• Title/Summary/Keyword: 인쇄기법(스크린 프린팅)

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탐방-삼정기계

  • 박성권
    • 프린팅코리아
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    • v.7 no.10
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    • pp.104-107
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    • 2008
  • 골프공, 핸드폰 숫자판 등에 쓰인 무늬 등은 어떻게 만들어 진 것일까라고 한번쯤 의문을 가졌던 경험이 있을 것이다. 파거나 새긴 것이 아니고 분명인쇄를 한 것인데 어떻게 이런 데다가도 인쇄를 할 수 있나 의아했을 것이다. 이런 특수 인쇄를 패드(Pad) 인쇄 기법이라고 하는데 이 기술을 국산화하고 발달시킨데 기여한 업체가 바로 삼정기계이다. 패드 인쇄 기계 및 실크스크린 인쇄기자재 제작, 판매 전문 업체로서 곡면, 평면 사출물 및 다양한 인쇄물을 사용자 편의 위주로 설계하고 소형 자동화하는 연구로 '작지만 강한' 기업으로 만든 삼정기계를 찾아가 보았다.

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테마기획-옥외광고

  • Kim, Chi-Won
    • 프린팅코리아
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    • s.44
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    • pp.92-95
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    • 2006
  • 옥외광고는 불특정 다수를 상대로한 반복되고 빈번한 노출이 가장 큰 특징이자 장점으로 꼽힌다. 그중에서 이동용 차량 광고에 속하는 지하철 광고는 수십가지의 매체가 한 역사안에 어우러져 있어 '광고 백화점'이라 이를 만하다. 최근에는 스크린도어, 에스컬레이터 핸드레일 등 신종 광고기법들까지 속속 등장, 시장에 가세하면서 소비자들의 구매 욕구를 강하게 불러일으키고 있다.

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The present status and future aspects of the market for printed electronics (인쇄전자 산업시장의 현황과 전망)

  • Park, Jung-Yong;Park, Jae-Sue
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.2
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    • pp.263-272
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    • 2013
  • Printed electronics creates electrically functional devices by printing on variety of substrates. Printing typically uses common printing equipment or other low-cost equipment suitable for defining patterns on material, such as screen printing, flexography, gravure, offset lithography and inkjet. Compared to conventional manufacturing of microelectronics, printed electronics is characterized by simpler and more cost-effective fabrication of high and low volume products. Now there is huge effort towards printing many other more functional components, from displays to transistors to photovoltaic cells, using the full range of printing technologies - from inkjet to roll to roll analogue print techniques. The market for printed electronics will rise from $1.99 billion in 2010 to $55.10 billion in 2020. In 2030, this industry could be $300 billion - larger than the silicon semiconductor industry - from lighting to displays[8].

VCO fabrication using Microstrip Line operating at the UHF frequency band (UHF대역에서 동작하는 마이크로스트립라인을 이용한 VCO 제작)

  • Rhie, Dong Hee;Jung, Jin-Hwee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.05c
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    • pp.55-58
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    • 2001
  • In this paper, we present the results of the design and fabrication of the VCO(Voltage controlled Oscillator) using RF circuit simulator GENESYS and electromagnetic field simulator EMpower Frequency range is fabricated VCO is 850 MHz ~ 950 MHz, which is used Colpitts Circuit. the fabricated VCO is consisted of resonator, oscillator and MSL(Microstrip Line) is used in LC tuning circuit.(operated by negative feedback) MSL(Microstrip Line), Varactor(Plastic package), low noise TR(SOT-23), chip inductor(1608), chip capacitor(1005), chip resistance(1005). 1005 type is used for sample fabrication of VCO. In the fabrication process, circuit pattern is screen printed on the alumina substrates of over 99.9% purity. Center frequency of the sample VCO is 850MHz at $V_T=1.5V$, while the simulated value was 1.0GHz at $V_T=1.5V$. Variable frequency range of the sample is 860~950MHz in contrast to the 1068~1100MHz of the simulated values.

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VCO fabrication using Microstrip Line operating at the UHF frequency band (UHF대역에서 동작하는 마이크로스트립라인을 이용한 VCO 제작)

  • Rhie, Dong-Hee;Jung, Jin-Hwee
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.05c
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    • pp.153-156
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    • 2001
  • In this paper, we present the results of the design and fabrication of the VCO(Voltage controlled Oscillator) using RF circuit simulator GENESYS and electromagnetic field simulator EMpower Frequency range is fabricated VCO is 850 MHz ~ 950 MHz, which is used Colpitts Circuit. the fabricated VCO is consisted of resonator, oscillator and MSL(Microstrip Line) is used in LC tuning circuit.(operated by negative feedback) MSL(Microstrip Line), Varactor(Plastic package), low noise TR(SOT-23), chip inductor(1608), chip capacitor(1005), chip resistance(1005). 1005 type is used for sample fabrication of VCO. In the fabrication process, circuit pattern is screen printed on the alumina substrates of over 99.9% purity. Center frequency of the sample VCO is 850MHz at $V_T$=1.5V, while the simulated value was 1.0GHz at $V_T$=1.5V. Variable frequency range of the sample is 860~950MHz in contrast to the 1068~1100MHz of the simulated values.

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Effect of Post-Annealing Condition on the Peel Strength of Screen-printed Ag Film and Polyimide Substrate (후속 열처리조건이 스크린 프린팅 Ag 박막과 폴리이미드 사이의 필강도에 미치는 영향)

  • Bae, Byung-Hyun;Lee, Hyeonchul;Son, Kirak;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.2
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    • pp.69-74
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    • 2017
  • Effect of post-annealing treatment times at $200^{\circ}C$ on the peel strength of screen-printed Ag film/polyimide substrate were systematically investigated by $180^{\circ}$ peel test for thermal reliability assessment of printed interconnect. Initial peel strength around 16.7 gf/mm increased up to 29.4 gf/mm after annealing for 24hours, and then sharply decreased to 22.3, 3.6, 0.6, and 0.1 gf/mm after 48, 100, 250, and 500 hours, respectively. Ag-O-C chemical bonding as well as binder organic bridges formations seemed to be responsible for interfacial adhesion improvement after the initial annealing treatment, while excessive Cu oxide formation at Cu/Ag interface seems to be closely related to sharp decrease in peel strength for longer annealing times.

Design of a Full-Printed NFC Tag Using Silver Nano-Paste and Carbon Ink (은 나노 분말과 카본 잉크를 이용한 완전 인쇄형 NFC 태그 설계)

  • Lee, Sang-hwa;Park, Hyun-ho;Choi, Eun-ju;Yoon, Sun-hong;Hong, Ic-pyo
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.42 no.4
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    • pp.716-722
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    • 2017
  • In this paper, a fully printed NFC tag operating at 13.56 MHz was designed and fabricated using silver nano-paste and carbon ink. The proposed NFC tag has a printed coil with an inductance of $2.74{\mu}H$ on a PI film for application to an NFC tag IC with an internal capacitance of 50 pF. Screen printing technology used in this paper has advantages such as large area printing for mass production, low cost and eco-friendly process compared to conventional PCB manufacturing process. The proposed structure consists of a circular coil implemented as a single layer using silver nano-paste and carbon ink, a jumper pattern for chip mounting between the outer edge and the center of the coil, and an insulation pattern between the coil and the jumper pattern. In order to verify the performance of the proposed NFC tag, we performed the measurements of the printing line width, thickness, line resistance, adhesion and environmental reliability, and confirmed the suitability of the NFC tag based on the full-printed manufacturing method.