• The Optical Journal
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• s.127
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• pp.29-31
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• 2010

열상센서는 빛의 유무와 관계없이 주야간 선명한 적외선 영상을 실시간으로 제공한다. 이러한 장점으로 최근에는 군사용 뿐 아니라 민간 활용도가 점차 높아지고 있다. 최근 군사용으로는 고정밀, 광역의 장거리 관측센서로 발전하고 있으며, 민간용으로는 안정된 화질로 소형, 경량이면서도 저가로 공급될 수 있는 기술로 발전중이다.

• Korean Journal of Optics and Photonics
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• v.15 no.5
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• pp.423-428
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• 2004

The development of a compact and high performance MWIR thermal imaging sensor based on the SOFRADIR 320${\times}$240 element IRCCD detector is described. The sensor has 20 magnification zoom optics with the maximum 40$^{\circ}$${\times}$30$^{\circ}$ of super wide field of view and 7.6 cycles/mrad of resolving power with the operation of attached micro-scanning system. In order to correct nonuniformities of detector arrays, we have proposed a multi-point correction method using defocusing of the optics and we have acquired the highest quality images. The MRTD of our system shows good results below 0.05K at spatial frequency 1 cycles/mrad at narrow field of view. Experimental data and obtained performances are presented and discussed.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.1 no.2
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• pp.27-31
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• 2000

Thermal imaging system is implemented for the measurement and the analysis of the thermal distribution of the target objects. The main Part of the system is thermal camera in which a focal plane array typed sensor is introduced The sensor detects mid-range infrared spectrum or target objects and then it output generic video signal which should be processed to form a thermal image frame. A digital signal processor(DSP) in the system inputs analog to digital converted data. performs algorithms to improve the thermal images and then outputs the corrected frame data to frame buffers for NTSC encoding and for digital outputs.. To enhance the quality of the thermal images, two point correction method is applied. Figures indicate that the corrected thermal images are much improved.

• Korean Journal of Optics and Photonics
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• v.18 no.2
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• pp.135-141
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• 2007

This paper describes the design technology for a third generation thermal imaging system, which is more compact than before, using a $320\times240$ mid-IR focal plane detector. The third generation non-scanning thermal imaging system was constructed as a compact thermal imaging module as a reconnaissance, surveillance and navigation sensor for helicopter and infantry vehicles in the $1980's\sim1990's$ and now, we designed a new compact infrared camera and studied a new type of non-uniformity correction lens fer this camera.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2009.05a
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• pp.160-163
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• 2009

최근 적외선 열 영상의 유용함이 발표되어감에 따라 이 기술에 대한 이해와 도입폭이 점진적으로 넓혀져 가고 있다. 국내는 물론 세계적으로 많은 제조, 개발 관련 업체들이 생겨나고 있으며, 업체들의 기술이 발전함에 따라 높은 온도 분해능과 해상도는 물론, 시스템 전체의 크기가 휴대가 가능할 정도로 소형화 되어가고 있는 추세이다. 이러한 열 영상 카메라에서 중요한 역할을 하는 적외선 열 감지 센서에서는 주변 온도, 대상 온도, 표면 온도 등의 측정 오차 및 열상 측정 소자의 온도, Bias 불안정 등의 매우 다양한 원인으로 인한 잡음이 발생하기 쉽다. 이러한 다양한 잡음의 감소는 해상도 및 온도 분해능의 향상과 직결되므로, 잡음을 줄이기 위한 많은 연구가 도처에서 행해지고 있다. 본 논문은 이러한 노력의 일환으로써 각각의 잡음 원인을 규명하지 않고 최종 열 영상 출력물에서 인접 프레임들의 비교, 혼합 하여 제거하는 3D Noise Reduction 기술을 이용해 노이즈를 감쇠하는 방법에 대해 연구하였다.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.566-569
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• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Proceedings of the KIEE Conference
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• 1992.07b
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• pp.1250-1254
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• 1992

