• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.47-53
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• 2012

Bonding strength of Sn-3.0Ag-0.5Cu solder joint due to degradation characteristic of OSP surface finish was investigated, compared with SnPb finish. The thickness variation and degradation mechanism of organic solderability preservative(OSP) coating were also analyzed with the number of reflow process. To analyze the degradation degree of solder joint strength, FR-4 PCB coated with OSP and SnPb were experienced preheat treatment as a function of reflow number from 1st to 6th pass, respectively. After 2012 chip resistors were soldered with Sn-3.0Ag-0.5Cu on the pre-heated PCB, the shear strength of solder joints was measured. The thickness of OSP increased with increase of the number of reflow pass by thermal degradation during the reflow process. It was also observed that the preservation effect of OSP decreased due to OSP degradation which led Cu pad oxidation. The mean shear strength of solder joints formed on the Cu pads finished with OSP and SnPb were 58.1 N and 62.2 N, respectively, through the pre-heating of 6 times. Although OSP was degraded with reflow process, the feasibility of its application was proven.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.19 no.1
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• pp.105-112
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• 2018

This paper proposes a method for fabricating heatable glass using the conduction characteristics of metal thin films deposited on the surface of Low-e(Low emissivity) glass. The heating value of Low-e glass depends on the Joule heat caused by Low-e glass sheet resistance. Hence, its prediction and design are possible by measuring the sheet resistance of the material. In this study, silver electrodes were placed at 50 mm intervals on a soft Low-e glass sample with a low emissivity layer of 11 nm. This study measured the sheet resistance using a 4-point probe, predicted the power consumption and heating value of the Low-e glass, and confirmed the heating performance through fabrication and experience. There are two conventional methods for manufacturing heatable glass. One is a method of inserting nichrome heating wire into normal glass, and the other is a method of depositing a conductive transparent thin film on normal glass. The method of inserting nichrome heating wire is excellent in terms of the heating performance, but it damages the transparency of the glass. The method for depositing a conductive transparent thin film is good in terms of transparency, but its practicality is low because of its complicated process. This paper proposes a method for manufacturing heatable glass with the desired heating performance using Low-e glass, which is used mainly to improve the insulation performance of a building. That is by emitting a laser beam to the conductive metal film coated on the entire surface of the Low-e glass. The proposed method is superior in terms of transparency to the conventional method of inserting nichrome heating wire, and the manufacturing process is simpler than the method of depositing a conductive transparent thin film. In addition, the heat characteristics were compared according to the patterning of the surface thin film of the Low-e glass by an emitting laser and the laser output conditions suitable for Low-e glass.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2003.04a
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• pp.35-35
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• 2003

