• Title/Summary/Keyword: 입계

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Alloy 600에서 규칙 반응과 입계응력부식균열

  • 김성수;김정수
    • Proceedings of the Korean Nuclear Society Conference
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    • 1996.05c
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    • pp.133-138
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    • 1996
  • 원자로의 중기발생기 재료로 사용되어온 Alloy 600에서의 규칙 반응에 대한 활성화 에너지 측정, aging에 따른 미세조직의 변화에 근거하여 입계 응력 부식 균열 기구를 검토하였다. Alloy 600에서는 약 50$0^{\circ}C$ 이하의 온도에서 aging 처리중 단범위 규칙 상의 존재 및 규칙 반응의 존재가 입증된 바 있다. 규칙 반응의 본성이 열적활성화 과정에 의한 것이라는 점, 규칙 반응에 대한 활성화 에너지의 크기와 입계응력부식균열의 활성화 에너지와의 유사성, 규칙 반응에 의한 쌍정의 형성, 쌍정의 형성에 기인한 결정내의 추가적 응력의 발생 등에 근거하여 Alloy 600에서 나타나는 입계응력부식균열 현상이 규칙 상의 형성과 관련되어 있음을 제안하였다.

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Analysis of Grain Boundary Phenomena in ZnO Varistor Using Dielectric Functions (유전함수를 이용한 ZnO 바리스터의 입계 특성 분석)

  • Hong, Youn-Woo;Shin, Hyo-Soon;Yeo, Dong-Hun;Kim, Jong-Hee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.178-178
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    • 2008
  • ZnO 바리스터는 인가되는 전압에 따라 저항이 변하는 전압 의존형 저항체이며 각종 전기 전자 정보통신용 제품에 정전기(ESD) 대책용 소자로 폭 넓게 사용되는 전자 세라믹스 부품이다. 특별히 Bi-based ZnO 바리스터는 다양한 상(phase)으로 구성되어 있으며 그 입계의 전기적 특성은 소량 첨가되는 dopant의 종류에 따라 다양하게 변하는 것으로 알려져 있다. 본 연구에서는 Bi-based ZnO 바리스터 (ZnO-$Bi_2O_3$, ZnO-$Bi_2O_3-Mn_3O_4$)에서 각종 유전함수$(Z^*,M^*,\varepsilon^*,Y^*,tan{\delta})$를 이용하여 입계의 주파수-온도에 대한 특성을 살펴 보았다. 일반적인 ZnO 바리스터 제조법으로 시편을 제작하여 78K~800K 온도 범위에서 각종 유전함수를 이용하여 복소 평면도(complex plane plot)와 주파수 응답도(frequency explicit plot)의 방법으로 defect level과 입계 특성(활성화 에너지, 정전용량, 저항, 입계 안정성 등)에 대하여 고찰하였다. ZnO-$Bi_2O_3$(ZB)계와 ZnO-$Bi_2O_3-Mn_3O_4$(ZBM)계 모두 상온 이하의 온도에서 $Zn_i$$V_o$의 결함이 나타났으며, 이들의 결함 준위는 각 유전함수에 따라 다소 차이가 났다. 입계 특성으로 ZB계는 이상구간(560~660K)을 전후로 1.15 eV $\rightarrow$ 1.49 eV의 활성화 에너지의 변화가 나타났지만, ZBM계는 이러한 현상이 나타나지 않았다. 또한 입계 전위 장벽의 온도 안정성에 대해서는 Cole-Cole model을 적용하여 분포 파라미터 (distribution parameter; $\alpha$)를 구하여 고찰하였다. ZB계의 입계 안정성은 온도에 따라 불안정해 졌지만, ZBM계는 안정하였다.

