• Title/Summary/Keyword: 재료물성시험

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Evaluation of Interfacial Properties on the Electrodeposited Carbon Fiber Reinforced Polyetherimide Toughened Epoxy Composites using Micromechanical Test (Micromechanical 시험법을 이용한 전기증착된 탄소섬유 강화 Polyetherimide로 강인화된 에폭시 복합재료의 계면물성 평가)

  • 박종만;김대식;공진우;김민영;김원호
    • Composites Research
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    • v.15 no.3
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    • pp.39-44
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    • 2002
  • Interfacial properties and microfailure modes or electrodeposition(ED) treated carbon fiber reinforced polyetherimide(PEI) toughened epoxy composites were investigated using microdroplet test. ED was performed to improve the interfacial shear strength(IFSS). As PEI content increased, IFSS increased due to enhanced toughness and plastic deformation of PEI. In the untreated cafe, IFSS Increased with adding PEI content, and IFSS of pure PEI matrix showed the highest. On the other hand, thor ED-treated case IFSS increased with PEI content with rather low improvement rate. In the untreated case, neat epoxy resin appeared brittle microfailure mode, whereas pure PEI matrix exhibited more likely ductile microfailure mode. In the ED-treated case, neat epoxy exhibited more ductile fracture compared to the untreated case. Interfacial properties of epoxy-PEI composite can be affected efficiently by both the control of matrix toughness and ED treatment.

Comparison of Mechanical Properties on Helical/Hoop Hybrid Wound HNT Reinforced CFRP Pipe with Water Absorption Behavior (CFRP 파이프의 와인딩 적층 패턴 설계 및 HNT 나노입자 보강에 따른 수 환경에서의 기계적 물성 평가)

  • Choi, Ji-Su;Park, Soo-Jeong;Kim, Yun-Hae
    • Composites Research
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    • v.34 no.3
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    • pp.174-179
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    • 2021
  • Currently, fluid transfer steel pipes take a lot of time and expense to maintain all facilities due to new construction and painting or corrosion and aging. Therefore, this study was conducted for designing a CFRP pipe structure with high corrosion resistance and chemical resistance as a substitute for steel pipes. The helical/hoop pattern was cross-laminated to improve durability, and HNT was added to suppress the moisture absorption phenomenon of the epoxy. The HNT/CFRP pipe was manufactured by a filament winding process, and performed a mechanical property test, and a moisture absorption test in distilled water at 70℃. As a result, the highest bending strength was obtained when the hoop pattern was laminated with a thickness equivalent to 0.6% of the pipe. The 0.5 wt% HNT specimen had the highest moisture absorption resistance. Also, the delamination phenomenon at the interlayer interface was delayed, resulting in the lowest strength reduction rate.

Material Properties for Reliability Improvement in the FEA Results for Rubber Parts (고무 제품 유한요소해석 결과의 신뢰 향상을 위한 물성치 연구)

  • Baek, Un-Cheol;Cho, Maeng-Hyo;Hawong, Jai-Sug
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.11
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    • pp.1521-1528
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    • 2011
  • We studied the material properties for reliability improvement in finite element analysis results for a nitrile butadiene rubber hub-bearing seal and for a carbon-filled rubber mount used in a vehicle. It was difficult to measure the material properties of hundreds of types of rubber for the mount design. Thus, we suggested that the engineering stressstrain relations from pure shear test data could be synthesized by using simple tension data and Poisson's ratio. We defined Poisson's ratio by using a function of principal stretches to synthesize the stress-strain relations for a pure shear test. A transformation of the pure shear data was applied to the experimental values to obtain the predicted results when the strain approaches 100%. In the finite element analysis for the contact force of a hub-bearing seal, the strain results that used the transformation of the pure shear data and simple tension data almost corresponded to the experimental values. Ogden constants were used to analyze.

High Temperature Tensile Stress Behavior of Hydrogen Vessel Composite Materials for Hydrogen Fuel Cell Bus (수소버스용 내압용기 복합재의 열적환경에 따른 기계적 물성 연구)

  • Hyunseok, Yang;Woo-Chul, Jung;Kwang Bok, Shin;Man-Sik, Kong
    • Composites Research
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    • v.35 no.6
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    • pp.425-430
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    • 2022
  • In this study, the mechanical properties of the pressure vessel composite exposed to the thermal environment were evaluated to establish the standard for high temperature static pressure test of the pressure vessel for hydrogen bus. As the tensile strength of the composite material approaches the glass transition temperature of the epoxy resin, the strength decreases due to the deterioration of the epoxy resin. In addition, it was confirmed that the tensile strength increased again due to the post-curing of the epoxy resin during long-term exposure. Therefore, the accelerated stress rupture test conditions of the pressure vessel for the hydrogen bus should be set based on the epoxy resin properties of the carbon fiber composite material.

A Study on the Prediction of the Mechanical Properties of Printed Circuit Boards Using Modal Parameters (모달 파라미터 정보를 활용한 PCB 물성 예측에 관한 연구)

  • Choo, Jeong Hwan;Jung, Hyun Bum;Hong, Sang Ryel;Kim, Yong Kap;Kim, Jae San
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.41 no.5
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    • pp.421-426
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    • 2017
  • In this study, we propose a method for predicting the mechanical properties of the printed circuit board (PCB) that has transversely isotropic characteristics. Unlike the isotropic material, there is no specific test standard for acquisition of the transversely isotropic properties. In addition, common material test methods are not readily applicable to that type of laminated thin plate. Utilizing the natural frequency obtained by a modal test and the sizing optimization technique provided in $OptiStruct^{(R)}$, the mechanical properties of a PCB were derived to minimize the difference between test and analysis results. In addition, the validity of the predicted mechanical properties was confirmed by the MAC (Modal Assurance Criteria) value of each of the compared mode shapes. This proposed approach is expected to be extended to the structural analysis for the design verification of the top product that includes a PCB.

