• Superconductivity and Cryogenics
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• v.4 no.1
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• pp.28-33
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• 2002

디지털 소자 구현에 가장 기본적인 조셉슨 접합의 특성 중 잘 알려진 특성이 아닌 자기장 하에서 접합의 거동을 살펴보았다. 자기장이 접합면에서 평행하게 걸린 경우에는 임계온도 이하에서도 어느 특정 온도에서 저항이 나타나는데 이는 그 때 접합을 투과하는 자속이 단자속의 정수배가 되는 경우에 해당함을 보였다. 이로부터 초전도 전극의 침투깊이의 크기와 온도의존성을 구할 수 있었다. 자기장이 접합면에 수직하게 걸린 경우에는 자기장이 볼텍스의 형태로 전극에 침투하여 전체접합을 볼텍스의 수로 나누는 역할을 함을 보였다. 이로써 자기장이 증가할수록 저항전이 폭이 증가함을 설명할 수 있었고 이는 고온초전도체의 거동을 이해하는 데에도 사용될 수 있음을 보였다.

• Journal of the Korean Vacuum Society
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• v.15 no.4
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• pp.367-373
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• 2006

We have observed a large increase in the magnetoresistance (MR) of Bi thin films, which were subjected to a post-annealing procedure at $268^{\circ}C$C, $3^{\circ}C$ below the Bi melting point. We have achieved an increase in the MR by 260-fold and 1200-fold at 5 K and 5 T after post-annealing, as compared with 190 and 620 for an as-deposited Bi film on PbTe/CdTe(111) and on mica, respectively. The large MR increase by post-annealing might be due to the improvement of crystallinity according to the x-ray analysis. However, post-annealing over a certain amount time showed the reduction in MR values.

• Journal of the Korean Magnetics Society
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• v.3 no.4
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• pp.305-309
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• 1993

Thermal stability of Co/Cu artificial superlattice (AS) prepared by RF-magnetron sputtering and the effect of low temperature annealing on the magnetoresistance of the AS have been investigated in this work. Dependence of annealing behavior on the Cu spacer thickness, Fe underlayer thickness, and kind of the underlayer was examined and the relationship between the interfacial reaction and magnetoresistance was studied. It turned out that when Co/Cu AS was annealed at low temperature ($<450^{\circ}C$), the magnetoresistance could increase in the case of AS with thick spacer Cu ($20~25\AA$) layer, whereas it decreased in the case of AS with thin spacer Cu ($7\AA$) layer, which of the former is in contrast with previous reports and the latter in consistent with them. The increase of magnetoresistance is due to increase of interfacial atomic sharpness, which is supported by low angle X-ray diffraction analysis. The thermal stability of Co/Cu AS was better in the case of thick Fe underlayered AS. Interfacial reaction (separation of intermixed Co and Cu) could be observed at lower temperature for (200)-textured samples than for (111)-textured samples, which can be interpreted in terms of interdiffusion kinetics depending on the crystallographic orientation.

• Journal of the Korean Magnetics Society
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• v.4 no.3
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• pp.239-243
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• 1994

$NiFe/TbCo/Si_3N_4$ thin films were fabricated, which can be employed as dualOongitudinal and transverse) biased magnetoresistive elements utilizing surface magnetic exchange at the interface of NiFe/TbCo films. When Tb area percent was 36 % and substrate bias was not applied, magnetic exchange fields of 100~180 Oe were obtained. The thicknesses of NiFe, TbCo and $Si_3N_4$(Protective layer) were $470\;{\AA},\;2400\;{\AA}\;and\;600\;{\AA}$, respectively. Magnetoresistance ratio of 1.45 % was obtained using NiFe films fabricated with 1000 W power and 2.5 mTorr of Ar pressure. The MR ratio of microstructured elements was reduced to 1.31 % and the MR response curves were shown not to saturate due to demagnetizing fields of the elements. When elements were fabricated with $36^{\circ}$ of misalignment with respect to the exchange field direction using films having 150 Oe exchange field, MR response curve was shifted by 85 Oe, and the operating point of the device shifted to the linear region of the response. Also, the Barkhausen noise was eiminated due to longitudinal bias field originating from the exchange field.

• Journal of the Korean Magnetics Society
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• v.7 no.3
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• pp.146-151
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• 1997

Buffer (t $\AA$)/ CoFe(35$\AA$)/Cu (50$\AA$)/Co (35$\AA$) sandwiches prepared by dc magnetron sputtering on Corning glass substrates using the $Co_{90}Fe_{10}$ and Co layers with different coercivities. Dependence of magnetoresistance on the type and thickness of buffer layers, and on the thickness of Cu and the magnetic layers in buffer/ CoFe/Cu /Co sandwiches were investigated. Magnetoresistance ratio and saturation field $H_s$ increased as thickness of the buffer layer becomes thicker, then decreased smoothly after a maximum value. An improved filed sensitivity was realized with the $Ni_{81}Fe_{19}$ buffer layer.

