• Title/Summary/Keyword: 연마 입자

Search Result 196, Processing Time 0.025 seconds

Standardization of Polishing Work by MAGIC Polishing Tool (MAGIC 숫돌에 의한 연마작업의 표준화)

  • Cho, Jong-Rae;Lee, Sang-Tea;Jung, Yoon-Gyo
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.22 no.10 s.175
    • /
    • pp.39-48
    • /
    • 2005
  • As the industrial development is accelerated, a new machining process and system are keenly required to achieve super precision surface finish. Especially to get ground surface finish fer complicated and narrow inner shape of molds, it is impossible with the existing methods so that a new method is being required to be developed. A new material, called Magic(MAGnetic Intelligent Compounds), is finally made and it is called Magic machining that uses this material. There is a way to make a material as follows, the mixture of magnetic particles, bonding material and particles of abrasive grain should be melt down by proper heat, and then this mixture put in a mold and cool down in magnetic field which has a uniform direction. This new polishing method is spotlighted as an excellent solution to the existing problems. However it hasn't reported any study about the influence of the machining conditions of polishing velocity, amplitude and polishing pressure to the surface roughness yet. This study would examine closely the influence of polishing conditions of the Magic polishing tool to the surface finish to decide the optimum polishing condition and to standardize the Magic polishing work.

A Study on Polishing of Grooved Surface by the Second-Generation Magnetic Abrasive Polishing (2 세대 자기연마를 이용한 미세 그루브형상 표면가공에 관한 연구)

  • Kim, Sang-Oh;Lee, Sung-Ho;Kawk, Jae-Seob
    • Transactions of the Korean Society of Mechanical Engineers A
    • /
    • v.35 no.12
    • /
    • pp.1641-1646
    • /
    • 2011
  • The second-generation magnetic abrasive polishing is one of the nontraditional machining technologies newly developed. Because of the flexibility effect in magnetic abrasive polishing, the precise and mirror like surface can be obtained during this process. In this study, magnetic abrasive polishing process was applied in small grooved surface. As a result, it was seen that the flexible magnetic abrasive tool was effective to remove burrs on the edge of the groove. However, the efficiency of magnetic abrasive polishing at the slot was very low according to increasing depth and width of slot. So, correlation between geometric parameters, such as the depth and width, and surface roughness was evaluated and the minimum width for suitable polishing was found by experimental results.

Variation of abrasive feed rate with abrasive injection waterjet system process parameters (연마재 투입형 워터젯 시스템의 공정 변수에 따른 연마재 투입량 변화)

  • Joo, Gun-Wook;Oh, Tae-Min;Kim, Hak-Sung;Cho, Gye-Chun
    • Journal of Korean Tunnelling and Underground Space Association
    • /
    • v.17 no.2
    • /
    • pp.141-151
    • /
    • 2015
  • A new rock excavation method using an abrasive injection waterjet system has been developed to enhance the efficiency and reduce the vibration of tunnel excavation. The abrasive feed rate is an important factor for the cutting performance and the economical efficiency of waterjet-based excavation. In this study, various experiments were performed to explore the effects of major process parameters for both the abrasive feed rate and the suction pressure occurring inside the mixing chamber when the abrasives are inhaled. Experimental results reveal that the abrasive feed rate is affected by geometry parameters (abrasive pipe height, length, and tortuosity), abrasive parameters (abrasive particle size), and jet energy parameters (water pressure and water flow rate). In addition, the relation between the cutting performance and the abrasive feed rate was discussed on the basis of the results of an experimental study. The cutting performance can be maximized when the abrasive feed rate is controlled appropriately via careful management of major process parameters.

Sludge 연마입자를 이용한 STS304 파이프 내면의 자기연마

  • 김희남;윤여권;이병우;유숙철;김상백;최희성
    • Proceedings of the Korean Institute of Industrial Safety Conference
    • /
    • 2003.10a
    • /
    • pp.270-279
    • /
    • 2003
  • 현대산업의 고도화 추세에 따라 반도체를 비롯한 의료 및 식품위생기기 산업분야에 사용되는 부품의 고정도가 요구되면서 기존에 공구와 가공물이 직접 접촉하면서 절삭하는 가공방법으로는 절삭력에 의한 변형과 마찰열 등으로 인하여 고정도 가공의 실현에 어려움이 생기게 되었다. 그리고 의료 및 식품기기에 사용될 부품의 내면을 기존의 기계적 가공방법으로 가공할 경우 공작물 표면에 미소한 가공흔적이 남게되어 표면의 요철부분에 칩(chip)등의 불순물이 잔재할 우려가 있으며, 또한 요철 부분에 미생물이 번식할 경우 청정도가 떨어져 산업위생상의 문제점이 발생하게된다.(중략)

  • PDF

Characterization of ultra Precision Grinding Plate for GMR Head Manufacturing by Measuring Frictional Force (마찰력 측정을 통한 GMR 헤드 제작용 초정밀 연마판의 특성화)

