• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.320-323
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• 2008

In this study, a macroscopic approach was carried out to gain insight into the bending mechanism of metallic sandwich plates. Shear force-punch stroke curves for various clearances were analytically derived for mild steel (CSP 1N) sandwich plates with the total thickness of 3 mm and 0.5 mm face sheets. As the clearance increases, shear force of the inner structures and sensitivity of punch stroke decrease. These data are useful to derive a criterion of judgment for core shear failure and de-bonding failure during U-bending.

• Journal of Korean Society of Water and Wastewater
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• v.19 no.2
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• pp.214-220
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• 2005

Errors may occur due to analysis methods and water quality during the application of the on-line particle counter In water treatment process. Errors caused by analysis methods include particle destruction by shear force due to inflow speed and tube friction, as well as interruption by screening, bubbles and contaminants. Since errors happen frequently because of these factors, it is necessary to examine and evaluate such errors during the application of a particle counter. Errors can be large due to screening and bubbles. Measurement values are effective for water analysis after filtration process. However, because of screening, only measurement values for particles above $7{\mu}m$ are valid for water with a turbidity between 3-10NTU. As particle numbers around $10{\mu}m$ increase a lot after ozone treatment, sufficient pretreatment process is necessary. Physical conditions should keep stable for inflow to decrease errors caused by shear force.

• Proceedings of the KAIS Fall Conference
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• 2007.11a
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• pp.99-101
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• 2007

사진관과 인쇄소간의 역할분담, 급속한 인터넷의 발달과 고속 인쇄기의 보급으로 노동집약적인 졸업 앨범 제작은 누구나 손쉽게 문서를 원하는 형태로 제작 출력이 가능해 졌다. 하지만 명함이나 광고 전단지, 신문이나 잡지, 전화번호부 책자 및 소책자를 제작하기 위해서는 전용 편집용 소프트웨어를 이용하여 전문가들이 제작을 하고 있다. 본 논문에서는 가장 대표적인 광고도안인 명함을 인터넷을 이용하여 신청단계부터 PDF파일을 생성하는 단계까지 일련의 작업공정을 자동화시스템을 구축하기 위한 컴퓨터조판시스템의 모델을 제시한다.

• Proceedings of the Korean Radioactive Waste Society Conference
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• 2016.05a
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• pp.61-62
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• 2016

우라늄전착물의 염 증류공정은 pyroprocess의 bottle neck에 해당되며, 회분식으로 조업된다. 본 발명에서는 증류탑 전단계에 고액분리실을 설치하고, 증류탑 후단에 냉각실을 설치하여, 전착물 도가니가 고액분리조- 증류조- 냉각조를 순차적으로 통과하여 조업시간을 크게 단축할 수 있도록 하였다. 또 도가니가 고온에서 이동할 수 있도록 중간에 고온 밸브를 설치하여 도가니가 다음 단계로 이동하면 새로운 전착물 도가니가 도입되어 연속적으로 조업이 가능하여 처리 용량이 향상되도록 하였다. 이에 따라 단위 시간당 처리용량을 현저히 높일 수 있다.

• Transactions of Materials Processing
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• v.32 no.2
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• pp.61-66
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• 2023

The quality of the sheared surface affects the stretch flangeability of steel sheet. The quality of sheared surface is influenced by several process factors such as die clearance, shape of cutting edge, use of counter punch, and shear. In this paper, the influence of these shearing process factors on the stretch flangeability of the HSS (DP980) was analyzed through a shearing and a stretch flangeability test. When the die clearance was 10%, the effect of these shearing process factors on the stretch flangeability was the greatest, and the use of an acute angle blade was found to be more advantageous in the stretch flangeability than a right angle blade. It was found that the stretch flangeability was improved when active bending was applied during shearing.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.1
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• pp.45-51
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• 2009

A low-voltage, low-power analog CMOS front-end for a cardiac pacemaker is proposed. The circuits include a 4th order switched-capacitor (SC) filter with a passband of 80-120 Hz and a SC variable gain amplifier whose control range is from 0 to 24-dB with 0.094 dB step. An inverter-based switched-capacitor circuit technique is used for low-voltage operation and ultra-low power consumption, and correlated double sampling technique is used for reducing the finite gain effect of an inverter. The proposed circuit has been designed in a $0.35-{\mu}m$ CMOS process, and it achieves 80-dB SFDR at 5-kHz sampling frequency. The power consumption is only 330 nW at 1-V power supply.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.12
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• pp.6060-6065
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• 2013

Minimizing the height of the die roll is very important for maximizing the size of effective shear planes. In this study, the die roll change was investigated for the change in the amounts and clearance of the V-ring indentation. Shear analysis and experiments were conducted with the V-ring distance fixed to 2mm. Fine blanking die was applied to the die insert with different clearances. Several specimens were analyzed about the height of the die roll. As a result, the pressure of V-ring effectively inhibited the flow of materials. And the height of the die roll was lowest when the clearance between the die and punch was 1% of the material thickness.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.726-729
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• 2010

Copper Pillar Tin Bump (CPTB) was investigated for high density chip interconnect technology development, which was prepared by electroplating and electro-less plating methods. Copper pillar tin bumps that have $100{\mu}m$ pitch were introduced with fabrication process using a KM-1250 dry film photoresist (DFR), with copper electroplating for Copper Pillar Bump (CPB) formation firstly, and then tin electro-less plating on it for control oxidation. Electric resistivity and mechanical shear strength measurements were introduced to characterize the oxidation effects and bonding process as a function of thermo-compression. Electrical resistivity increased with increasing oxidation thickness, and shear strength had maximum value with $330^{\circ}C$ and 500 N thermo-compression process. Through the simulation work, it was proved that when the CPTB decreased in its size, it was largely affected by the copper oxidation.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.23-33
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• 2007

The growing environmental regulation governs the use of lead by RoHS, WEEE, and then. The electronic industry is moving to replace Pb-bearing solder with Pb-free solder. To use the Pb-free solder, microelectronic industry needs consequently the new reliability appraisal such as the packaging for high temperature process, various mechanical change caused by new solder, and the development of Pb-free sloder for long life of product. The evaluation of solder bar and mechanical properties of joint were performed compared with international standard, and new appraisal standard was established. The solderability and spread ability of Sn-0.7Cu solder material showed up to the standard. Shear test of solder joint using by the solder resulted that the shear strengths after thermal shock or after aging were not much lower than the shear strength of as-soldered and that they were also up to the standard.

• Composites Research
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• v.33 no.2
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• pp.61-67
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• 2020

Preforming is crucial in resin transfer molding process using woven fabric. When shear deformation exceeds the locking angle, wrinkles are generated in the preform, which causes defects in the RTM process. Therefore, in this study, the allowable shear deformation limit of carbon fiber woven fabrics is quantified and the molding characteristics are verified using the actual fabric forming. As a result, the characteristics of creases according to the layer setups have been examined and the results have been discussed. Numerical analyses have been also performed using measured shear properties. These results have been compared with the experimental results.