• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.199.2-199
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• 2003

• Proceedings of the Korean Ceranic Society Conference
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• 2003.10a
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• pp.205.1-205
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• 2003

• Proceedings of the Korean Vacuum Society Conference
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• 2004.02a
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• pp.168-168
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• 2004

• Journal of the Korean Vacuum Society
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• v.22 no.1
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• pp.7-12
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• 2013

We fabricated ZnO-ZnMgO single quantum well (SQW) samples having different well-widths by using the atomic layer deposition technique. The QW samples exhibit different optical transition behaviors with different QW widths. We confirm that when the well-width of 1.5 nm does not have a confined quantum energy level due to the Mg diffusion into the well caused by after-thermal treatment whereas the QWs wider than 1.5 nm show optical transitions between the confined energy levels.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.04b
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• pp.93-96
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• 2002

원자층증착법으로 제조한 청색 CaS:Pb 박막 형광체에 대한 열처리 및 전자빔 조사 효과찰 연구하였다. CaS:Pb 형광 박박의 열처리는 500 - $700^{\circ}C$ 온도범위에서 급속 열처리 공정으로 수행하였고, 1 kV, $20{\mu}A/cm^{2}$ 조건의 전자빔을 연속적으로 조사하여 열화를 가속시킨 후 처리 전, 후의 재료 및 cathololuminescence (CL) 특성을 비교 분석하였다. 원자층증착법으로 성장한 CaS:Pb 박막은 화학적 조성과 결정성이 우수하여 후속 열처리에 의해 발광특성이 크게 증가하는 경향을 보이지 않았으며, 전자빔에 의한 열화 정도는 판매되고 있는 형광체에 비하여 오히려 적었다. CL 강도가 초기값의 50%로 감소할 때까지 전자빔을 조사한 후에도 주목할만한 결정성 및 조성의 변화는 관찰되지 않았으나 전자빔 조사에 의해 표변에 두께 10 nm 내외의 탄소오염층이 형성됨을 알 수 있었다.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.4 s.37
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• pp.345-349
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• 2005

Low resistive ($300{\mu}{\Omega}$-cm) W-C-N films have been deposited on tetraethylorthosilicate (TEOS) interlayer dielectric by atomic layer deposition (ALD) with $WF_6-N_2-CH_4$ gas. The exposure cycles of $N_2$ and $CH_4$ are synchronized with pulse plasma. The W-C-N films on TEOS layer follow the ALD mechanism and keep constant deposition rate of 0.2 nm/cycle from 10 to 100 cycles. As a diffusion barrier for Cu interconnection the W-C-N films maintain amorphous phase and Cu inter-diffusion is not occurred even at $800^{\circ}C$ for 30 min.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.82-82
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• 2015

원자층 단위의 정밀 제어가 가능한 원자층 증착법(Atomic Layer Deposition)은 반도체, 디스플레이, 에너지, MEMS 등 다양한 분야에서 점차 그 응용 범위를 확대하고 있다. 응용분야의 확대와 함께, 물질적 측면에서는 산화물 위주의 적용에서 나아가 금속층, 질화물 등 다양한 물질 개발로 이루어져 왔으며, 이는 precursor의 개발과 함께 공정적 측면에서 plasms를 이용한 plasma-enhanced atomic layer deposition (PEALD)의 개발과 함께 이루어져 왔다. 본 발표에서는 ALD 공정에서의 플라즈마의 활용에 대하여 논의하고, ALD 공정에서의 플라즈마 적용에 따른 영향을 살펴보았다.

• Journal of the Korean Vacuum Society
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• v.19 no.6
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• pp.495-500
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• 2010

In this study, $Al_2O_3$ and $TiO_2$ films was deposited on to PES (poly(ethersulfon) substrate by using atomic layer deposition as functions of deposition temperature and plasma power. The density and carbon contents of $Al_2O_3$ and $TiO_2$ films was changed by varying process conditions. High density thin films was achieved through optimizing the process conditions. Buffer layer was deposited prior to the processing of upper thin films to avoid PES surface destruction during the high power plasma process and to enhances the tortuous path for water vapor permeation for the defect decoupling effect. The water vapor transmission rate by using MOCON test was investigated to analyze the effect. Water vaper permeation properties was improved by using the inorganic multi-layer passivation layer and activation energy of the water vapor permeation was increased.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.111-115
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• 2015

To improve the efficiency of the Si solar cell, high minority carrier life time is required. Therefore, the passivation technology is important to eliminate point defects on the silicon surface, causing the loss of minority carrier recombination. PECVD or post-annealing of thermally-grown $SiO_2$ is commonly used to form the passivation layer, but a high-temperature process and low thermal stability is a critical factor of low minority carrier lifetime. In this study, atomic layer deposition was used to grow the $Al_2O_3$ passivation layer at low temperature process. $Al_2O_3$ was selected as a passivation layer which has a low surface recombination velocity because of the fixed charge density. For the high charge density, an improved minority carrier lifetime, and a low surface recombination, nitrogen was doped in the $Al_2O_3$ thin film and the improvement of passivation was studied.

• Proceedings of the Materials Research Society of Korea Conference
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• 2008.11a
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• pp.24.1-24.1
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• 2008