• Journal of the Institute of Electronics Engineers of Korea TE
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• v.42 no.4
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• pp.1-6
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• 2005

Recently embedded passive technology which fabricate passive elements such as resistors and capacitors at the inner layer of PCB(Printed Circuit Board) is used to make high performance IT products. However, embedded capacitor has limit in full range circuit applications because of the low capacitance density. In this paper, a new embedded capacitor which has wrinkled electrodes and dielectric layer was proposed to overcome the limits. FEM(Finite Elements Method) technique was used to evaluate capacitance density of the wrinkled type embedded capacitor. Capacitance density of the wrinkled type embedded capacitor is larger than that of conventional planar type embedded capacitor by about 25.6%$\sim$39.6%. In case of thin film type embedded capacitor, proposed wrinkled structure has more enhanced effect on the capacitance density.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.178-178
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• 2009

전자제품의 고속화, 고집적화, 고성능이 요구되어짐에 따라 IC's 성능 향상을 통해 패키징 기술의 소형화를 필요로 하고 있어 소재나 칩 부품을 이용해 커패시터나 저항을 구현하여 내장시키는 임베디드 패시브 기술에 대한 연구가 많이 진행되어 지고 있다. 본 연구에서는 3D 패키징이 가능한 flexible 소재에 능, 수동 소자를 내장하기 위한 다층 flexible 기판 공정 기술에 대한 연구를 수행하였다. 기판제작을 위해 flexible 소재에 미세 형성이 가능한 폴리머 필름을 접착하였고 flexible 위에 후막 저항체 패턴을 퍼|이스트를 이용하여 형성하였다. 또한, 능동소자 내장을 위해 test chip을 제작하여 플립칩 본더를 이용해 flexible 기판에 접합한 후에 bonding film을 이용한 build up 공정을 통해 via를 형성하고 무전해 도금 공정을 거쳐 전기적인 연결을 하였다. 위의 공정을 통해 앓고 가벼울 뿐만 아니라 자유롭게 구부러지는 특성을 갖고 있는 능, 수동 소자 내장형 flexible 기판의 변형에 따른 전기적 특성을 평가하였다.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1384-1385
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• 2008

본 논문에서는 내장된 수동형 트리플렉서와 듀얼 밴드/트라이모드 RF 모듈을 PCB에 내장시켜서 북미향 CDMA용 부품으로 제작하였다. 수동형 트리플렉서는 모든 수동 소자들을 다층 PCB 기판 안에 내장시키고 그 위에 GPS용 SAW 대역통과필터를 이용하여 설계 및 제작하였다. 8개의 인덕터와 커패시터로 이루어진 수동 회로는 다이플렉서와 병렬 공진기, 임피던스 매칭 회로로 구성되어 있다. CDMA용 듀얼밴드/트라이모드 RF 모듈은 트리플렉서와 CDMA, PCS용 듀플렉서를 테스트 보드 위에 조합하여 제작하였다. 측정된 주파수 특성들은 시뮬레이션 값과 비교적 일치하였다. 트리플렉서와 듀얼 밴드/트라이모드 RF 모듈은 각기 $3{\times}4mm^2$와 ${7\times}7mm^2$의 작은 크기였다. 설계 및 제작된 소자들은 고성능과 경박단소화, 저가화 등의 이점이 있기 때문에, 북미향 CDMA용 단말기의 응용부품에 적용될 수 있을 것으로 예상된다.

• The Journal of The Korea Institute of Intelligent Transport Systems
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• v.7 no.5
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• pp.97-105
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• 2008

The micro capacitors are passive elements necessary to electronic circuits and wireless portable PAN(personal area network) and Mobile Communications device modules in the baseband circuits in combination with another passive and active devices. As capacitance is proportionally increased with dielectric constant and electrode areas, in addition, inversely decreased the thickness of the dielectric material, thus thin film capacitors are generally seen as a preferable means to achieve high performance and thin film capacitors are used in a variety of functional circuit devices. In this paper, propose dielectric material as AIN(Aluminium nitride) to make micro thin film capacitor, and this capacitor has the MIM(metal-insulator-metal) structure. AIN thin films are widespread applied because they had more excellent properties such as chemical stability, high thermal conductivity, electrical isolation and so on. In addition, AIN films show low frequency response for baseband signal ranges, I-V and C-V electrical characterization of a thin film micro capacitor. The above experimental test and estimated results demonstrate that the thin film capacitor has sufficient and efficient functional performance to be the baseband range frequency of general electronics circuit and passive device applications.

