• 한국표면공학회지
• /
• 제45권3호
• /
• pp.97-105
• /
• 2012

The effects of pH, types of applied current, agitation method and time, additive on the amount of co-deposited $TiO_2$ particles in the matrix were investigated. The deposition rates increased with increasing pH values, while the volume fraction of $TiO_2$ particles and the size of agglomerated $TiO_2$ particles in the composite decreased. The volume fraction of $TiO_2$ particles in the composite decreased when pulsed current of 50% duty cycle was used. And the size of agglomerated $TiO_2$ particles in the nickel matrix of pulsed current was smaller than that of DC current specimen. The volume fraction of $TiO_2$ particles in the matrix decreased with longer time by air agitation, but in case of using magnetic bar, volume fraction in the same range of time was relatively constant. The volume fraction of the electrodeposited Ni-$TiO_2$ composite in the solution containing 0.01 M Dimethylamine borane (DMAB) increased slightly with increasing agitation time regardless of agitation methods. Thermal stability of the electrodeposited Ni-$TiO_2$ composite increased with lower pH at the temperature range of $200{\sim}800^{\circ}C$, and the results showed that the amount of co-deposited $TiO_2$ relies more on the deposition rate than zetapotential of $TiO_2$ particles.

• 융복합기술연구소 논문집
• /
• 제8권1호
• /
• pp.33-39
• /
• 2018

The screen printing method for forming the electrode by applying the existing pressure is difficult to apply to thin wafers, and since expensive Ag paste is used, it is difficult to solve the problem of cost reduction. This can solve both of the problems by forming the front electrode using a plating method applicable to a thin wafer. In this paper, the process conditions of electrode formation are optimized by using LIEP (Light-Induced Electrode Plating). Experiments were conducted by varying the Ni plating bath temperature $40{\sim}70^{\circ}C$, the applied current 5 ~ 15 mA, and the plating process time 5 ~ 20 min. As a result of the experiment, it was confirmed that the optimal condition of the structural characteristics was obtained at the plating bath temperature of $60^{\circ}C$, 15 mA, and the process time of 20 min. The Cu LIEP process conditions, experiments were conducted with Cu plating bath temperature $40{\sim}70^{\circ}C$, applied voltage 5 ~ 15 V, plating process time 2 ~ 15 min. As a result of the experiment, it was confirmed that the optimum conditions were obtained as a result of electrical and structural characteristics at the plating bath temperature of $60^{\circ}C$ and applied current of 15 V and process time of 15 min. In order to form Ni silicide, the firing process time was fixed to 2 min and the temperature was changed to $310^{\circ}C$, $330^{\circ}C$, $350^{\circ}C$, and post contact annealing was performed. As a result, the lowest contact resistance value of $2.76{\Omega}$ was obtained at the firing temperature of $310^{\circ}C$. The contact resistivity of $1.07m{\Omega}cm^2$ can be calculated from the conditionally optimized sample. With the plating method using Ni / Cu, the efficiency of the solar cell can be expected to increase due to the increase of the electric conductivity and the decrease of the resistance component in the production of the solar cell, and the application to the thin wafer can be expected.

• 마이크로전자및패키징학회지
• /
• 제25권4호
• /
• pp.67-74
• /
• 2018

두께가 $20{\mu}m$이며, 직경이 각기 $100{\mu}m$, $300{\mu}m$, $500{\mu}m$인 p형 $Sb_2Te_3$와 n형 $Bi_2Te_3$ 박막레그들을 전기도금하여 열전박막모듈을 형성한 후, 박막레그의 직경에 따른 출력전압과 출력전력을 비교하였다. $100{\mu}m$ 직경 박막레그들로 구성된 모듈은 ${\Delta}T=36.7K$에서 365 mV, $300{\mu}m$ 직경 박막레그들로 형성한 모듈은 ${\Delta}T=37.5K$에서 142 mV, $500{\mu}m$ 직경 박막레그들로 제작한 모듈은 ${\Delta}T=36.1K$에서 53 mV의 open circuit 전압을 나타내었다. $100{\mu}m$ 직경 박막레그 모듈은 ${\Delta}T=36.7K$에서 $845{\mu}W$, $300{\mu}m$ 직경 박막레그 모듈은 ${\Delta}T=37.5K$에서 $631{\mu}W$, $500{\mu}m$ 직경 박막레그 모듈은 ${\Delta}T=36.1K$에서 $276{\mu}W$의 최대출력전력을 나타내었다.