-time measurement sensitivity it has application boat song from candle precise measurement field it is increasing. But, currently the domestic application technique to sleeps and optical science military merit by optical science interferometer and directness it composes purchases to the level which it applies the expensive commercial business equipment the outside and in spite of the technical ripple effect is deficient even in many strong point. The hazard which complements like this problem point form technical development it leads from the research which it sees and an application degree and to sleep as the measurement equipment which tries to develop the small-sized optical science interference sensor and an interpretation program it raises it does.

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