• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1632-1634
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• 1998

In this paper, the study of influence of DC voltage and AC voltage on residual voltage of XLPE Cable was presented. In the former case, when the DC voltage of -10.0[kV] was applied to XLPE Cable for 0, 600, 1200, 1800[sec], time constants were 2139, 1416, 939, 488[sec] and resistivities were 930, 615.65, 408.26, 212.17[${\Omega}{\cdot}m$] respectively. In the latter case, when the AC voltage of 4 and 6[kV] was applied to the same Cable for 600[sec] after applying DC voltage of -5.0[kV] for 600[sec], time constants were 215, 275[sec] and resistivities were 93.48, 119.57[${\Omega}{\cdot}m$] respectively. In this experiments, measurement voltage, charging time and measurement time were -8.0[kV], 30[sec], 600[sec] respectively.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.05a
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• pp.795-797
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• 2010

습식 식각은 식각용액으로서 화학용액을 사용하는 공정으로 반응물이 기판표면에서 화학반응을 일으켜 표면을 식각하는 과정이며, 표면결합의 제거를 위한 식각연마와 폴리싱을 위한 식각, 그리고 구조적 형상 패턴등이 있다. 여기서 화학용액은 산화제 또는 환원제 역할을 하는 혼합용액으로 구성된다. 습식 식각 시 수${\mu}m$의 해상도를 얻기 위해서는 그 부식액의 조성이나, 에칭시간, 부식액의 온도 등을 고려하여야 한다. 또한 습식 식각 후 포토 레지스트를 제거하는 과정에서 포토 레지스트를 깨끗이 제거해야 하며, 제거공정 자체가 a-Si:H 박막을 부식 하지 않을 조건으로 행하여야 한다. 포토레지스트 제거 후 잔류 포토 레지스트를 제거하기 위해서 본 실험에서는 RCA-I 세척 기법을 사용한 후 D.I 로 린스 하였다. 본 실험에서 사용한 금속은 Cr, Al, ITO 로 모두 DC sputter 방법을 사용해서 증착하여 사용하였다. Cr박막은 $1300\AA$ 정도의 두께를 사용하였고, ITO (Indium Tin Oxide) 박막은 가시광 영역에서 투명하고 (80% 이상의 transmittance), 저저항 (Sheet Resistance : $50{\Omega}/sq$ 이하) 인 박막을 사용하였으며, 신호선으로 주로 사용되는 Al등의 증착조건에 따른 wet etching 특성을 조사하였다.

• Korean journal of applied entomology
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• v.14 no.1 s.22
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• pp.29-33
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• 1975

The experiment It·as conducted to find out the distribution of fenitrothion in rice plants at the preheading stage and its residue in harvested grains. The results obtained were as follows; 1. Distribution of fenitrothion in rice plants were measured 15.32 ppm attached to the leaf surface immediately after spray and 6.73 ppm was penetrated into tissues after 24 hours. 2. Residual amounts of fenitrothion in rice grains was 0.04 ppm at chaff and 0.01 ppm at unpolished rice, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.99-99
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• 2013