)를 금속와이어에 인가하면 저항발열에 의해 와이어가 미세한 입자나 금속증기상태로 폭발하는 현상을 이용한 것으로 기상합성법에 속한다고 할 수 있다. 선폭법은 다른 제조법에 비해 공정이 간단하여 생산비용이 저렴하며, 원재료의 조성을 갖는 분말의 합성과 금속간화합물, 융점차이가 나는 재료의 합금화 등이 가능하다. 인가에너지의 크기와 폭발 시 분위기를 제어함으로써 분말의 평균크기와 분포 제어 또한 가능하다. 본 연구는 러시아의 우수한 기초기술을 바탕으로 Pb-Sn계 합금은 전기폭발법으로 극미세분말을 제조하였으며, 분말의 형상, 상 화학조성의 변화를 조사하였다. 본 실험에 사용된 Sn-Pb계(All-Union State Standard 1499-70, 0.53mm)합금와이어는 자동시스템(1-0.6Hz)에 의해 챔버안으로 공급되었다. 이 때 임계폭발 와이어 길이는 50-80nm으로 실험을 행하였다. 챔버 압력은 1.4~2.0atm으로 유지하였다. 제조된 분말의 특성은 XRD, XRPES, SEM등을 이용하여 분말의 형상과 상, 화학조성, 표면분석을 행하였으며 DSC, TGA, BET분석을 통하여 온도변화에 따른 금속분말의 열량변화, 질량변화, 비표면적을 측정하였다. 제조된 Sn-Pb계 분말은 모두 평균 입도 117nm~220nm의 구형형상이었다. 이때 합금분말의 조성은 51.17~63.21 at%Sn, 35.47~46.37 at%Pb로 나타났다. 와이어에 인가되는 비에너지(W/Wc)가 감소된에 EK라 표면층의 Pb함량이 증가함을 보였다. 이는 와이어 내부 저항의 감소로 인한 공정시간의 지연과 Sn, Pb의 확산계수 차이에 의한 것으로 사료된다. 열분석 결과, Sn~Pb계 화합물의 융점은 167~$169^{\circ}C$로 관찰되었으며, $10^{\circ}C$/min로 $920^{\circ}C$까지 승은 하였을 때 17.1~18 wt%의 질량증가를 보였다.TEX>계 나노복합분말이 얻어짐을 알 수 있었다. 이 때 X션 회절피크의 line broadening으로부터 복합분말의 Fe 명균 결정립 크기는 24nm로 초미세 결정럽의 분말합금이었다. 포화자화값은 볼밀처리에 따라 점점 증가하여 MA 30시간에는 20.3emu/g로 포화됨을 알 수 있었다. 또한 보자력 Hc는 MA초기단계에 350e로 매우 낮으나 30시간 후에는 Hc값이 2600e로 매우 큰 값을 나타내었다. 이것은 환원반응결과 초기에 생성된 Fe의 결정립이 비교적 크고 결정결함이 적으나 볼밀처리를 30시간까지 행하면 Fe 결정렵의 미세화 빛 strain 증가로 magnetic hardening이 일어나기 때문인 것으로 사료된다.길이가 50, 30cm인 압출재를 제조하였다. 열간압출한 후의 미세조직을 광학현미경으로 압출방향에 평행한 방향과 수직방향으로 관찰하였고, 열간 압출재 이방성을 검토하기 위하여 X선 회절분석을 실실하여 결정방위를 확인하였다. 전기 비저항 및 Seebeck 계수 측정을 위하여 각각 2$\times$2$\times$10$mm^3$ 그리고 5$\times$5$\times$10TEX>$mm^3$ 크기의 시편을 준비하였다.준비하였다.전류를 구성하는 주요 입자의 에너지 영역(75~l13keV)에서 가장 높은(0.80) 상관계수를 기록했다. 넷째, 회복기 중에 일어나는 입자들의 유입은 자기폭풍의 지속시간을 연장시키는 경향을 보이며 큰 자기폭풍일수록 현저했다. 주상에서 관측된 이러한 특성은 서브스톰 확장기 활동이 자기폭풍의 발달과 밀접한 관계가 있음을 시사한다.se that were all low in two aspects, named "the Nonsignificant group". And the issues were high risk perception in general setting and lo

• Journal of Bio-Environment Control
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• v.28 no.3
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• pp.255-264
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• 2019

In this study, we conducted the hot box tests to compare the changes in thermal insulation for the four types of multi-layer thermal screens by the used period after collecting them from the greenhouses in the field when they were replaced at the end of their usage. The main materials for these four types of multi-layer thermal screens were matt georgette, non-woven fabrics, polyethylene (PE) foam, chemical cotton, etc. These materials were differently combined for each multi-layer thermal screen. We built specimens ($70{\times}70cm$) for each of these multi-layer thermal screens and measured the temperature descending rate, heat transmission coefficient, and thermal resistance for each specimen through the hot box tests. With regard to the material combinations of multi-layer thermal screens, thermal insulation can be increased by applying a multi-layered PE foam. However, it is considered that the multi-layered PE foam significantly less contributes to heat-retaining than chemical wool that forms an air-insulating layer inside multi-layer thermal screens. For the suitable heat-retaining performance of multi-layer thermal screens, basically, materials with the function of forming an air-insulating layer such as chemical cotton should be contained in multi-layer thermal screens. The temperature descending rate, heat transmission coefficient, and thermal resistance of multi-layer thermal screens were appropriately measured through the hot box tests designed in this study. However, in this study, we took into consideration only the four kinds of multi-layer thermal screens due to difficulties in collecting used multi-layer thermal screens. This is the results obtained with relatively few examples and it is the limit of this study. In the future, more cases should be investigated and supplemented through related research.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.115-115
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• 2010

