• Journal of the Microelectronics and Packaging Society
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• v.10 no.1
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• pp.31-38
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• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.

• Journal of the Computational Structural Engineering Institute of Korea
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• v.33 no.3
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• pp.171-178
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• 2020

In this study, we develop MPI-OpenMP hybrid parallelization for multibody peridynamic simulations. Peridynamics is suitable for analyzing complicated dynamic fractures and various discontinuities. However, compared with a conventional finite element method, nonlocal interactions in peridynamics cost more time and memory. In multibody peridynamic analysis, the costs increase due to the additional interactions that occur when computing the nonlocal contact and ghost interlayer models between adjacent bodies. The costs become excessive when further refinement and smaller time steps are required in cases of high-velocity impact fracturing or similar instances. Thus, high computational efficiency and performance can be achieved by parallelization and optimization of multibody peridynamic simulations. The analytical code is developed using an Intel Fortran MPI compiler and OpenMP in NURION of the KISTI HPC center and parallelized through MPI-OpenMP hybrid parallelization. Further parallelization is conducted by hybridizing with OpenMP threads in each MPI process. We also try to minimize communication operations by model-based decomposition of MPI processes. The numerical results for the impact fracturing of multiple bodies show that the computing performance improves significantly with MPI-OpenMP hybrid parallelization.

• Composites Research
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• v.31 no.3
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• pp.88-93
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• 2018

In this study, damaged composite laminates were repaired by a stepped patch repair method using halloysite nanotube(HNT) and milled carbon(MC) reinforced composite materials with different amount of the particles. And the mechanical and structural effects of the particles on the interface between the damaged and repair surfaces were analyzed. At this time, after exposing them to a harsh environment of high temperature and humidity for a long time, the recovery rate of the material properties relative to the material forming the damaged plate was compared. As a result, at $70^{\circ}C$ high temperature distilled water, the hygroscopicity of the HNT/GFRP composites was significantly different from that of the MC/GFRP composites. Especially, 0.5, 1 wt. % HNT was added, the moisture absorption rate was the lowest and this was the factor that contributed to the mechanical strength increase. On the other hand, MC showed a high hygroscopic resistance only with a small amount, and the strength was different according to the action direction of the load, and the addition amount was also different.

• Membrane Journal
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• v.24 no.2
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• pp.151-157
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• 2014

In this study, the nanofiber composite membrane was prepared by electrospinning method with poly (ancrylonitrile) (PAN) and a dispersed solution of graphene oxide (GO) and $Fe_3O_4$ functionalized graphene oxide (M-GO) in dimethyl formamide (DMF). The pore-diameter of prepared membranes was controlled by change of those layers. It was confirmed with SEM that the nanofiber composite membranes having fiber size of 500 nm were prepared. It was found with Raman spectroscopy and EDS that GO and M-GO were well dispersed on those membranes. Final nanofiber composite membrane showed the similar pore properties ($0.21{\sim}0.24{\mu}m$/pore-size, 40% porosity) with the commercial membrane ($0.27{\mu}m$/pore-size, 55% porosity) and their water-flux results also showed the 200% higher flux than its PAN membrane. From these results, it was expected that the nanofiber composite membrane prepared by electrospinning method could be utilized as a water-treatment membrane.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2011.03a
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• pp.58-58
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• 2011