This paper describes the designed and fabricated thermal imaging system with the SPRITE(Signal PRocessing in The Element) detector, operating in the 3-12 micron band. This system consists of an afocal telescope, a scan unit containing the SPRITE detector, an electronic processor unit and a cooler. The optical scan system utilizing rotating polygon and oscillating mirror, is 2-dimensional serial/parallel scan type using five elements of the detector. And the electronic processor unit performs digital scan conversion to reform the parallel data stream into serial analog data compatable with conventional RS-170 video. The scan field of view is 40 ${\times}$ 26.7 and the MRTD(Minium Resolvable Temperature Difference) is 0.6 K at 7.5 cycles/mm. The acquired thermal image indicates that this system has a satisfactory performance.

• Journal of Institute of Control, Robotics and Systems
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• v.13 no.2
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• pp.128-132
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• 2007

Thermal Imaging systems are reported to be crucial for fire fighting and beginning to be used by fire fighters. The performance of thermal imaging system is determined by both the radiation of infrared from the target and the attenuation of infrared signal in the optical path by the absorption, scattering, diffraction and reflection. In the scene of fire, water drops with various sizes such as vaporized water, wafer mist from sprinkler, and wafer to suppress the fire reside with various gas generated by burning. To measure the transmission of infrared radiation in the scene of fire, fire simulating system and thermal imagers with cooled detector which detects $3{\sim}5{\mu}m$ infrared and uncooled detector fabricated by the MEMS technology which detects $8{\sim}12{\mu}m$ infrared. are made. With thermal imagers and Ire simulating system, the change of thermal image with respect to the change of visibility controlled with the burned fas was measured. It was found that the transmission of infrared was not reduced by the burned gas, which could be explained by the long wavelength of infrared ray compared with visible ray. However, the transmission of infrared ray was largely reduced by the combination of burned gas and water mist supplied by sprinkler. This is contrary to the results of calculated transmission through the pure water mist and shows that the transmission of infrared ray is mostly affected by the compounds of water mist and burned gas. In this case, it was found that the uncooled detector which detects $8{\sim}12{\mu}m$ infrared ray is better than cooled detector which detects $3{\sim}5{\mu}m$ infrared ray for fire fighting.

• Journal of the Korea Society of Computer and Information
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• v.19 no.12
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• pp.31-37
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• 2014

In this paper, to compensate the degraded performance in high-resolution infrared sensor due to assembling error, the influence of each component was evaluated through the sensitivity analysis of lens assembly, axis mirror, and detector and also suggested detector tilt mechanism for compensation. 3 detector tilt mechanisms were investigated. The first one is 'Shim plate' method which is applying shim on installing plane. The second one is 'Tilting screw' method that is using tilt screw for adjusting detection plane. The last one is 'Micrometer head' method that is installing micrometer on detection plane and acquiring quantitative data. Based on the investigation result, 'Tilting screw' method was applied due to ease of user control, small volume, and real-time controllability, thereby we could acquire high-resolution infrared images. The research result shows that the tilting mechanism is necessary technology for the implementation of high-resolution infrared imaging system.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.8
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• pp.180-186
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• 2002

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist (PR) and to bake coated PR in FAB process of semiconductor. The badness of Hot Plate (HP) has directly influence upon the performance of wafer, it is necessary to guarantee the performance of HP. In this study, a reliability evaluation system has been designed and developed, which is to measure and to estimate thermal uniformity and flatness of HP in range of temperature 0~$250^\circC$. This system has included the techniques which measures and analyzes thermal uniformity using infrared thermal vision, and which compensates measuring error of flatness using laser displacement sensor For measuring flatness, a measurement stage of 3 axes are developed which adapts the precision encoder. The allowable error of this system in respect of thermal uniformity is less $than\pm0.1^\circC$ and in respect of flatness is less $than\pm$1mm . It is expected that the developed system can measure from $\Phi200mm\;(wafer 8＂)\;to\;\Phi300mm$ (wafer 12＂) and also can be used in performance test of the Cool Plate and industrial heater, etc.