• Journal of Korean Tunnelling and Underground Space Association
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• v.25 no.2
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• pp.101-120
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• 2023

Electrical resistivity survey have been widely conducted at diverse scales, from a few centimeters for laboratory tests to kilometers for field tests. It measures electrical resistance through relationship of electric potential difference and current between two electrodes penetrated on the surface of medium, and eventually quantifies electrical resistivity known as inherent properties of the medium. In field or full-scale test, it assumes the electrodes as equivalent half-sphere electrodes that have a same surface area with different electrodes for ease of calculation because the contact area between electrode and medium is small and sufficient distance between two electrodes. However, small-scale laboratory test is significantly affected by the electrode geometries (penetrated depth, height, radius of electrode and distance between electrodes), which change the equipotential surface and electric current flow. Indeed, the electrode geometries may eventually cause a difference of electrical resistivity value. This study reviews the theoretical electrical resistance derived with various electrode geometries (half-sphere, cylinder, cylindrical with half-spherical tip, cylindrical with conical tip) and verifies the developed numerical module by comparing results with the theoretical electrical resistance. The distributions of electrical resistance around electrodes and among electrodes are analyzed. In addition, it is discussed how the electrical characteristic of cylindrical electrode with conical tip widely used in field test has effect on the electric current flow.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.44 no.1
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• pp.49-62
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• 2024

Reckless development of the underground by rapid urbanization causes inspection delay on replacement of existing structure and installation new facilities. However, frequent accidents occur due to deviation in construction design planned by inaccurate location information of underground structure. Meanwhile, the electrical resistivity survey, knowns as non-destructive method, is based on the difference in the electric potential of electrodes to measure the electrical resistance of ground. This method is significantly advanced with multi-electrode and deep learning for analyzing strata. However, there is no study to quantitatively assess change in electrical resistance according to geometric conditions of structures. This study evaluates changes in electrical resistance through geometric parameters of electrodes and structure. Firstly, electrical resistance numerical module is developed using generalized mesh occurring minimal errors between theoretical and numerical resistance values. Then, changes in resistances are quantitatively compared on geometric parameters including burial depth, diameter of structure, and distance electrode and structure under steady current condition. The results show that higher electrical resistance is measured for shallow depth, larger size, and proximity to the electrode. Additionally, electric potential and current density distributions are analyzed to discuss the measured electrical resistance around the terminal electrode and structure.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.39 no.10
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• pp.1011-1019
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• 2015

Insulated-gate bipolar transistors (IGBTs) are the predominantly used power semiconductors for high-current applications, and are used in trains, airplanes, electrical, and hybrid vehicles. IGBT power modules generate a considerable amount of heat from the dissipation of electric power. This heat generation causes several reliability problems and deteriorates the performances of the IGBT devices. Therefore, thermal management is critical for IGBT modules. In particular, realizing a proper thermal design for which the device temperature does not exceed a specified limit has been a key factor in developing IGBT modules. In this study, we investigate the thermal behavior of the 1200 A, 3.3 kV IGBT module package using finite-element numerical simulation. In order to minimize the temperature of IGBT devices, we analyze the effects of various packaging materials and different thickness values on the thermal characteristics of IGBT modules, and we also perform a design-of-experiment (DOE) optimization