• Title/Summary/Keyword: 잔류 구조

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Analysis of Residual Stresses Induced during Adhesion Process of Chip and Leadframe (칩과 리드페임의 접착과정에서 발생하는 잔류 응력 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.13 no.1
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    • pp.97-103
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    • 2000
  • This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

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Development of Micro/nanostructured Superhydrophobic Surface (마이크로/나노구조를 이용한 초발수 표면 특성 연구)

  • Lee, Ju-Yeong;Mun, Seong-Mo;Jeong, Yong-Su
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.187-187
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    • 2013
  • 알루미늄 표면에 산/알칼리 에칭법을 이용하여 복합구조를 형성시키고 소수성 물질을 코팅한 후 접촉각과 구름각을 측정하여 초발수 특성을 확인하였다. 표면의 복합구조는 전자현미경을 이용하여 정밀하게 관찰되었고 표면의 구조 및 잔류물에 따른 초발수 특성의 변화를 관찰하였다. 이는 향후 다양한 기능성 코팅 소재 분야에 유용하게 적용될 수 있을 것으로 기대된다.

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박막형 CIGS 연성태양전지용 Mo 배면전극 증착에 관한 연구

  • Kim, Gang-Sam;Jo, Yong-Gi
    • Proceedings of the Korean Vacuum Society Conference
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    • 2010.02a
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    • pp.169-169
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    • 2010
  • 박막형 CIGS 태양전지의 배면전극으로 사용되는 Mo 박막은 낮은 저항으로 인한 전기전도성과 열적 안전성이 아주 우수하다. 연구에서는 연성 CIGS 태양전지의 제조를 위한 Mo 배면전극의 대면적 증착기술에 관한 것으로 DC Magnetron Sputtering 공정을 이용하여 전주기술을 통한 Ni-Fe계 연성기판재 위에 졸걸법으로 합성된 $SiO_2$ 절연박막에 Mo 박막을 증착하는 것을 목적으로 하고 있다. 실험에서는 연성기판재 대신 시편을 Sodalime glass, Si wafer, SUS계 소재를 사용하여 스퍼터링 공정에 의한 Mo 박막을 증착하였다. 실험에서 타겟에 인가되는 전력과 공정압력을 변수로 하여 Mo 박막의 증착율, 전기저항성을 측정하였다. 타겟의 크기는 $80mm{\times}350mm$, 타겟과 기판간 거리 20cm 이었으며, 공정 압력은 2~50 mtorr 영역에서 인가전력을 0.5-1.5kW로 하였다. Mo 박막의 증착율과 전기적 특성을 측정하기 위하여 $\alpha$-step과 4-point probe(CMT-SR 1000N)를 이용하였다. 그리고 Mo 박막의 잔류응력을 측정하기 위하여 잔류응력측정기를 이용하였다. Mo 박막의 미세구조분석을 위하여 SEM 및 XRD를 분석을 실시하였다. 배면전극으로서 전기저항성은 공정압력에 따라 좌우 되었으며, 2 mTorr 공정압력과 1.5kW의 전력에서 최소값인 $8.2\;{\mu}{\Omega}-cm$의 저항값과 증착율 약 $6\;{\mu}/h$를 보였다. 기판재와의 밀착성과 관련한 잔류응력 측정과 XRD분석을 통한 결정립 크기를 분석하여 공정압력에 따른 Mo 박막의 잔류응력과 전기 저항 및 결정립 크기의 상관관계를 조사하였다. 그리고 대면적 CIGS 증착공정을 위해 직각형 타겟을 통해 증착된 Mo 박막의 증착분포를 20cm 이내 조사하였다.

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Remaining persons estimation system using object recognition (객체인식을 활용한 잔류인원 추정 시스템)

  • Seong-woo Lee;Gyung-hyung Lee;Jin-hoon Seok;Kyeong-seop Kim;Min-seo Jeon;Seung-oh Choo;Tae-jin Yun
    • Proceedings of the Korean Society of Computer Information Conference
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    • 2023.01a
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    • pp.269-270
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    • 2023
  • 재해, 재난 발생 시에 구조대가 건물 내부나 지하철 등, 특정 구역 내의 대피하지 못한 잔류인원을 제대로 파악하데 어려움을 겪는다. 이를 개선하고자 YOLO와 DeepSORT를 활용하여 통행자를 인식하여 특정 구역의 잔류인원을 파악하고 이를 서버를 통해 확인할 수 있는 시스템을 개발하였다. 실시간 객체인식 알고리즘인 YOLOv4-tiny와 실시간 객체추적기술인 DeepSORT 알고리즘을 이용하여 제안한 방법을 Ubuntu환경에서 구현하고, 실내 상황에 맞춰 통행자 동선을 고려해서 적용하였다. 개발한 시스템은 인식된 통행자 객체방향으로 출입을 구분하여 데이터를 서버에 저장한다. 이에 따라 재해 발생 시 구역의 잔류인원을 파악하여 빠르고 효율적으로 요구조자 위치와 인원을 예측할 수 있다.