나노결정질 다이아몬드(Nanocrystalline Diamond: NCD) 박막은 고경도와 낮은 마찰계수를 가지고 있어 초경합금이나 고속도강과 같은 절삭공구 위에 코팅하여 공구의 성능 향상을 도모하려는 노력이 있어 왔다. 그러나 NCD 박막의 잔류응력이 크고, 초경합금과 철계 금속에 NCD가 증착되지 않는다는 문제점이 있다. 따라서 잔류응력 완화와 다이아몬드 핵생성을 위하여 제3의 중간층 재료가 필요하다. 본 연구에서는 W과 Ti을 중간층으로 하여 초경합금(WC-Co)과 고속도강(SKH51)에 NCD 박막을 코팅하고 기계적 특성을 비교하였다. 초경합금 또는 고속도강기판 위에 W 또는 Ti 중간층을 DC magnetron sputter를 이용해 각 1 ${\mu}m$의 두께로 증착하고 그 위에 MPCVD (Microwave Plasma Chemical Vapor Deposition)를 이용해 NCD 박막을 2${\mu}m$의 두께로 코팅하였다. FESEM을 이용하여 표면과 단면의 형상을 관찰하였고, XRD와 Raman spectroscopy를 통해 NCD 박막의 결정성을 확인하였다. 그리고 tribology test를 실시하여 코팅된 박막의 내마모성을 비교하였으며, Rockwell C indentation test를 이용하여 밀착력을 비교하였다. 초경합금에 적용 시, W이 Ti보다 중간층으로서 더 우수한 것으로 나타났으며 이는 열팽창계수 차이에 의한 잔류응력의 차이에 의한 것으로 여겨진다. 중간층 두께에 따른 박막의 기계적 특성 변화를 알아보기 위해 W 중간층의 두께를 1, 2, 4 ${\mu}m$로 변화를 주었다. 중간층 두께가 2 ${\mu}m$ 이상일 때 박막의 밀착력이 증가되는 것으로 나타났다. 고속도강 위에 같은 방법으로 1 ${\mu}m$의 W 또는 Ti 중간층 위에 2 ${\mu}m$의 NCD 박막을 코팅한 시편들은 초경합금에 코팅한 것과 달리 두 시편 모두 낮은 밀착력을 나타내었다. 열팽창계수 차이에 의한 잔류응력을 완화하기 위해 고속도강에 W/Ti 복합박막을 중간층으로 Ti, W순으로 각각 1 ${\mu}m$ 두께로 증착 후 그 위에 NCD 박막을 2 ${\mu}m$ 두께로 코팅 한 후 특성을 비교하였다. Ti/W 복합 중간층 위에 코팅된 NCD 박막의 밀착력이 W 혹은 Ti 단일 중간층에 코팅된 박막에 비해 우수한 것으로 나타났다. 그러나 실제 공구에 적용하기에는 박막의 밀착력 개선이 요구되며 이를 위해서 더 연구가 필요하다.

• Journal of the Korean Chemical Society
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• v.29 no.5
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• pp.503-509
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• 1985

Sixteen organochlorine pesticides extracted out from the crops and cleaned by solvent-solvent partitioning and Florisil column chromatography were determined by gas-liquid chromatography. The majority of the pesticides were well separated by being eluted through 5% QF-1 column and some of them through 3% OV-17 column and 2.596 DC-200/2.5% QF-1 column, and the eluted pesticides were detected by $^{63}Ni$ electron capture detector. The linear calibration curves were obtained for the most of pesticides while some curves were slightly deviated from the linearity. In the determination of 16 pesticides added to thirteen kinds of crops, the recoveries were showed over 85% for the most cases and the relative standard deviations of 5 analyses were less than 12.1%. The results were within the criteria of the AOAC method.

• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.389-393
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• 2000

Effects of Co addition and heat treatment on the magnetic properties of Fe-Si-B thin films were investigated. The compositions of metalloids, i.e, B and Si, in the alloys were kept 10 at.% each. Heat treatments were carried out in the temperature range from 100 to $300^{\circ}C$ for up to 60 min. Amorphous thin films of FeCoSiB were deposited on the water-cooled substrates by dc magnetron sputtering. The composition of thin films was controlled by placing proper number of pellets of alloying elements and analyzed by ICP, resulting in $Fe_{80-X}Co_ XB_{10}Si_{10}$ (X=8~18 at.%). Saturation magnetization of the alloys increased as Co concentration increased up to 10 at.% and then decreased with further increase of Co concentration. However, coercive force of the films decreased with the increase of Co concentration. Furthermore, the coercive force was also reduced by the annealing due to the residual stress relief.