CNT 나노기술을 응용한 IT산업용 적층간지용 ESD(정전방전, Electrostatic Dissipation)PU 발포필름의 제조 가공기술 및 상품화 개발은 전자제품 패키지에 요구되는 쿠션성과 정전방전 기능을 갖는 폴리우레탄 발포 필름의 제조기술을 확립함으로써 가능 할 수 있다. 특히 IT산업용 필름제품이 개발되면 ESD 성능을 발휘하게 됨으로서 정전기 쇼크에 의한 각종 전자제품의 오작동이나 파손 방지가 가능하게 되어 포장재, 자동차, 전자제품의 하우징 등으로 사용될 수 있게 된다. 현재까지 ESD 기능을 부여하기 위해서 사용되는 충전재로는 금속섬유, 금속플레이크, 탄소섬유, 카본블랙 등이 있으며, 최근 탄소나노튜브를 응용한 연구가 많이 진행되고 있는데 탄소나노튜브는 직경이 수십nm, 종횡비 1000이상의 나노섬유형태로 서 전기전도성이 구리수준으로 알려져 있고 소량을 충전할 시 기계적 특성도 오히려 증대하는 장점을 가지고 있으며 전기적 특성으로는 상대적으로 낮은 나노튜브 함량에서는 ESD를 들 수 있고 높은 함량에서는 전자파 차폐성까지 기대되고 있다. 본 연구에서는 우수한 인장강도, 기계적 강도, 열적 안정성, 내약품성을 가지면서 습식 또는 용융공정을 통해 용이하게 시트, 필름, 코팅제를 제조할 수 있는 방수, 투습방수성을 가지는 유연재료인 폴리우레탄(PU) 1액형 PU에 MWNT 함량이 3wt%인 IPA/MWNT 분산용액을 PU 함량 대비 20, 30, 40파트로 함유시켜 $120^{\circ}C$에서 2분 건조시켜 제조한 그라운드 필름에 2액형 PU와 IPA/MWNT 분산용액에 발포제를 첨가하여 발포온도 140, 150, $160^{\circ}C$에서 5분간 건조시켜 시료 필름을 제조하였다. 제조된 필름의 전기전도성 측정은 부피저항과, 표면저항을 각각 측정하여 확인하였으며, 필름의 마찰 대전압은 E.S.T-7 마찰 대전압 시험기를 이용하여 표면 마찰 대전압과 반감기를 측정하여 확인하고, 필름의 물리적 특성은 인장시험기를 이용하여 breaking stress, breaking strain을 구하였다. 필름의 표면 특성은 영상 현미경 시스템을 사용하여 ${\times}1000$ 배율로 측정하여 분산특성과의 연관성을 확인하였다.

• Proceedings of the Korean Society of Dyers and Finishers Conference
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• 2012.03a
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• pp.63-63
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• 2012

전자제품 패키지에 요구되는 쿠션성과 정전방전 기능을 갖는 폴리우레탄 발포 필름의 제조기술을 확립하게 되면 IT산업용에 적용 가능한 필름제품이 개발되어 ESD(정전방전, Electrostatic Dissipation) 성능을 발휘하게 됨으로서 정전기 쇼크에 의한 각종 전자제품의 오작동이나 파손 방지가 가능하게 되어 포장재, 자동차 전자제품의 하우징 등으로 사용될 수 있게 된다. 전도성 고분자인 Polyaniline (PANI)은 다른 여러 고분자와 비교하여 볼 때 다른 유형의 전도성 고분자보다 합성하기가 쉽고 높은 전기전도도를 보임은 물론 열적 및 대기 안정성이 우수하며 가격이 저렴한 장점을 가지고 있다. 본연구는 CNT 나노기술을 응용한 IT산업용 적층간지용 ESD PU발포필름의 제조 가공기술 및 상품화 개발을 수행하고자 방수, 투습방수성을 가지는 유연재료인 폴리우레탄(PU)의 1액형 PU와 DMF에 PANI의 함량을 5, 10, 15, 20, 25, 30wt%로 변화시켜 제조한 PANI/DMF 분산용액과 IPA/MWNT 3wt% 분산용액의 혼용비에 변화를 주어 $120^{\circ}C$에서 2분 건조시켜 그라운드 필름을 제조하였다. 그리고 2액형 PU와 IPA/MWNT 3wt% 분산용액과 발포제를 사용하여 발포온도 $150^{\circ}C$에서 5분간 건조시켜 발포필름을 제조하였으며 이들의 전기적 특성과 역학적 특성을 조사하였다. 제조된 필름의 전기전도성은 전기저항측정기 KEITHLEY 8009를 사용하여 부피저항과, 표면저항을 각각 측정하여 확인하였으며, 필름의 마찰 대전압은 E.S.T-7 마찰 대전압 시험기를 이용하여 표면 마찰 대전압을 측정하여 확인하고, 필름의 물리적 특성은 인장시험기를 이용하여 breaking stress, breaking strain을 측정하였다. 필름단면의 CNT 발포특성은 주사전자현미경(SEM)을 사용하여 측정하여 발포특성과 물성과의 연관성을 확인하였다. 그 결과 필름의 전기적 특성은 PANI가 30% 함량일 때 전반적으로 낮은 저항값이 측정되었으며, 마찰대전압을 측정한 결과 대부분의 시료가 0에 가까운 낮은 값을 가졌다. 필름의 물리적 인장특성은 PANI가 10wt%의 함량일 때 가장 높은 절단강도를 가졌으며 분산용액의 혼용비에 따른 경향성은 나타나지 않았다. 필름의 단면형상을 확인하여 발포특성을 분석한 결과 PANI의 함량에 따라 발포 cell의 크기는 뚜렷한 경향성을 보이지 않았으나 30wt%의 PANI/DMF 분산용액 20part(gr)와 3wt% IPA/MWNT 분산용액 40part(gr)로 제조한 시료의 cell이 가장 균일하고 고르게 발포되었으며, 3.90E+06ohm으로 가장 낮은 표면저항 값으로 측정되어 가장 좋은 전기전도성을 가짐을 확인하였다.

