• Title/Summary/Keyword: 이면결함

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Evaluation of Surface Crack and Blind Crack by Induced Current Focusing Potential Drop(ICFPD) Technique (집중유도형 교류전위차법에 의한 표면결함 및 이면결함의 평가에 관한 연구)

  • Kim, Hoon
    • Journal of the Korean Society for Nondestructive Testing
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    • v.16 no.2
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    • pp.86-94
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    • 1996
  • In the life management safety evaluation of constructs base on a fracture mechanics, the size of defect is the very important parameter. ICFPD (Induced Current Focusing Potential Drop)technique has been developed for detecting and sizing of defects that exist not only on surface but also inside and interior of structural components. The principle of this technique is to induce a focusing current at an exploration region by a straight induction wire through which an alternating current (AC)flows that has constant amplitude and frequency. The potential distributed on the surface of metallic material is measured by potential pick-up pins that are settled on the probe. In this paper, this NDI technique was applied to the evaluation of surface cracks and blind cracks in plate specimens. The results of this study show that in the case of surface crack, the distribution of potential drop is varied with the inched angle of surface crack, and the potential drops in the crack region and the crack edge region are varied with the inclined angle and depth of crack. The distribution of potential drop for the blind crack is distingulished from that for the surface crack, and the potential drop in the crack region is varied with the depth of crack.

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Development of the Advanced NDI Technique Using an Alternating Current : the Evaluation of surface crack and blind surface crack and the detection of defects in a field component (교류전류를 이용한 새로운 비파괴탐상법의 개발;표면결함과 이면결함의 평가 및 실기 부재의 결함 검출)

  • Kim. H.;Lim, J.K.
    • Journal of Welding and Joining
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    • v.13 no.2
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    • pp.42-52
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    • 1995
  • In the evaluation of aging degradation on the structural materials based on the fracture mechanics, the detection and size prediction of defect are very important. Aiming at nondestructive detection and size prediction ol defect with high accuracy and resolution, therefore, an lnduced Current Focusing Potential Drop(ICFPD) technique has been developed. The principle of this technique is to induce a focusing current at an exploratory region by an induction wire flowing an alternating current(AC) that is a constant ampere and frequency. Defects are assessed with the potential drops that are measured the induced current on the surface of metallic material by the potential pick-up pins. In this study, the lCFPD technique was applied for evaluating the location and size of the surface crack and blind crack made in plate specimens, and also for detecting the defects existing in valve, a field component, that were developed by SCC etc. during the service. The results of this present study show that surface crack and blind crack are able to defect with potential drop. these cracks are distinguished with the distribution of potential drop, and the crack depths can be estimated with each normalized potential drop that are parameters estimating the depth of each type crack. In the field component, the defects estimated by experiment result correspond with those in the cutting face of the measuring point within a higher sensitivity.

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Thermal Imaging for Detection of SM45C Subsurface Defects Using Active Infrared Thermography Techniques (능동 적외선 열화상 기법에 의한 SM45C 이면결함 검출 열영상에 관한 연구)

  • Chung, Yoonjae;Ranjit, Shrestha;Kim, Wontae
    • Journal of the Korean Society for Nondestructive Testing
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    • v.35 no.3
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    • pp.193-199
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    • 2015
  • Active thermography techniques have the capability of inspecting a broad range simultaneously. By evaluating the phase difference between the defected area and the healthy area, the technique indicates the qualitative location and size of the defect. Previously, the development of the defect detection method used a variety of materials and the test specimen was done. In this study, the proposed technique of lock-in is verified with artificial specimens that have different size and depth of subsurface defects. Finally, the defect detection capability was evaluated using comparisons of the phase image and the amplitude image according to the size and depth of defects.