• Korean Journal of Environmental Agriculture
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• v.16 no.3
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• pp.207-211
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• 1997

Laboratory experiments were conducted to the potential ability of bioremediation with bentazon such as determining the absorption, translocation, and metabolism of $^{14}C-Bentazon$ in minari after foliar applications. The absorption and translocation of $^{14}C-bentazon$ were compared when applied to foliar of minari. In foliar applications, 21% was observed in treated leaves, 66% remained in water extracts of leaf surfaces, and 13% was found in the epicuticular wax layer after 2d. Translocation of the herbicide from treated leaves to roots was very low(79 to 9%). Analysis of methanol-soluble extracts of $^{14}C$ indicated that more than 60% of the foliarapplied herbicide was metabolized in all plant sections after 2d. However, 77% or more of the bentazon was degraded in roots and shoots 2d after root absorption. The major metabolite in these experiments was an unknown compound that was less polar than bentazon and 6- and 8-hydroxy bentazon.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.46 no.11
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• pp.16-23
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• 2009

A 12b 10MS/s pipelined ADC with low DC gain amplifiers is presented. The pipelined ADC using a reference scaling technique is proposed to compensate the gain error in MDACs due to a low DC gain amplifier. To minimize the performance degradation of the ADC due to amplifier offset, the proposed offset trimming circuit is employed m the first-stage MDAC amplifier. Additional reset switches are used in all MDACs to reduce the memory effect caused by the low DC gain amplifier. The measured differential and integral non-linearities of the prototype ADC with 45dB DC gain amplifiers are less than 0.7LSB and 3.1LSB, respectively. The prototype ADC is fabricated in a $0.35{\mu}m$ CMOS process and achieves 62dB SNDR and 72dB SFDR with 2.4V supply and 10MHz sampling frequency while consuming 19mW power.

• Journal of the Korean institute of surface engineering
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• v.32 no.2
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• pp.93-99
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• 1999

Surface polymer layer formed on the silicon wafer during the oxide overetching using $C_4F_8$/ helicon wave plasmas and their characteristics were investigated using spectroscopic elipsometry, X-ray photoelectron spectroscopy, and secondary ion mass spectrometry. Overetch percentage and dc-self bias voltage were varied to investigate the effects on the characteristics of the polymers remaining on the overetched silicon surface. The increase of bias voltage from -80 volts to -120 volts increased the C/F ratio and carbon bondings such as C-C, $C-CF_x$/, and C-Si in the polymer while reducing the thickness of the polymer layer. However, the increase of the overetch percentage from 50% to 100% did not change the composition of the polymer layer and the carbon bondings in the polymer layer remained same even though it increased the polymer thickness. The polymer layer formed at the higher dc-self bias voltage was more difficult to be removed by the following various post-etch treatments compared to that formed at the longer overetch percentage.

• Applied Chemistry for Engineering
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• v.18 no.1
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• pp.24-28
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• 2007

The etching of zinc oxide (ZnO) thin films has been studied using a high density plasma in a $Cl_2/Ar$ gas. The etch characteristics of ZnO thin films were systematically investigated on varying $Cl_2$ concentration, coil rf power, dc-bias voltage, and gas pressure. With increasing $Cl_2$ concentration, the etch rate of ZnO thin film increased, the redeposition around the etched patterns decreased but the sidewall slope of the etched patterns slanted. As the coil rf power and dc-bias voltage increased, the etch rates of ZnO thin films increased and etch profiles of ZnO thin films were improved. With increasing gas pressure, the etch rate of ZnO thin films slightly increased but little change in etch profile was observed. Based on these results, the optimal etching conditions of ZnO thin film were selected. Finally, the etching of ZnO thin films with a high degree of anisotropy of approximately $75^{\circ}{\sim}80^{\circ}$ without the redepositions and residues was successfully achieved at the etching conditions of 20% $Cl_2$ concentration, coil rf power of 1000 W, dc-bias voltage of 400 V, and gas pressure of 5 mTorr.