• Journal of the Korean institute of surface engineering
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• v.42 no.6
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• pp.251-255
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• 2009

In this study, the plasma etching of the TaN thin film with $O_2/BCl_3$/Ar gas chemistries was investigated. The equipment for the etching was an inductively coupled plasma (ICP) system. The etch rate of the TaN thin film and the selectivity of TaN to $SiO_2$ and PR was studied as a function of the process parameters, including the amount of $O_2$ added, an RF power, a DC-bias voltage and the process pressure. When the gas mixing ratio was $O_2$(3 sccm)/$BCl_3$(6 sccm)/Ar(14 sccm), with the other conditions fixed, the highest etch rate was obtained. As the RF power and the dc-bias voltage were increased, the etch rate of the TaN thin film was increased. X-ray photoelectron spectroscopy (XPS) was used to investigate the chemical states of the surface of the TaN thin film.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.12
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• pp.935-938
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• 2011

The etching characteristics of ZnO and etch selectivities of ZnO to $SiO_2$ in $SF_6$/Ar plasma were investigated using Inductively-coupled-plasma (ICP). The maximum etch rates of ZnO were 6.5 nm/min at $SF_6$(50%)/Ar(50%), Source power (700 W), Bias power (250 W), Working pressure(8 mTorr). The etch rate of ZnO showed a non-monotonic behavior with increasing from 0% to 50% Ar fraction in $SF_6$/ Ar plasma. The plasma diagnostic were characterized using Optical Emission Spectroscopy (OES) analysis measurements.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.412-412
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• 2012

갈륨비소(GaAs)는 수직공진표면방출레이저, 발광다이오드, 태양전지 등과 같은 광전소자에 널리 사용되는 물질이다. 그러나 높은 굴절률을 갖는 갈륨비소는 표면에서 30% 이상의 반사율을 갖기 때문에 광손실로 인해 소자의 성능이 저하된다. 따라서 표면 Fresnel 반사율을 낮출 수 있는 효율적인 반사방지막이 필요하다. 최근, 열적 불일치, 물질 선택, 접착력 저하의 단점을 가지고 있는 기존 다중박막을 대체하는 생체모방 서브파장 나노구조가 활발히 연구되고 있다. 이러한 구조는 공기(air)부터 갈륨비소까지 선형적인 유효굴절률 분포를 갖는 유효 단일박막과도 같기 때문에 소자 표면에서의 광손실을 줄일 수 있다. 더욱이, 자연계의 나방의 각막과 나비의 눈의 구조 형태를 모방한 반도체 생체모방 복합 눈(compound eye)은, 즉 마이크로 렌즈모양과 서브파장 나노격자구조의 복합적 형태, 표면에서 우수한 반사방지 특성을 나타낸다. 본 연구에서는, 포토리소그래피와 유도결합플라즈마 식각법을 이용하여 GaAs 기판 표면에 마이크로 렌즈 모양의 패턴을 형성한 후, 스핀코팅을 이용하여 나노 크기를 갖는 실리카 구를 도포하여 건식 식각함으로써 복합 눈 구조를 갖는 갈륨비소 반사방지막을 제작하였다. 제작된 샘플의 표면 및 식각 형상은 전자현미경(scanning electron microscope)을 사용하여 관찰하였으며, UV-vis-NIR spectrophotometer를 사용하여 반사율을 측정하였다.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.4
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• pp.203-209
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• 2000

This paper proposes the improvement of the etch rate of GaN using a magnetized inductively coupled $CH_4/H_2/Ar$plasma. The gradient magnetic field with the axial direction is investigated using Gauss-meter and the ion current density is measured using double Langmuir probe. The applied magnetic field changes the ion current density profile in the radial direction, resulting in producing the higher density in the outer region than in the center. GaN dry etching process is carried out based on the measurements of the ion current density. The each rate of 2000 /min is achieved with $CH_4/H_2/Ar$ chemistries at 800 W input power, 250W rf bias power, 10 mTorr pressure and 100 gauss magnetic field.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05b
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• pp.7-11
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• 2002

In this study, Au thin films were etched with a $Cl_2/Ar$ gas combination in an in an inductively coupled plasma. The etch properties were measured for different gas mixing ratios of $Cl_2/(Cl_2+Ar)$ while the other process conditions were fixed at rf power (700 W), dc bias voltage (150 V), and chamber pressure (15 mTorr). The highest etch rate of the Au thin film was 3500 $\AA/min$ and the selectivity of Au to $SiO_2$ was 4.38 at a $Cl_2/(Cl_2+Ar)$ gas mixing ratio of 0.2. The surface reaction of the etched Au thin films was investigated using x-ray photoelectron spectroscopy (XPS) analysis. There is Au-Cl bonding by chemical reaction between Cl and Au. During the etching of Au thin films in $Cl_2/Ar$ plasma, Au-Cl bond is formed, and these products can be removed by the physical bombardment of Ar ions. In addition, Optical emission spectroscopy (OES) were investigated to analyze radical density of Cl and Ar in plasma. The profile of etched Au investigated with scanning electron microscopy (SEM).