Measurement Uncertainty on Subsurface Defects Detection Using Active Infrared Thermographic Technique (능동 적외선열화상 기법을 이용한 이면결함 검출에서의 측정 불확도)

  • Chung, Yoonjae;Kim, Wontae;Choi, Wonjae
    • Journal of the Korean Society for Nondestructive Testing
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    • v.35 no.5
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    • pp.341-348
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    • 2015
  • Active infrared thermography methods have been known to possess good fault detection capabilities for the detection of defects in materials compared to the conventional passive thermal infrared imaging techniques. However, the reliability of the technique has been under scrutiny. This paper proposes the lock-in thermography technique for the detection and estimation of artificial subsurface defect size and depth with uncertainty measurement.

Speckle Interferometric Detection of Defects on the backside of steel plate (스페클 간섭계를 이용한 평판 이면결함의 검출 특성)

  • 김동한;장석원;장경영
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.195-198
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    • 2001
  • Backside defect of plate structure may grow due to fatigue or overload to cause critical failure during operation, so it is important to detect this kind of defect in line. For this purpose, nondestructive, non-contact and highly sensitive method is required. ESPI and Shearography are considered as useful method to satisfy these requirements. In this paper, the possibility of application of ESPI and Shearography to detect the backside defect of steel plate and to quantify the defect size was tested. For the experiment, some steel plates with defect on the backside were prepared. Experimental results for these plates showed that location and size of defect could be detected correctly by both of ESPI and Shearography.

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Variation in Flexural Fracture Behavior of Silicon Chips before and after Plastic Encapsulation (프라스틱 패키징 전과 후 실리콘 칩들의 휨 파괴 운형에 대한 변화)

  • Lee, Seong-Min
    • Journal of the Microelectronics and Packaging Society
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    • v.15 no.1
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    • pp.65-69
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    • 2008
  • This work shows that the grinding-induced scratches formed on the back surface of silicon chips can highly influence the flexural strength of the chips. Meanwhile, in a case that excellent adhesion between the back surface and the plastic package body maintains, the flexural strength of plastic-encapsulated packages is not so sensitive to the geometry of the scratch marks. This article explains why such different flexural fracture behavior between bare chips and plastic-encapsulated chips appears.

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온돌시공 핸드북

  • Korea Boiler Engineering Association
    • 보일러설비
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    • no.9 s.152
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    • pp.137-141
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    • 2006
  • 우리나라 보일러 산업은 짧은 역사에도 불구하고 가스 수요의 증가와 함께 장족으로 발전을 하여왔다. 그러나 업계의 과잉경쟁에 의한 양적인 성장 이면에는 기술개발의 한계로 인한 제품자체의 결함이나 설치ㆍ시고상의 하자, 가스배관 내 이물질 등의 문제로 인한 가스보일러 사고가 종종 발생하고 있다. 우리 온돌 시공인이 일선 현장에서 가스보일러를 직접 설치ㆍ시공하는데 조금이나마 도움이 되어 가스보일러 사고를 예방함으로써 가스안전문화를 정착시키는데 기여했으면 한다.

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Shearing Phase Lock-in Infrared Thermography for Defects Evaluation of Metallic Materials Specimen (금속재료 시편의 결함평가에 대한 전단위상 Lock-in 적외선열화상 연구)

  • Park, Jeong-Hak;Choi, Man-Yong;Kim, Won-Tae
    • Journal of the Korean Society for Nondestructive Testing
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    • v.30 no.2
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    • pp.91-97
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    • 2010
  • This paper proposes method to evaluate the location and size of the internal defects of metallic specimens by the shearing phase lock-in infrared thermography. Until now, infrared thermography test for metal specimen of STS304 and Cu-Zn were conducted to find the best test conditions. However, In unspecified situation of the form and existence of defects, there was a disadvantage to takes a long time for finding the optimal experimental conditions. The defect detection and evaluation was performed at 60 MHz signal using lock-in and shearing-phase method under limited heating conditions. By shearing-phase distribution method, Defects for the maximum, minimum and zero points were quantitatively detected at the size and location of the subsurface. As results, application of the proposed technique was verified for STS304 and Cu7-Zn3 with artificial defect and factors affected defect evaluation were searched and analyzed.