• Korean Journal of Optics and Photonics
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• v.31 no.5
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• pp.205-212
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• 2020

In the performance of a wind turbine system, the blades play a vital role. However, they are susceptible to damage arising from complex and irregular loading (which may even cause catastrophic collapse), and they are expensive to maintain. Therefore, it is very important both to find defects after blade manufacturing is completed and to find damage after the blade is used for a certain period of time. This study provides a new perspective for the detection of internal defects in glass-fiber- and carbon-fiber-reinforced panels, which are used as the main materials in wind turbine blades. A gap or fracture between fiber-reinforced materials, which may occur during blade manufacturing or operation, is simulated by drilling a hole 5 mm in diameter in the middle layer of the laminated material. Then, a digital-image-correlation (DIC) method is used to detect internal defects in the blade. Tensile load is applied to the fabricated specimen using a tensile tester, and the generated changes are recorded and analyzed with the DIC system. In the glass-fiber-reinforced laminated specimen, internal defects were detected from a strain value of 5% until the end of the experiment, while in the case of the carbon-fiber-reinforced laminated specimen, internal defects were detected from 1% onward. It was proved using the DIC system that the defect was detected as a certain level of strain difference developed around the internal defects, according to the material properties.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.6
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• pp.34-42
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• 2000

Recently, there is a growing need to develope small-size RF chip inductors operating to GHz to realize high-performance, micro-fabricated wireless communication products. For the development of high-performance RF chip inductors, however, the ferrite-based chip inductors can not be used above 300MHz due to the limitation of the permeability of this material. In this work, small-size, high-performance RF chip inductors utilizing amorphous $Al_2O_3$ core material were investigated. Copper (Cu) with 40${\mu}m$ diameter was used as the coils and the chip inductor size fabricated in this work is $2.1mm{\times}1.5mm{\times}1.0mm$. The external current source was applied after bonding Cu coil leads to gold pads electro-plated on the bottom edges of a core material. The composition of core materials was measured using a EDX. High frequency characteristics of the inductance (L), quality factor (Q), and impedance (Z) of developed inductors were measured using an RF Impedance/Material Analyzer (HP4291B with HP16193A test fixture). The developed inductors have the self-resonant frequency (SRF) of 1 to 3.5 GHz and exhibit L of 22 to 150 nH. The L of the inductors decreases with increasing the SRF. The Z of the inductors has the maximum value at the SRF and the inductors have the quality factor of 70 to 97 in the frequency range of 500 MHz to 1.5 GHz.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.4
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• pp.69-74
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• 2010

A new package substrate for dynamic random access memory(DRAM) devices has been developed using selective aluminum anodization. Unlike the conventional substrate structure commonly made by laminating epoxy-based core and copper clad, this substrate consists of bottom aluminum, middle anodic aluminum oxide and top copper. Anodization process on the aluminum substrate provides thick aluminum oxide used as a dielectric layer in the package substrate. Placing copper traces on the anodic aluminum oxide layer, the resulting two-layer metal structure is completed in the package substrate. Selective anodization process makes it possible to construct a fully filled via structure. Also, putting vias directly in the bonding pads and the ball pads in the substrate design, via in pad structure is applied in this work. These arrangement of via in pad and two-layer metal structure make routing easier and thus provide more design flexibility. In a substrate design, all signal lines are routed based on the transmission line scheme of finite-width coplanar waveguide or microstrip with a characteristic impedance of about $50{\Omega}$ for better signal transmission. The property and performance of anodic alumina based package substrate such as layer structure, design method, fabrication process and measurement characteristics are investigated in detail.

• Applied Chemistry for Engineering
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• v.24 no.3
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• pp.219-226
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• 2013

Organic semiconductor-based soft electronics has potential advantages for next-generation electronics and displays, which request mobile convenience, flexibility, light-weight, large area, etc. Organic field-effect transistors (OFET) are core elements for soft electronic applications, such as e-paper, e-book, smart card, RFID tag, photovoltaics, portable computer, sensor, memory, etc. An optimal multi-layered structure of organic semiconductor, insulator, and electrodes is required to achieve high-performance OFET. Since most organic semiconductors are self-assembled structures with weak van der Waals forces during film formation, their crystalline structures and orientation are significantly affected by environmental conditions, specifically, substrate properties of surface energy and roughness, changing the corresponding OFET. Organo-compatible insulators and surface treatments can induce the crystal structure and orientation of solution- or vacuum-processable organic semiconductors preferential to the charge-carrier transport in OFET.