• Journal of the Korean Magnetics Society
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• v.14 no.1
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• pp.13-17
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• 2004

We have investigated the effect of Hf insertion in the Al oxide tunnel barrier on the properties of magnetic tunnel junctions (MTJs). MTJs with Hf inserted barrier show the higher tunnel magnetoresistance (TMR) ratio and less temperature and bias voltage dependence of TMR than MTJs with a conventional Al$_2$O$_3$ barrier. The enhancement of TMR ratio and the reduction of the temperature and bias voltage dependence might be due to the reduction of defects in the barrier. Al-Hf oxide was formed by depositing Al and Hf simultaneously, and oxidizing the compound films. The TMR ratio of 36% was almost the same value as that with Hf inserted barrier. This implies that the inserted Hf layers mixed with Al layers during deposition or oxidation, and they might form Al Hf oxide barriers. This compound Al Hf oxide formation may be responsible to reduction of defect concentration which enhanced the TMR ratio and reduced temperature and bias-voltage dependence.

• Journal of the Korean Magnetics Society
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• v.9 no.3
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• pp.159-165
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• 1999

Structural, magnetic and magnetoresistance behavior of NiFe/Ag multilayers prepared by a magnetron sputter under an Ar and $Ar/H_2$ atmosphere was studied. It was difficult to make a uniform multilayer by using an Ar atmosphere. However, the uniform multilayers could be fabricated by using an $Ar/H_2$ atmosphere. This was thought to be due to decrease in the energy of the sputtered atom and Ar content of the film. Typical magnetoresistance behavior of the discontinuous NiFe/Ag multilayers appeared when the uniform multilayer was formed and annealed. Substrate temperature did not improve the uniformity of the multilayers. Above 20$0^{\circ}C$ of the substrate temperature, the films were almost formed into granular alloys rather than multilayers.

• Journal of the Korean Vacuum Society
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• v.4 no.1
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• pp.67-76
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• 1995

자기저항헤드용 Ni-Fe-Co/Cu/Ni-Fe-Co/Fe-Mn 다층박막에서 자기적 성질과 전기적 성질에 관하여 조사하였다. 저 포화자계에서 고 자기저항을 나타내는 스핀 밸브형 다층박막을 제작하기 위하여 Borond이 도핑된 p-type Si(100)기판위에 Ni-Fe-Co 단층박막과 Si/Ni-Fe-Co/Cu/Ni-FeCo, Si/Ni-Fe-Co/Fe-Mn 구조의 다층막을 제작하여 자기적 특성을 조사하였다. Ni-Fe-Co 단층박막의 자기적 특성은 고정된 아르곤 분압에서 박막의 두께 등에 의존성이 있는 것으로 나타났다. 또한 Si/Ni-Fe-Co($70AA$)/Fe-Mn 구조에서 Ni-Fe-Co와 Fe-Mn 계면에서의 두 자성층의 이방성 차이에 의해서 발생되어지는 교환자기이방성이 존재하였으며, 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값은 Fe-Mn 두께가 $150\AA$일 때 가장 큰 값을 나타내었다. Ni-Fe-Co texture와 교환자기이방성자계값의 의존성을 알아보기 위하여 Ti, Cu를 바닥층으로 사용하였다. Ti을 바닥층으로 사용하였을 경우, 교환자기이방성자계값은 23.5 Oe 정도의 가장 큰 값을 나타내었다. XRD 분석결과, Ti 바닥층이 Cu 바닥층이나, 바닥층이 없는 경우와 비교하여 성막된 Ni-Fe-Co 자성층의 강한 fcc(111) texture를 형성하는 것으로 나타났다. 각각의 단층박막과 다층박막에서의 자기적 특성을 측정한 후, Si/Ti($50\AA$)/Ni-Fe-Co($70\AA$)/Cu($23\AA$)/Ni-Fe-Co($70\AA$)/Fe-Mn(150$\AA$)/Cu(50$\AA$)의 스핀밸브구조를 갖는 다층박막을 제작하였으며, 11 Oe의 낮은 포화자계값에서 4.1%의 고 자기저항값을 얻을 수 있었다.

• Proceedings of the KIPE Conference
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• 2016.07a
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• pp.523-524
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• 2016

본 논문에서는 자기저항 (Magnetic Resistive, MR)각도 센서에서 자속 간섭 및 축 진동과 같은 외란에 의해 발생하는 각도맥동을 해결하는 방법이 연구되었다. 외란에 의한 각도 맥동은 일정한 기계각 속도 한 주기 내에서 전기각 속도가 불균일하게 측정되는 현상이다. 이를 해결하기 위해 위상동기루프 (phase locked loop, PLL)를 적용하였고, 자기저항 각도 센서의 각도 맥동을 효과적으로 제거하였다.

• Journal of the Korean Vacuum Society
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• v.2 no.4
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• pp.433-438
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• 1993

전자의 파동성에 기인하는 여러 가지 양자간섭 현상을 연구하기 위하여, 금속의 미세고리구조을 제작하였다. 전자의 양자간섭과 가간섭 역충돌 효과에 의한 자기저항의 진동형상이 관측되었으며, 자기저항의 비주기 섭동 현상과 비국재현상도 관찰되어 중시적 전기 전도도의 일반식에 의하여 설명되었다. 또한 AlGaAs/GaAs 의 이차원 전자가스총을 이용한 고리구조도 제작되어, 양자 효과와 탄동적 수송의 영역에서 자기저항이 측정되었다.