• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.260-260
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• 2004

연삭 가공은 대직경 반도체 웨이퍼의 경면 가공, 산업용 정밀 부품, 광학 분야의 고정밀급 렌즈 등 여러 산업 분야의 각종 정밀 부품의 마무리 공정에 적총되어 제품의 질을 좌우하는 필수적인 공정이라 할 수 있다. 이러한 연삭 가공은 높은 치수 정밀도와 양호한 표면 거칠기 및 제품의 형상을 동시에 만족시킬 수 있는 가공 기술로서 , 대직경 웨이퍼 생산에 있어서, 고정밀ㆍ고품위의 웨이퍼를 양산하는데 적합한 기술로 인식되고 있다.(중략)

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.2
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• pp.165-170
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• 2012

The resin bonded diamond wheel is used to grind the difficult-to-cut materials. Traditionally, the resin bonded diamond wheel is manufactured without any pores due to the characteristics of resin bond. In this study, two porous resin bonded diamond wheel were made and the grinding characteristics were compared with traditional nonporous ones. The experimental results indicate that the porous resin bond diamond wheel require less grinding forces and powers.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.04a
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• pp.900-904
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• 1997

A problem in the grinding process using the machining center(MC) with a small diametric wheel is the machining error due to due to decrease of quill diameter. In this paper, a side-cut grinding is performed with a vitrified bonded CBN wheel by the MC, and the relation between grinding force and machining error for grinding conditions is investigated experimentally. It is show that the normal force has a significant effect on the machining error.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.33-37
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• 1995

A side-cut grinding generates a machining error by the decrease of the quill rigidity. In this paper, The effect on the grinding force, machining error and surface roughness due to the change of the quill rigidity is investigated experimentally. The slenderness ratio of the quill is a significant factor to analyse the change of the grinding force and machining error.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1995.10a
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• pp.38-42
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• 1995

In this paper, a theoretical analysis is presented on the mechanics for the side-cut grinding by electrodeposited CBN wheel of a hemispheric type. Each of the grinding force components is calculated by using the geometrical model. It is also presented that experimental results show grinding forces for grinding variable such as wheel speed, feed speed,depth of cut, and grinding wheel positions. The experimental results are found to be in good agreement with those predicted by the analytcal calculation.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.3
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• pp.98-103
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• 2012

One of the problems in the grinding process using the machining center(MC) with a small diametric wheels is machining error due to decrease of the quill diameter. In this thesis, side-cut grinding is performed with a vitrified bonded CBN wheel on the machining center to establish the basis of the grinding using MC. The grinding force and machining error are investigated experimentally for the change of the machining condition. It is possible to estimate the machining performance by the ratio of the setting depth of cut and actual depth of cut. In addition, the relation between normal grinding force and machining error is presented by the experimental formula.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.5
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• pp.36-41
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• 2013

One of the problems in grinding process using a machining center(MC) with a small diametric wheels is machining error due to decrease of the quill diameter. In this study, side-cut grinding is performed with a vitrified bonded CBN wheel on the machining center. Grinding experiments are performed at various grinding conditions including quill length, quill diameter and depth of cut. The effect on the grinding force, machining error and surface roughness due to the change of the quill rigidity are investigated experimentally. The slenderness ratio of the quill is significant factor to analyse the change of the grinding force and machining error.

• Journal of the Korean Society for Precision Engineering
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• v.15 no.6
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• pp.153-158
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• 1998

In this paper, a theoretical analysis is presented on the mechanics of the grinding by hemispheric type electroplated CBN wheel. The grinding forces acting on a single grain were calculated from its geometry by assuming the abrasive grain is spherical. Then. the total grinding forces were obtained by estimating the number of acting abrasive grains and the area of contact. The model includes the grinding variables such as wheel speed. feed speed. depth of cut, and grinding wheel positions. Experiments were also carried out to compare with the analytical results. The experimental results were found to be in good agreement with the analytical ones.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.870-874
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• 1997

Super-abrasives such as diamond and CBN have used to maintain accuracy and form deviation for superalloy etc. This study contains the dry cylindrical grinding of metals with resinoid-bond CBN wheel. For various conditions of grinding speed, workpiece speed, grinding depth and feed speed of table, the grinding resistance and the surface roughness are measured and discussed. The results are as follows.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.3
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• pp.105-110
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• 2020

Alumina, a typical ceramic material used for semiconductors and display parts, is the subject of research and development efforts for mineral material processing. Alumina is extremely difficult to process since it is brittleness to either fine ceramics material. We have studied the shape of diamond particles and their use in machinability for alumina processing. Our study was carried out under various processing conditions, including cutting speed, table speed, and the surface roughness of the work piece. We also analyzed the wear characteristics of the tool by total cutting.