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Alloy 690에서 용체화처리에따른 미세조직 관찰

  • 이용복;이덕열;장진성;국일현
    • Proceedings of the Korean Nuclear Society Conference
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    • 1996.11b
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    • pp.469-474
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    • 1996
  • Alloy 690은 응력부식 균열에 대한 저항성이 요구되는 원자력 발전소 증기발생기 전열관 재료에 사용되고 있다$^{(1)}$ . 응력부식 균열에 대한 저항성은 주로 결정입계에 존재하는 크롬탄화물의 기여에 의한 것이 대부분이다. 크롬탄화 석출물의 핵생성을 알아보기 위해서 110$0^{\circ}C$에서 용체화처리를 0, 1, 3, 10분 동안 하여 관찰하였다. 용체화처리한 모든 시편에서 결정입계에 존재하는 석출물의 분포는 쌍정과 교차하면서 갑자기 변화하는 것을 관찰 할 수 있다. 이처럼 석출물이 존재하지 않는 결정입계들은 대부분 낮은 ∑ 값의 CLS으로부터 약간 벗어난 입계가 될 것이다. 결정입계에 존재하는 석출물은 기지와 Cube-Cube orientation relationship을 갖는다. 그리고 단지 하나의 결정입과 반정합을 이룬다. 기지와 반정합을 이루는 석출물은 M$_{23}$ C$_{6}$형태의 크롬 탄화물이고 격자상수는 기지의 격자상수보다 3배 크다.

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Microstructure of alumina-dispersed Ce-TZP ceramics (알루미나가 분산된 세리아 안정화 지르코니아 세라믹스의 미세구조)

  • 김민정;이종국
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.10 no.2
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    • pp.122-127
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    • 2000
  • Microstructural evolutions in ceria-stabilized zirconia (Ce-TZP) and alumina-dispersed Ce-TZP ceramics were investigated as functions of doping and annealing conditions. All of sintered specimens showed the relative density over 99 %. Sintered specimens had linear grain boundaries and normal grain shapes, but ceria-doped specimens had irregular grain shapes and nonlinear grain boundaries due to the diffusion-induced grain boundary migration during annealing at $1650^{\circ}C$ for 2 h. Mean grain boundary length of Ce-TZP with irregular grain shapes was higher than that of normal grain shapes, and was a value of 23pm at the maximum. Alumina particles dispersed in Ce-TZP inhibited the grain growth of zirconia particles. $Al_2O_3$Ce-TZP doped with ceria and annealed at $1650^{\circ}C$ for 2 h showed irregular grain shapes as well as small grain size. Added alumina particles showed the grain growth during sintering or annealing, and they changed the position from grain boundary to inside of the grains during the annealing. The specimens with normal grain shapes showed an intergranular fracture mode, whereas the specimens with irregular grain shapes showed a transgranular fracture mode during the crack propagation.

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The Effect of Grain Boundary Diffusion on the Boundary Structure and Electrical Characteristics of Semiconductive $SrTiO_3$ Ceramics (입계확산에 의한 반도성 $SrTiO_3$ 세라믹스의 입계구조 및 전기적 특성 변화)

  • 김태균;조남희
    • Journal of the Korean Ceramic Society
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    • v.34 no.1
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    • pp.23-30
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    • 1997
  • Semiconductive SrTiO3 ceramic bodies were prepared by conventional ceramic powder processes in-cluding sintering in a reducing atmosphere. Sodium or potassium ions were diffused from the surface of the sintered bodies into the inner region using thermal diffusion process at 800-120$0^{\circ}C$. The effects of such ther-mal treatments on the electrical and chemical characteristics of the grain boundaries were investigated. The presence of sodium or potassium ions at grain boundaries produces non-linear current-voltage behaviors, electrical boundary potential barriers of 0.1-0.2eV, and threshold voltages of 10-70V. The diffused ions form diffusion layers with thicknesses of 20-50nm near the grain boundaries, reducing the concentration of strontium and oxygen.