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Prediction of Cutting Stress by 2D and 3D-FEM Analysis and Its Accuracy (2차원과 3차원 FEM 해석에 의한 절단응력의 해석 및 정도)

  • 장경호;이상형;이진형;강재훈
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.16 no.3
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    • pp.261-269
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    • 2003
  • Steel bridges, which have been damaged by load and corrosion, need repair or strengthening. In general, before the repair welding procedure, cutting procedure carry out. Therefore, the investigating of the behavior of stress generated by cutting is so important for safety of structure. Residual stress produced by gas cutting was analyzed using 2D and 3D thermal elasto plastic FEM. According to the results, the magnitude of temperature was analyzed by 2D FEM is smaller than that was analyzed using the 3D FEM program at the start and end edge of flange. And the magnitude and distribution of residual stress of perpendicular to the cutting line was analyzed by the 2D FEM program was similar to that was analyzed by the 3D FEM program. Therefore, it is possible to predict of cutting stress by 2D and 3D FEM.

Development of Longitudinal Ultimate and Residual Strength Estimation System for Hull Girder Structure (선각 거어더의 최종 몇 잔류종강도 추정 시스템 재발)

  • J.H. Ham;U.N. Kim
    • Journal of the Society of Naval Architects of Korea
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    • v.32 no.3
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    • pp.107-115
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    • 1995
  • A simple estimation system of ultimate and residual strength for ship structures is developed on the Open-Window system of SUN4 engineering workstation. System development consists of three stages. Firstly, various ultimate longitudinal strength estimation methods are investigated and some rational estimation methods are adopted based on the parametric comparison of various hulls or box girders. Secondly, these selected and newly formulated methods are linked with elastic & perfectly plastic section modulus calculation procedure. Therefore, the longitudinal hull girder strength can be calculated in the intact and damaged conditions due to the grounding or collision of hull structure. Finally, an exclusive system is developed such that whole procedures are proceeded under the window management system using mouse button and elastic and perfect plastic stress conditions. Also longitudinal members are plotted automatically under three dimensional graphic circumstances. These established program is tested for various actual ships, and some examples are illustrated.

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Dental Co-Cr alloys fabricated by selective laser melting: A review article (선택적 레이저 용융 방법으로 제작한 치과용 코발트 크롬 합금에 대한 문헌고찰)

  • Kang, Hyeon-Goo
    • The Journal of Korean Academy of Prosthodontics
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    • v.59 no.2
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    • pp.248-260
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    • 2021
  • Cobalt-chromium alloys are used to fabricate various dental prostheses, and have advantages of low cost and excellent mechanical properties compared to other alloys. Recently, selective laser melting, which is an additive manufacturing method, has been used to overcome the disadvantages of the conventional fabrication method. A local rapid heating and cooling process of selective laser melting induces fine microstructures, grain refinement, and reduction of porosities of the alloys. Therefore, it can improve mechanical properties compared to the alloys fabricated by the conventional method. On the other hand, layering process and rapid heating and cooling cause accumulation of a large amount of residual stresses that can adversely affect the mechanical properties. A heat treatment for removing residual stresses through recovery and recrystallization process caused complicated changes in mechanical properties induced by phase transformation, precipitate and homogenization of the microstructures. The purpose of this review was to compare the manufacturing methods of Co-Cr alloys and to investigate the characteristics of Co-Cr alloys fabricated by selective laser melting.

Bond Strength of Wafer Stack Including Inorganic and Organic Thin Films (무기 및 유기 박막을 포함하는 웨이퍼 적층 구조의 본딩 결합력)

  • Kwon, Yongchai;Seok, Jongwon
    • Korean Chemical Engineering Research
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    • v.46 no.3
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    • pp.619-625
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    • 2008
  • The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.