  • 노병국;김기대
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.20 no.7
    • /
    • pp.78-83
    • /
    • 2003
  • Characterization of an ultra precision grinding plate for GMR head manufacturing is performed by measuring frictional forces between the grinding plate and the advanced ceramic Two kinds of methods of producing the precision grinding plates are presented: texturing and micro-channeling. Texturing is effective in terms of production time but micro-channeling excels in quality control. It is found that the frictional coefficient of a precision grinding plate decreases as the impregnation of diamond grain onto the precision-grinding plate progresses, and remains unchanged once the impregnation process is successfully completed, even after 100 revolutions of the precision-grinding plate against the advanced ceramic under 40 N of normal force. Therefore, the measurement of the frictional coefficient can replace costly and time-consuming process of estimating the level of impregnation of diamond grain on the precision-grinding plate, which has been performed by using scanning electron microscope, and be employed as an index to determine the level of impregnation of diamond grain.

Magnetic Abrasive Polishing Technology with Ceramic Particles (세라믹 입자를 이용한 자기연마가공 기술 사례)

  • Kwak, Tae-Soo;Kwak, Jae-Seob
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.30 no.12
    • /
    • pp.1253-1258
    • /
    • 2013
  • Ceramic particles as polishing abrasives are often used in a magnetic abrasive polishing process because they have strong wear resistance. Non-ferromagnetic ceramic abrasives should be mixed with ferromagnetic iron particles for controlling the mixture within a magnetic brush during the polishing process. This study describes the application of the ceramic particles for the magnetic abrasive polishing. The distribution of the magnetic abrasives attached on a tool varies with magnetic flux density and tool rotational speed. From the correlation between abrasive adhesion ratio in the tool and surface roughness produced on a workpiece, practical polishing conditions can be determined. A step-over for polishing a large sized workpiece is able to be selected by a S curve, and an ultrasonic vibration assisted MAP produces a better surface roughness and increases a polishing efficiency.

A study on the surface treatment of titanium alloy by micro abrasive blaster (마이크로 연마입자 분사를 이용한 티타늄합금의 표면처리에 관한 연구)

  • Kim, Seong-Won;Wang, Duck-Hyun;Kim, Wonil
    • Journal of the Korean Society of Manufacturing Process Engineers
    • /
    • v.8 no.4
    • /
    • pp.20-27
    • /
    • 2009
  • The characteristics of titanium alloy as a relatively advanced material is low density, avirulent and, superior corrosive resistant, therefore the use of titanium alloy is increasing lately in aerospace and mechanical technologies, precision machinery, electronics industry, petro-chemical industries and biomedical areas. In these days, the titanium alloy product is required various surface qualities of not only smooth surface but also rough surface depending on usages. The purpose of this experimental research is to find the optimum surface roughness of titanium alloy of Ti-6Al-4V, by micro abrasive blasting as depending variable conditions of working pressure, nozzle size, working time, stand of distance and power particle size.

  • PDF

Effects of Abrasive Size and Impact Angle on the Contact Stress in Abrasive Machining Process (입자연마가공에서의 입자크기 및 충돌각의 영향에 대한 고찰)

  • Kwak, Haslomi;Kim, Wook-Bae;Sung, In-Ha
    • Tribology and Lubricants
    • /
    • v.27 no.1
    • /
    • pp.34-39
    • /
    • 2011
  • In this study, finite element analysis of particle-surface collision using 2-dimensional elements was performed to observe the effects of abrasive size and impact angle. The result of the simulation on the change in abrasive size revealed that larger abrasive particle induced larger contact stress due to force transfer through slurry fluid as the particle moved and pushed the fluid. This observation brought an important finding that the slurry fluid could make the workpiece surface soften and then change the mechanical properties of the surface layer such as elastic modulus and yield strength. As for the impact angle, it was found that the contact stress increased with the angle of impact and jumped up at a specific angle. Such result would be attributed to the complex effects of the impact velocity and angle.

Evaluation on Tungsten CMP Characteristic using Fixed Abrasive Pad with Alumina (알루미나 고정입자패드를 이용한 텅스텐 CMP 특성 평가)

  • 박범영;김호윤;김형재;서헌덕;정해도
    • Proceedings of the Korean Society of Precision Engineering Conference
    • /
    • 2002.10a
    • /
    • pp.206-209
    • /
    • 2002
  • The fixed abrasive pad(FAP) has been introduced in chemical mechanical polishing(CMP) field recently. In comparison with the general CMP which uses the slurry including abrasives, FAP takes advantage of planarity. resulting from decreasing pattern selectivity and defects such as dishing due to the reduction of abrasive concentration especially. This paper introduces the manufacturing technique of $Al_2$O$_3$-FAP using hydrophilic polymers with swelling characteristic in water and explains the self.texturing phenomenon. It also focuses on the chemical effects on tungsten film and the FAP is evaluated on the removal rate as a function of chemicals such as oxidizer, catalyst, and acid. The removal rate is achieved up to 1000A1min as about 70 percents of the general one. In the future. the research has a plan of the advanced FAP and chemicals in tungsten CMP considering micro-scratch, life-time, and within wafer non-uniformity.

  • PDF