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The Fabrication of Poly-Si Solar Cells for Low Cost Power Utillity (저가 지상전력을 위한 다결정 실리콘 태양전지 제작)

  • Kim, S.S.;Lim, D.G.;Shim, K.S.;Lee, J.H.;Kim, H.W.;Yi, J.
    • Solar Energy
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    • v.17 no.4
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    • pp.3-11
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    • 1997
  • Because grain boundaries in polycrystalline silicon act as potential barriers and recombination centers for the photo-generated charge carriers, these defects degrade conversion effiency of solar cell. To reduce these effects of grain boundaries, we investigated various influencing factors such as thermal treatment, various grid pattern, selective wet etching for grain boundaries, buried contact metallization along grain boundaries, grid on metallic thin film. Pretreatment above $900^{\circ}C$ in $N_2$ atmosphere, gettering by $POCl_3$ and Al treatment for back surface field contributed to obtain a high quality poly-Si. To prevent carrier losses at the grain boundaries, we carried out surface treatment using Schimmel etchant. This etchant delineated grain boundaries of $10{\mu}m$ depth as well as surface texturing effect. A metal AI diffusion into grain boundaries on rear side reduced back surface recombination effects at grain boundaries. A combination of fine grid with finger spacing of 0.4mm and buried electrode along grain boundaries improved short circuit current density of solar cell. A ultra-thin Chromium layer of 20nm with transmittance of 80% reduced series resistance. This paper focused on the grain boundary effect for terrestrial applications of solar cells with low cost, large area, and high efficiency.

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Role of CaO in the Sintering of 12Ce-TZP Ceramics (12Ce-TZP 세라믹스의 소결에서의 CaO의 역할)

  • 박정현;문성환;박한수
    • Journal of the Korean Ceramic Society
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    • v.29 no.4
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    • pp.65-65
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    • 1992
  • Role of CaO in the sintering of 12Ce-TZP ceramics was studied. The addition of small amounts of CaO increase the densification rate of 12Ce-TZP by altering lattice defect structure and the diffusion coefficient of the rate controlling species, namely cerium and zirconium cations. CaO also inhibits grain growth during sintering and allows the sintering process to proceed to theoretical density by maintaining a high diffusion flux of vacancies from the pores to the grain boundaries. The inhibition of grain growth is accomplished by the segregation of solute at the grain boundaries, causing a decrease in the grain boundary mobility. The segregation of calcium was revealed by AES study.

Movement of graphene grain boundary and its interaction with defects during graphene growth (그래핀 결정입계의 이동 및 결함과의 상호작용)

  • Hwang, Suk-Seung;Choi, Byung-Sang
    • The Journal of the Korea institute of electronic communication sciences
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    • v.9 no.3
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    • pp.273-278
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    • 2014
  • On poly and single crystalline Cu substrates, the graphene was synthesized by chemical vapor deposition(CVD). Optical microscopic images which were not possible to show the detailed characterization of graphene growth were adjusted and analyzed using image analyzing software. As a result it was possible to show the detailed growth mechanism of graphene by utilizing the image analysis. Nucleation of graphene on Cu grain boundary and its growth behavior into Cu grain are shown. In addition, the movement of graphene grain boundary interacting with Cu grain boundary and pinholes during growth was illustrated in detail, and the cause and result are discussed as a result of those interactions.

Stucture and Intergranular Segregation of WC/WC Grain Boundaries in WC-Based Cemented Carbides (WC기 초경합금중 WC/WC界面의 구조와 입계편석)

  • Sin, Sun-Gi
    • Korean Journal of Materials Research
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    • v.10 no.9
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    • pp.612-618
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    • 2000
  • The WC/WC grain boundary structure and intergranular segregation in WC-Co and WC-VC-Co cemented carbides were investigated by high-resolution transmission electron microscopy and energy dispersive X-ray spectroscopy in order to elucidate whether contiguous boundaries were present or not at the atomic level. Some grain boundaries were separated by liquid phase, while others were contiguous at the atomic level. Cobalt was found to be segregated to WC/WC grain boundaries in WC-Co. Cobalt and vanadium were co-segregated to grain boundaries in WC-VC-Co. The segregation width in both materials was about 6 nm. These results suggest that the vanadium present in contiguous boundaries acts as an effective barrier to the migration of boundaries during sintering and annealing. This could explain the grain growth inhibiting mechanism of VC added to WC-Co.

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