• Clean Technology
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• v.23 no.4
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• pp.413-420
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• 2017

The batch experiments and response surface methodology (RSM) have been applied to the investigation of the Cs adsorption with zeolite X synthesized using coal fly ash generated from the thermal power plant. Regression equation formulated for Cs adsorption was represented as a function of response variables. The model was highly relevant because the decision coefficient ($r^2$) was 0.9630. It was confirmed from the statistical results that the removal efficiency of Cs was affected by the order of experimental factors as pH > Cs concentration > temperature. The adsorption kinetics were more accurately represented by a pseudo second-order model. The maximum adsorption capacity calculated from the Langmuir isotherm model was $151.52mg\;g^{-1}$ at 293 K. Also, according to the thermodynamic parameters calculated from Vant Hoff equation, it could be confirmed that the adsorption reaction was an endothermic reaction and a spontaneous process.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.152-152
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• 1999

1Gb급 이상 기억소자의 캐패시터 재료로 주목받고 있는 (Ba,Sr)TiO3 [BST] 박막의 전극재료로는 Pt, Ru, Ir과 같은 금속전극과 RuO2, IrO2와 산화물 전도체가 유망한 것으로 알려져 있다. 그런데, DRAM의 집적도가 증가하게 되면, BST같은 고유전율 박막을 유전재료로 사용한다 하더라도, 3차원적인 구조가 불가피하게 때문에 기존의 sputtering 방법으로는 우수한 단차피복성을 얻기 힘들므로, MOCVD법이 필수적이다. 본 연구에서는 기존에 연구되었던 Pt에 비해 식각특성이 우수하고, 비교적 낮은 비저항을 갖는 Ru 박막증착에 대한 연구를 행하였다. 본 연구에서는 수직형의 반응기와 저항 가열 방식의 susceptor로 구성된 저압 유기금속 화학증착기를 사용하여 최대 6inch 직경을 갖는 기판 위에 Ru박막을 증착하였다. Precursor로는 기존에 연구된 적이 없는 bis-(ethyo-$\pi$-cyclopentadienyl)Ru (Ru(C5H4C2H5)2, [Ru(EtCp)2])를 사용하였으며, bubbler의 온도는 85$^{\circ}C$로 하였다. Si, SiO2/Si를 사용하였으며, 증착온도 25$0^{\circ}C$~40$0^{\circ}C$, 증착압력 3Torr의 조건에서 Ru 박막을 증착하였다. Presursor를 운반하는 수송기체로는 Ar을 사용하였으며, carbon과 같은 불순물의 제거를 위해 O2를 첨가하였다. 증착된 박막은 XRD, SEM, 4-point probe등을 통해 구조적, 전기적 특성을 평가하였으며, 열역학 계산을 위해서는 SOLGASMIX-PV프로그램을 사용하였다. Ru 박막의 증착에 있어서 산소의 첨가는 필수적이었으며, Ru 박막의 증착속도는 30$0^{\circ}C$~40$0^{\circ}C$의 온도 영역에서 200$\AA$/min으로 일정하였으며, 첨가된 산소의 양이 적을수록 더 치밀하고 평탄한 표면형상을 보였으며, 또한 더 낮은 전기 전도도를 보였다. 그리고 증착된 박막은 12~15$\mu$$\Omega$cm 정도의 낮은 비저항 값을 나타냈으며 이것은 기존의 sputtering 법에 의해 증착된 Ru 박막의 비저항 값들과 비교될만하다. 한편, 높은 온도, 높은 산소분압 조건에서 RuO2의 형성을 관찰하였으며, 이것은 열역학적인 계산을 통해서 잘 설명할 수 있었다.

• Tunnel and Underground Space
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• v.30 no.4
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• pp.306-319
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• 2020

Characterizations of Excavation Damage Zone (EDZ), which is hydro-mechanical degrading the host rock, are the important issues on the geological repository for the spent nuclear fuel. In the DECOVALEX 2019 project, Task G aimed to model the fractured rock numerically, describe the hydro-mechanical behavior of EDZ, and predict the change of the hydraulic factor during the lifetime of the geological repository. Task G prepared two-dimensional fractured rock model to compare the characteristics of each simulation tools in Work Package 1, validated the extended three-dimensional model using the TAS04 in-situ interference tests from Äspö Hard Rock Laboratory in Work Package 2, and applied the thermal and glacial loads to monitor the long-term hydro-mechanical response on the fractured rock in Work Package 3. Each modelling team adopted both Finite Element Method (FEM) and Discrete Element Method (DEM) to simulate the hydro-mechanical behavior of the fracture rock, and added the various approaches to describe the EDZ and fracture geometry which are appropriate to each simulation method. Therefore, this research can introduce a variety of numerical approaches and considerations to model the geological repository for the spent nuclear fuel in the crystalline fractured rock.

