• Transactions of the Korean Society of Mechanical Engineers
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• v.9 no.2
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• pp.240-249
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• 1985

여러 가지 조건하에서 한쪽면만 이온질화 처리된 SCM4 의 평판을 모델로 하여 질화층의 기계적 성질과 잔류응력을 연구하였다. 질화층에서의 재료의 성질은 질소함량분포에 비례하여 변할 것이 라는 가정하에 외팔보의 굽힘과 온도-곡률의 관계를 구하는 이론적 모델을 정립하고 이에 따른 간접적 실험방법을 제시하였다. 질화층 표면에서의 선팽창 계수는 질화되지 않은 코어의 값에 비 해 2내지 12% 증가를 보였고 탄성계수는 50내지 700%증가를 보였다. 질화로 인한 축방향 팽창은 변형도로 약 0.002를 얻었다. 상온에서의 코어의 최대인장 잔류응력은 2내지 25Kg/mm$^{2}$이 며, 질화층표면에서 일어나는 최대압축잔류응력은 질화조건에 따라 50내지 300Kg/mm$^{2}$을 얻었다.

• Proceedings of the Korean Reliability Society Conference
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• 2002.06a
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• pp.199-204
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• 2002

본 연구에서는 저압 증기 터빈블레이드의 안전성 확보를 위하여 작용응력 및 강도의 변동성을 고려한 확률론적 해석을 수행하였다. 정상상태에서 작용응력은 이론 및 유한요소해석에 의해서 얻을 수 있으며, 최대 von-Mises 응력은 215.4MPa이다. 회전굽힘 하중하에서의 피로한도는 응력비 R= -1에서 계단식 시험법을 이용하여 구하였으며, 이의 확률론적 특성에 가장 적합한 분포는 3 모수 와이블 분포이다. 그리고 신뢰성에 미치는 다양한 인자들의 영향은 영향계수(sensitivity factor)를 이용하여 정량적으로 평가하였다.

• Proceedings of the KSME Conference
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• 2001.06a
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• pp.603-608
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• 2001

Recently, cold expansion of fastener holes is commonly used in the aerospace industry to increase the fatigue endurance of airframes. Cold expansion process is used as the retardation of crack initiation in the hole. This treatment leads to an improvement of fatigue behavior due to the compressive residual stresses developed on the hole surface. The residual stress profile depends on the cold expansion ratio. In the present paper, it is shown that residual stress is redistributed due to the application of cold expansion process for CT specimen. It is further shown that residual stress increases in proportion to cold expansion ratio. It is thought that crack growth rate increases as cold expansion ratio.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.25-30
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• 2001

The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.3
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• pp.916-923
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• 1991

본 연구에서는 표면 균열이 있는 평판의 탄소성 피로하중 상태에서 성장하는 균열 형태의 변화와, 작용하는 응력의 크기에 따른 균열 개페구 특성의 변화를 연구하 였다.또, 유효 응력 확대계수 범위, .DELTA.K$_{eff}$와 J적분범위, .DELTA.J가 탄소성 응력 상태에서의 표면 피로균열 진전속도를 나타내는 역학양으로 사용되는데 따른 적합성등 을 검토하였다.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.10 no.5
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• pp.110-117
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• 2001

In the weldments, the crack propagation rate is changed due to the residual stress. The crack propagation rate is high in the region with the residual stress. However it shows the same behavior with the base metal in the region that does not include the residual stress. The fatigue crack growth rate for the material with residual stresses can be predicted more precisely by using the effective stress ratio. The difference between experimental results and prediction results seems to be due to the redistribution of the residual stresses and microstructural change.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.6
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• pp.94-102
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• 2007

Applications of bonded dissimilar materials such as large scale integration (LSI) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in LSI. In order to investigate stress singularities on the bonded interface edges and delamination of die pad and resin in the IC package. In this paper, stress singularity factors(${\Gamma}_i$) and stress intensity factors($K_i$) considering thermal stress in the IC package were analyzed by using the 2-dimensional elastic boundary element method(BEM).

• Transactions of the Korean Society of Mechanical Engineers
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• v.13 no.4
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• pp.625-635
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• 1989

Mixed mode fracture problem is analyzed for the finite orthotropic plate where an inclined crack parallel to the fiber direction is centrally placed. Modified mapping collocation method with both uniform stress and uniform displacement boundary conditions is utilized to calculate stress intensity correction factors for glass/epoxy and graphite/epoxy composites. Computed results are presented for selected combinations of crack length to width ratio L/W and plate aspect ratio H/W with various fiber orientations.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.1
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• pp.121-126
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• 1994

A mutual integral, which has the conservation property, is applied to the problem of a crack in an isotropic elastic material. The stress intensity factors $K_{I}, K_{II}, K_{III}$ and T-stress for the problem in an infinite medium are easily obtained by using the mutual integral without solving the boundary value problem. The auxiliary solutions necessary in the proposed method are taken from the known asymptotic solutions. This method is amenable to numerical evaluation of the stress intensity factors and T-stress if the crack in a finite medium is considered.

• Journal of Korea Water Resources Association
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• v.43 no.6
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• pp.517-524
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• 2010

In this study, the 1D apparent shear stress model for vegetated compound open-channel flows was suggested. To consider the effect of momentum exchange between main channel and floodplain, the eddy viscosity concept was used in the present model. The interfacial eddy viscosity in the interface of main channel and floodplain was determined from the 3D Reynolds stress model. The evaluated interfacial eddy viscosity appears to be good agreement with those proposed previously. To investigate the effect of interfacial eddy viscosity, sensitive analysis was carried out. the computed backwater profiles are nearly identical with respect to the value of the interfacial eddy viscosity. However, the discharge conveyed by the floodplain changes is proportional to the interfacial eddy viscosity. Finally, the changes of the interfacial eddy viscosity due to the vegetation density and vegetation height were examined. The computed results of interfacial eddy viscosity are in proportion to the vegetation density and vegetation height, and the interfacial eddy viscosity has a range of $(2-5)\;{\times}\;10^{-4}$.