• The Transactions of the Korean Institute of Power Electronics
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• v.13 no.2
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• pp.103-109
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• 2008

This paper presents a new method for designing a ballast that can provide dimming control of an electrodeless fluorescent lamp. Frequency control of lamp power is inappropriate because the lamp coefficients such as equivalent impedance, coupling coefficient of the transformer, and plasma resistance are a function of lamp power. In this paper, the dimming is achieved by controlling the DC_Link voltage in relation to the lamp power. The DC_Link voltage is controlled by a buck converter. Simulation and experimental results of the proposed design method are presented in order to validate the proposed method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.10
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• pp.752-758
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• 2010

The etching characteristics of indium tin oxide (ITO) thin films in an $O_2/BCl_3/Ar$ plasma were investigated. The etch rate of ITO thin films increased with increasing $O_2$ content from 0 to 2 sccm in $BCl_3$/Ar plasma, whereas that of ITO decreased with increasing $O_2$ content from 2 sccm to 6 sccm in $BCl_3$/Ar plasma. The maximum etch rate of 65.9 nm/m in for the ITO thin films was obtained at 2 sccm $O_2$ addition. The etch conditions were the RF power of 500 W, the bias power of 200 W, the process pressure of 15 mTorr, and the substrate temperature of $40^{\circ}C$. The analysis of x-ray photo electron spectroscopy (XPS) was carried out to investigate the chemical reactions between the surfaces of ITO thin films and etch species.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.3
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• pp.156-159
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• 2018

Inductively coupled plasma (ICP) treatment with argon and a mixture of argon and oxygen gases has been used to modify the surface of polycarbonate (PC) substrates. The results showed that the surface contact angle was inversely proportional to the plasma discharge power and that the mixed-gas plasma (gas flow 10:10 sccm, discharge power 60 W) decreased the surface contact angle as low as $18.3^{\circ}$, indicating a large increase in the surface hydrophilicity. In addition, $SnO_2$ thin films deposited on the PC substrate effectively enhanced the ICP plasma treatment, and could also enhance the usefulness of PC in the inner parts of automobiles.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.56 no.3
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• pp.566-570
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• 2007

The specific electrical, optical and acoustic properties of Zinc Oxide (ZnO) are important for semiconductor process which has many various applications. Piezoelectric ZnO films has been widely used for such as transducers, bulk and surface acoustic-wave resonators, and acousto-optic devices. In this study, we investigated etch characteristics of ZnO thin films in inductively coupled plasma etch system with $BCl_3/Ar$ gas mixture. The etching characteristics of ZnO thin films were investigated in terms of etch rates and selectivities to $SiO_2$ as a function of $BCl_3/Ar$ gas mixing ratio, RF power, DC bias voltage and process pressure. The maximum ZnO etch rate of 172 nm/min was obtained for $BCl_3$ (80%)/Ar(20%) gas mixture. The chemical states on the etched surface were investigated with X-ray photoelectron spectroscopy (XPS).

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.10
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• pp.1706-1711
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• 2016

Electromagnetic wave simulation was performed to predict characteristics of manufactured cutoff probe at low temperature magnetized plasma medium. Microwave cutoff probe is designed for research the properties of magnetized inductively coupled plasma. It was shown that the cutoff probe method can safely be used for weakly magnetized high density plasma sources. Cutoff probe system with two port network analyzer has been prepared and applied to measure electron density distributions in large area, 13.56MHz driven weakly magnetized inductively coupled plasma source. The results shown that, the plasma frequency confirmed cut-off characteristics in low temperature plasma. Especially, cut-off characteristics was found at upper hybrid resonance frequency in the environment of the magnetic field. In case of a induced weak magnetic field in inductively coupled plasma, plasma density estimated from the cutoff frequency in the same way at unmagnetized plasma due to nearly same plasma frequency and upper hybrid resonance frequency. The plasma density is increased and uniformity is improved by applying a induced weak magnetic field in inductively coupled plasma.