• Journal of the Korean Chemical Society
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• v.55 no.3
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• pp.364-372
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• 2011

The corrosion inhibition of imatinib mesylate (IMT) on mild steel in 0.25 M sulphuric acid has been studied using gravimetric and potentiodynamic polarization techniques at various concentrations of inhibitor, temperature and fluid velocities. The results obtained showed that, inhibition efficiency (% IE) increases with increasing concentration of the inhibitor. The adsorption process on mild steel surface follows Langmuir adsorption isotherm. The values of Gibbs free energies of adsorption obtained suggest that, the adsorption process of IMT on mild steel is chemisorption. Thermodynamic parameters were evaluated and discussed. The electron orbital density distribution of HOMO and LUMO of IMT was used to discuss the inhibition mechanism. FT-IR spectroscopy and SEM images were used to analyze the surface adsorbed film.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.3
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• pp.387-387
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• 1998

This paper reports on a thermodynamic analysis for the GaN thick film growth by vapor phaseepitaxy method. The thermodynamic calculation was performed using a chemical stoichiometric algorism. Thesimulation variables include the growth temperature in a range 400~1500 K, the gas ratios $(GaCl_3)/(GaCl_3+NH_3)$and $(N_2)/(GaCl_3+NH_3)$. The theoretical calculation predicts that the growth temperature of GaN be in thelower range of 450~750 K than the experimental results. The difference in the growth temperature betweenthe simulation and the experiments indicates that the vapor phase epitaxy of GaN is kinetically limited,presumably, due to the high activation energy of thin film growth.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.3
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• pp.388-395
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• 1998

This paper reports on a thermodynamic analysis for the GaN thick film growth by vapor phase epitaxy method. The thermodynamic calculation was performed using a chemical stoichiometric algorism. The simulation variables include the growth temperature in a range 400~1500 K, the gas ratios $(GaCl_3)/(GaCl_3+NH_3)$ and $(N_2)/(GaCl_3+NH_3)$. The theoretical calculation predicts that the growth temperature of GaN be in the lower range of 450~750 K than the experimental results. The difference in the growth temperature between the simulation and the experiments indicates that the vapor phase epitaxy of GaN is kinetically limited, presumably, due to the high activation energy of thin film growth.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2158-2166
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• 1994

In order to understand the package crack emanating from the edge of leadframe after the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the M-integral and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the package crack are investigated taking into account the temperature dependence of the material properties, which simulates a more realistic condition. If the temperature dependence of the material properties is considered the result of analysis conforms with observations that the crack is kinked at between 50 and 65 degree. However, in case of constant material properties at the room temperature it is found that the J-integral is underestimated and the kink crack angle is different form the observation. The effects of the material properties and molding process temperature on J-integral and crack angle are less significant that the chip size for the cases considered here. It is suggested that the geometric factors such as ship size, leadframe size are to be well designed in order to prevent(or control) the occurrence and propagation of the package crack.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.8
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• pp.2139-2157
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• 1994

In order to understand the delamination between leadframe and epoxy molding compound in an electronic packaging of surface mounting type, the stress intensity factor, T-stress and J-integral in fracture mechanics are obtained. The effects of geometry, material properties and molding process temperature on the delamination are investigated taking into account the temperature dependence of the material properties, which simulates as more realistic condition. As the crack length increases the J-integral increases, which suggest that the crack propagates if it starts growing from the small size. The effects of the material properties and molding process temperature on stress intensity factor, T-stress is and J-integral are less significant than the chip size for the practical cases considered here. The T-stress is negative in all eases, which is in agreement with observation that interfacial crack is not kinked until the crack approaches the edge of the leadframe.

• Journal of computational fluids engineering
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• v.12 no.2
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• pp.8-13
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• 2007

A general purpose program NUFLEX for the analysis 3-D thermo/fluid flow and pre/post processor in complex geometry has been developed, which consists of a flow solver based on FVM and GUI based pre/post processor. The solver employs a general non-orthogonal grid system with structured grid and solves laminar and turbulent flows with standard/RNG $k-{\varepsilon}$ turbulence model. In addition, NUFLEX is incorporated with various physical models, such as interfacial tracking, cavitation, MHD, melting/solidification and spray models. For the purpose of evaluation of the program and testing the applicability, many actual problems are solved and compared with the available data. Comparison of the results with that by STAR-CD or FLUENT program has been also made for the same flow configuration and grid structure to test the validity of NUFLEX.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.55-58
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• 2002

Parallel finite element code has been recently developed for the analysis of the incompressible Wavier-Stokes equations using domain decomposition method. Metis and MPI libraries are used for the domain partitioning of an unstructured mesh and the data communication between sub-domains, respectively. For unsteady computation of the incompressible Navier-Stokes equations, 4-step splitting method is combined with P1P1 finite element formulation. Smagorinsky and dynamic model are implemented for the simulation of turbulent flows. For the validation performance-estimation of the developed parallel code, three-dimensional Laplace equation has been solved. It has been found that the speed-up of 40 has been obtained from the present parallel code fir the bench mark problem. Lastly, the turbulent flows around the MIRA model and Tiburon model have been solved using 32 processors on IBM SMP cluster and unstructured mesh. The computed drag coefficient agrees better with the existing experiment as the mesh resolution of the region increases, where the variation of pressure is severe.