• Journal of the Korea Institute of Military Science and Technology
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• v.23 no.5
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• pp.516-522
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• 2020

In this paper, the frequency detector which detects the clock frequency of the embedded system is proposed and analyzed. The proposed frequency detector is consisted of filter and peak voltage detector. The clock signal is converted from square wave to triangular wave by the filter. The peak voltage of the triangular wave is determined according to the frequency response of filter. The peak voltage detector detects and holds the peak voltage of the signal. Moreover, the proposed clock frequency detector can detect the frequency within 1ms and it gives guarantee of real-time operation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.243-244
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• 2006

집적회로기판의 소형화 추세에 따라 커패시터, 인덕터, 저항과 같은 수동소자를 PCB기판 내부에 임베딩하는 연구가 국내외에서 활발하게 진행되고 있다. 본 논문에서는 폴리머-금속-세라믹의 3상복합체 구조를 가지는 임베디드 커패시터의 온도변화에 따른 유전불성변화에 대하여 고찰하였다. 매트릭스를 형성하는 고분자 재료로는 PMMA를 사용하였으며, 충분히 혼합된 분말을 PMMA의 유리 전이온도 보다 높은 온도에서 프레싱하여 시편을 제조하였다. 유전특성은 임피던스분석기 및 LCZ미터를 이용하여 측정하였으며, 실험결과는 혼합법칙과 Percolation 이론을 이용하여 해석하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.343-343
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• 2006

집적회로기판의 소형화 추세에 따라 커패시터, 인덕터, 저항과 같은 수동소자를 PCB 기판내부에 임베딩하는 연구가 국내외에서 활발하게 진행되고 있다. 본 논문에서는 polymer-metal-ceramic의 3상 복합체 구조를 가지는 임베디드 커패시터에서 Bimodal PZT분말에 따른 유전 특성에 대하여 고찰하였다. 매트릭스를 형성하는 고분자 재료로는 PMMA(polymethyl methacrylate)를 사용하였으며, 충분히 혼합된 분말을 고온에서 프레싱하여 시편을 제조하였다. 유전특성은 임피던스분석기 및 LCZ 미터를 이용하여 측정하였으며, 실험결과는 혼합법칙과 Percolation 이론을 이용하여 해석하였다.

• Journal of the Korean Magnetics Society
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• v.15 no.1
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• pp.30-36
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• 2005

Recently, It has been reported that the spin sprayed ferite film shows better magnetic properties at high frequeny that the ferrite by co-firing over $800^{\circ}C$ . Besides, there is no limitation to select the substrate materials because it can be processed with relatively low temperature below $100^{\circ}C$. Therefore, we fabricated film inductor as a passive device for DC-DC converter by a use of spin sprayed embedded form was completed by via hole process of pad opening. Saturation magnetization of 0.61 T and real part of permeability of 110 were obtained in Ni-Zn ferrite. In addition, inductance of 1.52 ${\mu}H$, quality factor of 24.3 at 5 MHz were measured with spiral 16 turn inductor. The rated current of inductor was 863 mA.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.48 no.2
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• pp.67-72
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• 2011

8-layer printed circuit board is designed and implemented for triple band(2.3/2.5/3.5GHz) m-WiMAX system. In order to maintain excellent RF performance, low dielectric constant material is used for implementation of the printed circuit board. Also, embedded printed circuit board which embed passive devices is manufactured to reduce total system area. As a result, total system area is cut off by 9%. Triple band m-WiMAX system is produced using embedded printed circuit board. Furthermore, internet connecting test is performed and proved successful running of the system. The developed embedded printed circuit board will provide a effective solution for system area reduction and low loss signal RF communication system.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.110-113
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• 2008

Embedded capacitor technology is one of the effective packing technologies for further miniaturization and higher performance of electric packaging system. In this paper, the embedded capacitors were simulated and fabricated in 8-layered printed circuit board employing standard PCB processes. The composites of barium titanante($BaTiO_3$) powder and epoxy resin were employed for the dielectric materials in embedded capacitors. Theoretical considerations regarding the embedded capacitors have been paid to understand the frequency dependent impedance behavior. Frequency dependent impedance of simulated and fabricated embedded capacitors was investigated. Fabricated embedded capacitors have lower self resonance frequency values than that of the simulated embedded capacitors due to the increased parasitic inductance values. Frequency dependent capacitances of fabricated embedded capacitors were well matched with those of simulated embedded capacitors from the 100MHz to 10GHz range. Quality factor of 20 was observed and simulated at 2GHz range in the 10 pF embedded capacitors. Temperature dependent capacitance of fabricated embedded capacitors was presented.