고휘도 고효율 백색 LED (lighting emitting diode)가 차세대 조명광원으로 급부상하고 있다. 백색 LED를 생산하기 위한 공정에서 MOCVD (유기금속화학증착)장비를 이용한 에피웨이퍼공정은 에피층과 기판의 격자상수 차이와 열팽창계수차이로 인하여 생성되는 에피결함의 문제로 기판과 GaN 박막층 사이에 완충작용을 해줄 수 있는 버퍼층 (Buffer layer)을 만든다. 그 위에 InGaN/GaN MQW (Multi Quantum Well)공정을 하여 고휘도 고효율 백색 LED를 구현 할 수 있다. 이 공정에서 기판의 온도가 불균일해지면 wafer 파장 균일도가 나빠지므로 백색 LED의 yield가 떨어진다. 균일한 기판 온도를 갖기 위한 조건으로 기판과 induction heater의 간격, 가스의 흐름, 기판의 회전, 유도가열코일의 디자인 등이 장비의 설계 요소이다. 본 연구에서는 유도가열방식의 유도가열히터를 이용하여 기판과 히터의 간격에 차이에 따른 기판 균일도 측정했고, 회전에 의한 기판의 온도분포와 자기장분포의 실험적 결과를 상용화 유체역학 코드인 CFD-ACE+의 모델링 결과와 비교 했다. 또한 가스의 inlet위치에 따른 기판의 온도 균일도를 측정하였다. 본 연구에서 사용된 가열원은 유도가열히터 (Viewtong, VT-180C2)를 사용했고, 가열된 흑연판 표면의 온도를 2차원적으로 평가하기 위하여 적외선 열화상 카메라 (Fluke, Ti-10)를 이용하여 온도를 측정했다. 와전류에 의한 흑연판의 가열 현상을 누출 전계의 분포로 확인하기 위하여 Tektronix사의 A6302 probe와 TM502A amplifier를 사용했다. 흑연판 위에 1 cm2 간격으로 211곳에서 유도 전류를 측정했다. 유도전류는 벡터양이므로 $E{\theta}$를 측정했으며, 이때의 측정 방향은 흑연판의 원주방향이다. 또한 자기장에 의한 유도전류의 분포를 확인하기 위하여 KANETEC사의 TM-501을 이용하여 흑연판 중심으로부터 10 mm 간격으로 자기장을 측정 했다. 저항 가열 히터를 통하여 대류에 의한 온도 균일도를 평가한 결과 gap이 3 mm일때, 평균 온도 $166.5^{\circ}C$에서 불균일도 6.5%를 얻었으며, 회전에 의한 온도 균일도 측정 결과는 2.5 RPM일 때 평균온도 $163^{\circ}C$에서 5.5%의 불균일도를 확인했다. 또한 CFD-ACE+를 이용한 모델링 결과 자기장의 분포는 중심이 높은 분포를 나타냄을 확인했고, 기판의 온도분포는 중심으로부터 55 mm되는 곳에서 300 W/m3로 가장 높은 분포를 나타냈다. 가스 inlet 위치를 흑연판 중심으로 수직, 수평 방향으로 흘려주었을 때의 불균일도는 각각 10.5%, 8.0%로 수평 방향으로 가스를 흘려주었을 때 2.5% 온도 균일도 향상을 확인했다.