Thermal and Mechanical Properties of OG POSS Filled DGEBA/DDM (OG POSS의 첨가가 DGEBA/DDM의 열적, 기계적 물성에 미치는 영향)

  • Choi, Chunghyeon;Kim, YunHo;Kumar, Sarath Kumar Sathish;Kim, Chun-Gon
    • Composites Research
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    • v.30 no.6
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    • pp.379-383
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    • 2017
  • A study on the low Earth orbit (LEO) space environment have been conducted as a use of composites have increased. Among the LEO environmental factors, atomic oxygen is one of the most critical factors because atomic oxygen can react and erode a surface of polymer-based composite materials. POSS (Polyhedral Oligomeric Silsesquioxane) materials have been widely studied as an atomic oxygen-resistant nanomaterial. In this study, nanocomposites, which are composed of OG (Octaglycidyldimethylsilyl) POSS nanomaterials and DGEBA/DDM epoxy, were fabricated to find out its thermal and mechanical properties. FT-IR results showed that the nanocomposites were fully cured and contained OG POSS enough. Thermogravimetric analysis and differential scanning calorimetry were performed to measure the thermal properties of the nanocomposites. The initial mass loss temperature and char yield were increased through the filling of OG POSS. As the content of OG POSS increased, glass transition temperature tended to increase to 5 wt.% of OG POSS, but the temperature decreased significantly at 10 wt.% of OG POSS. The tensile test results showed that the content of OG POSS did not affect tensile strength and tensile stiffness.

Characterization for Viscoelasticity of Glass Fiber Reinforced Epoxy Composite and Application to Thermal Warpage Analysis in Printed Circuit Board (유리섬유강화 복합재의 점탄성 특성 규명 및 인쇄회로기판 열변형해석에의 적용)

  • Song, Woo-Jin;Ku, Tae-Wan;Kang, Beom-Soo;Kim, Jeong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.2
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    • pp.245-253
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    • 2010
  • The reliability problems of flip chip packages subjected to temperature change during the packaging process mainly occur due to mismatches in the coefficients of thermal expansion as well as features with time-dependent material properties. Resin molding compounds like glass fiber reinforced epoxy composites used as the dielectric layer in printed circuit boards (PCB) strongly exhibit viscoelastic behavior, which causes their Young's moduli to not only be temperature-dependent but also time-dependent. In this study, the stress relaxation and creep tests were used to characterize the viscoelastic properties of the glass fiber reinforced epoxy composite. Using the viscoelastic properties, finite element analysis (FEA) was employed to simulate thermal loading in the pre-baking process and predict thermal warpage. Furthermore, the effect of viscoelastic features for the major polymeric material on the dielectric layer in the PCB (the glass fiber reinforced epoxy composite) was investigated using FEA.

A study on the Change of Uniaxial Compressive Strength and Young's Modulus According to the Specimen Size of Intact Material (무결함 재료의 크기에 따른 강도와 탄성계수의 변화에 관한 연구)

  • Lee, Seung-Woo;Song, Jae-Joon
    • Journal of Korean Tunnelling and Underground Space Association
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    • v.8 no.3
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    • pp.205-217
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    • 2006
  • Rock and discontinuities are main factors consisting of a rock mass and the physical properties of each factor have direct effects on the mechanical stability of artificial structures in the rock mass. Because physical properties of the rock and discontinuities change a lot according to the size of test materials, a close attention is needed when the physical properties, obtained from laboratory tests, are used for the design of field structures. In this study, change of physical properties of intact materials due to the change of their size are studied. Six kinds of artificial materials including crystal, instead of an intact rock, are adopted for the study to guarantee the homogeneity of specimen materials even with relatively large size. Uniaxial strength and Young's modulus of each artificial material are checked out for a size effect and compared with the predicted values by Buckingham's theorem - dimensional analysis. A numerical analysis using PFC (Particle Flow Code) is also applied and primary factors influencing on the size effect are investigated.

Effects of Wood Flour Size on the Physical Properties of Polypropylene/Wood Flour Composites (목분의 크기가 폴리프로필렌/목분 복합재료의 물성에 미치는 영향)

  • Seo, Yong Won;Kim, Dae Su
    • Polymer(Korea)
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    • v.38 no.3
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    • pp.327-332
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    • 2014
  • Polymer/wood flour composites are recently attracting a lot of interest because they are economic and ecofriendly. In this study, the effects of wood flour size on the thermal and mechanical properties of a polypropylene/wood flour composite were investigated. Mechanical properties of the composite samples prepared by melt-mixing and compression molding were tested by UTM and an izod impact tester, and thermal properties of them were measured by TGA, DMA, DSC and TMA. The best coupling agent was selected by testing three kinds of maleic anhydride modified polypropylene coupling agents, and under the same condition, the effects of wood flour size on the physical properties of the composite were investigated. According to the test results for four different wood flour sizes of 600, 250, 180 and $150{\mu}m$, flexural strength, flexural modulus, crystallinity and water-resistivity of the composite increased with decreasing wood flour size.