• Journal of Korean Society of Forest Science
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• v.99 no.3
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• pp.277-284
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• 2010

rust fungus, Uromyces truncicola, infected stems, branches and leaves of Sophora japonica trees, and 78% of planted host depending on investigated sites. Teliospores of this fungus were reddish brown, global to oval and $29-37{\times}24-27\;{\mu}m$. The urediniospores were yellowish brown, elliptical to oval with spiny surface and $28-39{\times}19-22\;{\mu}m$. In the infected branches cork layers were thickened, ray parenchymatous cells were distorted, branched or combined and increased in numbers. While ray parenchymatous cells in healthy branches were one or two layers, the cells in the infected branches were three or more layers to shape fusiform. In the infected branches xylem tissues also distorted and yellowish pigments formed in the intercellular space. In the less infected trees the hairs on the branches were dense and long, and the thickness of upper epidermal cell walls were ca 23.3 ${\mu}m$, while in the highly infected trees the hairs were less dense and short, and the thickness of upper epidermal cell walls was ca 17.4 ${\mu}m$. We think individual host trees resistant to this fungus are present.

• Korean Journal of Materials Research
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• v.2 no.1
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• pp.35-42
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• 1992

Thermal behavior of residue and damaged layer formed by reactive ion etching (RIE) in $CHF_3/C_2F_6$ were investigated using X-ray photoelectron spectroscopy(XPS) and secondary ion mass spec-trometry(SIMS) techniques. Decomposition of polymer residue film begins at $200^{\circ}C$ and above $400^{\circ}C$ carbon compound as graphite mainly forms by in-situ resistive heating. It reveals that thermal decomposition of residue can be completed by rapid thermal anneal treatment above $800^{\circ}C$ under nitrogen atmosphere and out-diffusion of carbon and fluorine of damaged layer is observed.

• Journal of the Korean Institute of Telematics and Electronics T
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• v.35T no.1
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• pp.7-13
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• 1998

The VLSI devices of submicron level trend to have a lowering of reliability because of hot carriers by two dimensional influences which are caused by short channel effects and which are not generated in a long channel devices. In order to minimize the two dimensional influences, much research has been made into various types of source/drain structures. MOS typed tunnel transistor with Schottky barrier junctions at source/drain, which has the advantages in fabrication process, downsizing and response speed, has been proposed. The experimental device was fabricated with p type silicon, and manifested the transistor action, showing the unsaturated output characteristics and the high transconductance comparing with that in field effect mode. The results of trial indicate for better performance as follows; high doped channel layer to lower the driving voltage, high resistivity substrate to reduce the leakage current from the substrate to drain.

• Fire Science and Engineering
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• v.32 no.3
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• pp.27-34
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• 2018

A Semi-Incombustible Composite Insulation Board (SICIB) that can be applied to building construction and ships was developed. The SICIBs comprised of pine leaf powder, vermiculite. The incombustibility, semi-incombustibility, and U-factor of the developed SICIBs were measured. The incombustibility of the each SICIB was determined by the proportion of combustible flexible binder and pine leaf powder. SICIB satisfied the incombustibility test without a combustible flexible binder and pine leaf powder. In addition, SICIB with 6% of pine leaf ensured its semi-incombustible performance. A combustible flexible binder or pine leaf powder over 6% failed the fire-resistant performance of SICIB. In addition, SICIBs with incombustible/semi-incombustible finishing and a 200 mm insulating layer (glass wool and sprayed poly urethane foam) met the U-factor of an external wall for buildings described in the Korean building code.

• Journal of Digital Convergence
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• v.17 no.3
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• pp.205-213
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• 2019

In a construction site, excavation work has a close relation with temporary earth retaining structure. In order to build the underground structure most effectively in a narrow space, prevent soil relaxation of the external behind ground in excavation work, and maintain a ground water level, it is required to install a temporary earth retaining structure that secures safety. To prevent soil washoff in underground excavation work, the conventional method of temporary earth retaining structure is to make a temporary wall and build the internal support with the use of earth anchor, raker, and struct for excavation work. RSB method that improves the problem of the conventional method is to remove the internal support, make use of two-row soldier piles and bracing, and thereby to resist earth pressure independently for underground excavation. This study revealed that through the field application cases of RSB method and the measurement result, the applicability of the method for installing a temporary earth retaining structure, the assessment result, and displacement all met allowable values of measurement, and that the RSB method, compared to the conventional method, improved constructability and economy.